Patents by Inventor Yasuhiro Ichihara
Yasuhiro Ichihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7733666Abstract: A circuit board storage bag and a storage rack are disclosed. A plurality of printed circuit board storage bags for accommodating a circuit board comprise a front surface portion and a rear surface portion opposed to the obverse and reverse surfaces, respectively, of the circuit board accommodated in the circuit board storage bag and connecting portions for connecting the front surface portion and the rear surface portion. The front surface portion and the rear surface portion bend at the connecting portions to open and close the circuit board storage bag for use in transporting the circuit board. The circuit boards are stored in a storage rack having an inclined mounting surface for mounting the storage bags and a bag stopper at the lower end of the mounting surface. The bags are stored in vertical position on one side at the lower end of the mounting surface.Type: GrantFiled: August 31, 2005Date of Patent: June 8, 2010Assignee: Fujitsu LimitedInventors: Yasuhiro Ichihara, Shozo Suzuki, Shoichi Hayashi
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Publication number: 20070007976Abstract: A circuit board storage bag and a storage rack are disclosed. The stock in process, of the printed circuit boards between processes, is reduced while at the same time saving the space otherwise required for the stock, and the inward and outward delivery of the printed circuit boards are facilitated. A plurality of printed circuit board storage bags (1) each for accommodating a circuit board (90) each comprise a front surface portion (11) and a rear surface portion (12) opposed to the obverse and reverse surfaces, respectively, of the circuit board (90) accommodated in the circuit board storage bag (1) in closed state and connecting portions (13 to 15) for connecting the front surface portion (11) and the rear surface portion (12). The front surface portion (11) and the rear surface portion (12) connected to each other are adapted to bend at the connecting portions (13 to 15) thereby to open and close the circuit board storage bag (1) for use in transporting the circuit board (90) between processes.Type: ApplicationFiled: August 31, 2005Publication date: January 11, 2007Inventors: Yasuhiro Ichihara, Shozo Suzuki, Shoichi Hayashi
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Patent number: 7004646Abstract: A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.Type: GrantFiled: October 21, 2003Date of Patent: February 28, 2006Assignee: Fujitsu LimitedInventors: Yasuhiro Ichihara, Yasuhide Kuroda
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Patent number: 6749347Abstract: A laser diode module including a laser diode assembly having a laser diode and a holder, a lens-fiber assembly having a lens and an optical fiber fixed in a given positional relationship, and a sleeve. The lens-fiber assembly includes a casing having a first hole and a second hole offset from the first hole. The lens is inserted and fixed in the first hole, and a ferrule in which the optical fiber is embedded is press-fitted with the second hole. The ferrule has a slant polished first end and a second end projecting from an end surface of the casing by a given distance. The lens and the ferrule are fixed in the casing so that a given distance is defined between the lens and the first end of the ferrule.Type: GrantFiled: November 17, 2000Date of Patent: June 15, 2004Assignee: Fujitsu LimitedInventors: Yasuhiro Ichihara, Takashi Shiotani, Toshiya Kishida
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Publication number: 20040081468Abstract: A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.Type: ApplicationFiled: October 21, 2003Publication date: April 29, 2004Applicant: FUJITSU LIMITEDInventors: Yasuhiro Ichihara, Yasuhide Kuroda
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Patent number: 6727718Abstract: A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.Type: GrantFiled: November 19, 2002Date of Patent: April 27, 2004Assignee: Fujistu LimitedInventors: Yasuhiro Ichihara, Seiji Kogure, Hiroshi Iimura, Fumio Arase
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Publication number: 20030063448Abstract: There is provided a ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package.Type: ApplicationFiled: November 19, 2002Publication date: April 3, 2003Applicant: Fujitsu LimitedInventors: Yasuhiro Ichihara, Seiji Kogure, Hiroshi Iimura, Fumio Arase
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Patent number: 6498307Abstract: A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.Type: GrantFiled: July 29, 1998Date of Patent: December 24, 2002Assignee: Fujitsu LimitedInventors: Yasuhiro Ichihara, Seiji Kogure, Hiroshi Iimura, Fumio Arase
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Publication number: 20010030057Abstract: There is provided a ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package.Type: ApplicationFiled: July 29, 1998Publication date: October 18, 2001Applicant: FUJITSU LIMITEDInventors: YASUHIRO ICHIHARA, SEIJI KOGURE, HIROSHI IIMURA, FUMIO ARASE
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Patent number: 5828128Abstract: A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.Type: GrantFiled: February 21, 1996Date of Patent: October 27, 1998Assignee: Fujitsu, Ltd.Inventors: Yutaka Higashiguchi, Toshio Kumai, Yasuhiro Teshima, Mamoru Niishiro, Yasushi Kobayashi, Yukio Sekiya, Shuzo Igarashi, Yasuhiro Ichihara
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Patent number: 5760469Abstract: A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.Type: GrantFiled: February 16, 1996Date of Patent: June 2, 1998Assignee: Fujitsu LimitedInventors: Yutaka Higashiguchi, Mitsuo Inagaki, Toshio Kumai, Ryoichi Ochiai, Yasuhiro Teshima, Mamoru Niishiro, Yasushi Kobayashi, Hideaki Tamura, Hiroshi Iimura, Seishi Chiba, Yukio Sekiya, Shuzo Igarashi, Yasuhiro Ichihara