Patents by Inventor Yasuhiro ISHIMOTO

Yasuhiro ISHIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11471954
    Abstract: A tool holder (1) includes a clamping member (4) for clamping and holding a tool (5), a holder body (2) having, at a leading end thereof, a receiving portion (25) for receiving the clamping member (4) along an axis (AX) and an operational member (N) for attaching the clamping member (4) to the holder body (2). The clamping member (4) clamps the tool (5) by an operation of the operational member (N). Vibration is applied to a contact portion (T) between the clamping member (4) and the holder body (2) when the clamping member (4) clamps the tool (5).
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: October 18, 2022
    Assignee: Big Daishowa Co., Ltd.
    Inventors: Joji Nakatani, Yasuyuki Ishida, Hidemori Kawashita, Yasuhiro Ishimoto
  • Publication number: 20190381577
    Abstract: A tool holder (1) includes a clamping member (4) for clamping and holding a tool (5), a holder body (2) having, at a leading end thereof, a receiving portion (25) for receiving the clamping member (4) along an axis (AX) and an operational member (N) for attaching the clamping member (4) to the holder body (2). The clamping member (4) clamps the tool (5) by an operation of the operational member (N). Vibration is applied to a contact portion (T) between the clamping member (4) and the holder body (2) when the clamping member (4) clamps the tool (5).
    Type: Application
    Filed: March 2, 2017
    Publication date: December 19, 2019
    Inventors: Joji NAKATANI, Yasuyuki ISHIDA, Hidemori KAWASHITA, Yasuhiro ISHIMOTO
  • Patent number: 10389212
    Abstract: A printed circuit board and multiple components, which are mounted on both sides of the printed circuit board, form a circuit to drive a motor. The printed circuit board is opposed to a case at a one side. First thermal conductive portion is interposed between a heat generating component of the components and the case. Second thermal conductive portion is interposed between the circuit board and the case. The first and second thermal conductive portions are formed of the same flexible material, are equipped to the same side of the circuit board, are in contact with both the circuit board and the case, and are located at different positions.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: August 20, 2019
    Assignee: DENSO CORPORATION
    Inventors: Yasuhiro Ishimoto, Kazuyuki Watanabe, Takuya Matsuyama
  • Publication number: 20180269122
    Abstract: A printed substrate having a first surface to which an electronic component is to be fixed through an underfill material includes a groove that is recessed from the first surface. The first surface includes a pair of lands that is to be electrically connected to the electronic component. The groove extends in a first direction in which the pair of lands extends and is located in a facing region of the first surface in which the first surface is to face the electronic component. An electronic device includes the printed substrate, the electronic component fixed to the first surface and the underfill material disposed between the first surface and the electronic component.
    Type: Application
    Filed: February 28, 2018
    Publication date: September 20, 2018
    Inventors: Yoshiki KATO, Yasuhiro ISHIMOTO
  • Publication number: 20180006520
    Abstract: A printed circuit board and multiple components, which are mounted on both sides of the printed circuit board, form a circuit to drive a motor. The printed circuit board is opposed to a case at a one side. First thermal conductive portion is interposed between a heat generating component of the components and the case. Second thermal conductive portion is interposed between the circuit board and the case. The first and second thermal conductive portions are formed of the same flexible material, are equipped to the same side of the circuit board, are in contact with both the circuit board and the case, and are located at different positions.
    Type: Application
    Filed: May 30, 2017
    Publication date: January 4, 2018
    Inventors: Yasuhiro ISHIMOTO, Kazuyuki WATANABE, Takuya MATSUYAMA