Patents by Inventor Yasuhiro Kajikawa
Yasuhiro Kajikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240326177Abstract: A flux containing an organic acid (AC1), a solvent (S1), and a compound (AZ1) that has a benzotriazole skeleton is employed. AC1 has a rate of decrease in weight of 20% by mass or less in a case of being held at 140° C. for 15 minutes. S1 has a rate of decrease in weight of 50% by mass or less in a case of being held at 140° C. for 15 minutes.Type: ApplicationFiled: October 4, 2022Publication date: October 3, 2024Inventors: Tomohisa KAWANAGO, Yasuhiro KAJIKAWA, Atsushi IKEDA
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Patent number: 11945055Abstract: A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of 1200 or less, in which the content of the low-molecular-weight nonionic surfactant is equal to or larger than the content of the organic sulfonic acid activator. This flux contains no cationic surfactant or contains more than 0 wt % and 5 wt % or less of the cationic surfactant. A solder paste containing this flux and a Sn-based solder metal.Type: GrantFiled: October 14, 2021Date of Patent: April 2, 2024Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroshi Sugii, Yasuhiro Kajikawa, Yo Yamada
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Publication number: 20230302585Abstract: A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of 1200 or less, in which the content of the low-molecular-weight nonionic surfactant is equal to or larger than the content of the organic sulfonic acid activator. This flux contains no cationic surfactant or contains more than 0 wt % and 5 wt % or less of the cationic surfactant. A solder paste containing this flux and a Sn-based solder metal.Type: ApplicationFiled: October 14, 2021Publication date: September 28, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroshi SUGII, Yasuhiro KAJIKAWA, Yo YAMADA
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Patent number: 11407068Abstract: Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.Type: GrantFiled: August 1, 2019Date of Patent: August 9, 2022Assignee: Senju Metal Industry Co., Ltd.Inventors: Yasuhiro Kajikawa, Hiroyoshi Kawasaki, Hiroshi Sugii, Yoshinori Hiraoka
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Patent number: 11179813Abstract: Provided is a flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. The flux includes 5 wt % or more and 20 wt % or less of any one of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid, on in total, of two or more of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid; 30 wt % or more and 70 wt % or less of a thermosetting resin; and 3 wt % or more and 15 wt % or less of an amine. The solder paste includes solder powder and the flux.Type: GrantFiled: January 16, 2019Date of Patent: November 23, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Yasuhiro Kajikawa, Hiroshi Sugii, Hiroyoshi Kawasaki, Yoshinori Hiraoka
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Publication number: 20210245306Abstract: Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.Type: ApplicationFiled: August 1, 2019Publication date: August 12, 2021Inventors: Yasuhiro Kajikawa, Hiroyoshi Kawasaki, Hiroshi Sugii, Yoshinori Hiraoka
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Publication number: 20210069837Abstract: Provided is a flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. The flux includes 5 wt % or more and 20 wt % or less of any one of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid, on in total, of two or more of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid; 30 wt % or more and 70 wt % or less of a thermosetting resin; and 3 wt % or more and 15 wt % or less of an amine. The solder paste includes solder powder and the flux.Type: ApplicationFiled: January 16, 2019Publication date: March 11, 2021Inventors: Yasuhiro Kajikawa, Hiroshi Sugii, Hiroyoshi Kawasaki, Yoshinori Hiraoka
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Publication number: 20200047291Abstract: A flux including: a) a phenolic activator except a hindered phenol, b) a resin, c) an organic acid, and d) a solvent. The phenolic activator, which is contained in the flux, has a molecular weight of 150 or more and 550 or less. Further, the flux may include: a) a phenolic activator except a hindered phenol and b) an acrylic resin.Type: ApplicationFiled: August 7, 2019Publication date: February 13, 2020Inventors: Masato Shiratori, Hiroyoshi Kawasaki, Yasuhiro Kajikawa
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Patent number: 10357852Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.Type: GrantFiled: September 15, 2016Date of Patent: July 23, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Yasuhiro Kajikawa, Yoshinori Hiraoka, Hiroyoshi Kawasaki, Takashi Hagiwara
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Publication number: 20190091809Abstract: Provided is a flux that can delay cured time of a resin within room temperature range and suppress the glass transition point of the resin from being reduced. The flux contains at least one species of ?-amino acid and ?-amino acid and a thermosetting resin wherein 1 part by weight or more and 30 parts by weight or less of ?-amino acid or ?-amino acid, or ?-amino acid and ?-amino acid are added for 100 parts by weight of the thermosetting agent.Type: ApplicationFiled: March 30, 2017Publication date: March 28, 2019Inventors: Hiroyoshi Kawasaki, Yasuhiro Kajikawa, Yoshinori Hiraoka, Takashi Hagiwara
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Publication number: 20180257182Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.Type: ApplicationFiled: September 15, 2016Publication date: September 13, 2018Inventors: Yasuhiro Kajikawa, Yoshinori Hiraoka, Hiroyoshi Kawasaki, Takashi Hagiwara