Patents by Inventor Yasuhiro Kashima

Yasuhiro Kashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10340063
    Abstract: A chip resistor includes a resistive element, first and second electrodes disposed on a lower surface the resistive element, a protective film disposed on the lower surface of the resistive element and between the first and second electrodes. The resistive element has first and second recesses therein. The first recess extends from the lower surface along a first edge surface and does not reach an upper surface of the resistive element. The second recess extends from the lower surface along a second edge surface and does not reach the upper surface of the resistive element. The first and second electrodes are disposed between the first and second recesses. The protective film is disposed between the first and second electrodes. A first plating layer disposed on the first electrode and an inner surface of the first recess. A second plating layer is disposed on the second electrode and an inner surface of the second recess. This chip resistor avoids mounting failures.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: July 2, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuharu Kinoshita, Shoji Hoshitoku, Hironori Tsubota, Yasuhiro Kashima
  • Publication number: 20180096759
    Abstract: A chip resistor includes a resistive element, first and second electrodes disposed on a lower surface the resistive element, a protective film disposed on the lower surface of the resistive element and between the first and second electrodes. The resistive element has first and second recesses therein. The first recess extends from the lower surface along a first edge surface and does not reach an upper surface of the resistive element. The second recess extends from the lower surface along a second edge surface and does not reach the upper surface of the resistive element. The first and second electrodes are disposed between the first and second recesses. The protective film is disposed between the first and second electrodes. A first plating layer disposed on the first electrode and an inner surface of the first recess. A second plating layer is disposed on the second electrode and an inner surface of the second recess. This chip resistor avoids mounting failures.
    Type: Application
    Filed: April 26, 2017
    Publication date: April 5, 2018
    Inventors: YASUHARU KINOSHITA, SHOJI HOSHITOKU, HIRONORI TSUBOTA, YASUHIRO KASHIMA
  • Patent number: 9890373
    Abstract: The present application relates to a modified isoprene synthase that has an isoprene synthetic activity and has at least one mutation of an amino acid residue in the amino acid sequence of SEQ ID NO: 4, an amino acid sequence having one or several amino acid substitutions, deletions, insertions or additions in the amino acid sequence of SEQ ID NO: 4, or an amino acid sequence having 90% or more identity to the amino acid sequence of SEQ ID NO: 4. The modified isoprene synthase is useful for preparing isoprene monomers in improved yields.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: February 13, 2018
    Assignee: Ajinomoto Co., Inc.
    Inventors: Kunio Nakata, Yoshinori Tajima, Uno Tagami, Takashi Oku, Yasuhiro Kashima
  • Publication number: 20160257944
    Abstract: Modified isoprene synthases that have one or more mutations of a given amino acid residue(s) in any amino acid sequence of (a) the amino acid sequence of SEQ ID NO:4, (b) an amino acid sequence having one or several amino acid substitutions, deletions, insertions or additions in the amino acid sequence of SEQ ID NO:4, or (c) an amino acid sequence having 90% or more identity to the amino acid sequence of SEQ ID NO:4, and has an isoprene synthetic activity are useful for preparing isoprene monomer in improved yields.
    Type: Application
    Filed: May 19, 2016
    Publication date: September 8, 2016
    Applicant: AJINOMOTO CO., INC.
    Inventors: Kunio NAKATA, Yoshinori Tajima, Uno Tagami, Takashi Oku, Yasuhiro Kashima
  • Patent number: 8609376
    Abstract: A process for producing a saccharified solution, by which xylose can be produced at a high yield from lignocellulosic biomass, is provided. The saccharification is carried out by adding a saccharifying enzyme to a pretreated material for saccharification of the lignocellulosic biomass. As the saccharifying enzyme is added a mixture of a first saccharifying enzyme originated from one or more microorganisms selected from the group consisting of fungi of the genus Acremonium, the genus Trichoderma, the genus Penicillium, the genus Aspergillus and the genus Thermoascus, and eubacteria of the genus Clostridium and the genus Bacillus, and a second saccharifying enzyme composed of ?-xylosidase originated from Thermotoga maritima.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: December 17, 2013
    Assignees: Honda Motor Co., Ltd., Thermostable Enzyme Laboratory Co., Ltd.
    Inventors: Shigenobu Mitsuzawa, Minako Onodera, Maiko Fukuura, Koh Shikata, Yasuhiro Kashima
  • Publication number: 20120003702
    Abstract: A process for producing a saccharified solution, by which xylose can be produced at a high yield from lignocellulosic biomass, is provided. The saccharification is carried out by adding a saccharifying enzyme to a pretreated material for saccharification of the lignocellulosic biomass. As the saccharifying enzyme is added a mixture of a first saccharifying enzyme originated from one or more microorganisms selected from the group consisting of fungi of the genus Acremonium, the genus Trichoderma, the genus Penicillium, the genus Aspergillus and the genus Thermoascus, and eubacteria of the genus Clostridium and the genus Bacillus, and a second saccharifying enzyme composed of ?-xylosidase originated from Thermotoga maritima.
    Type: Application
    Filed: May 9, 2011
    Publication date: January 5, 2012
    Applicants: THERMOSTABLE ENZYME LABORATORY CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Shigenobu MITSUZAWA, Minako Onodera, Maiko Fukuura, Koh Shikata, Yasuhiro Kashima
  • Publication number: 20050164350
    Abstract: The inventors isolated from hyperthermophilic archaebacteria Aeropyrum pernix a heat resistant thioredoxin, thioredoxin reductase and thioredoxin peroxidase having at least 50% residual activity after heat treatment at 100° C. for 0.5 hour, and sequenced the amino acid and base sequences. The inventors also isolated from hyperthermophilic archaebacteria Pyrococcus horikoshii a heat resistant thioredoxin, thioredoxin reductase, and thioredoxin peroxidase showing substantially no decline in activity when heat treated at 100° C. for 0.5 hour, and sequenced the amino acid and base sequences.
    Type: Application
    Filed: March 18, 2005
    Publication date: July 28, 2005
    Inventors: Kazuhiko Ishikawa, Sung-jong Jeon, Yasuhiro Kashima
  • Publication number: 20030235902
    Abstract: The inventors isolated from hyperthermophilic archaebacteria Aeropyrum pernix a heat resistant thioredoxin, thioredoxin reductase and thioredoxin peroxidase having at least 50% residual activity after heat treatment at 100° C. for 0.5 hour, and sequenced the amino acid and base sequences. The inventors also isolated from hyperthermophilic archaebacteria Pyrococcus horikoshii a heat resistant thioredoxin, thioredoxin reductase, and thioredoxin peroxidase showing substantially no decline in activity when heat treated at 100° C. for 0.5 hour, and sequenced the amino acid and base sequences.
    Type: Application
    Filed: December 10, 2002
    Publication date: December 25, 2003
    Inventors: Kazuhiko Ishikawa, Sung-Jong Jeon, Yasuhiro Kashima
  • Patent number: 4985212
    Abstract: Disclosed is an apparatus for supporting a ceramic honeycomb element which is anisotropic in modulus of elasticity and in strength. The support apparatus comprises a shock absorber which is interposed between a casing and the honeycomb element so that a force of pressure acts on the honeycomb element in high-strength directions of the honeycomb structure thereof.
    Type: Grant
    Filed: January 24, 1990
    Date of Patent: January 15, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Kawakami, Yasuhiro Kashima