Patents by Inventor Yasuhiro Kawauchi

Yasuhiro Kawauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220266161
    Abstract: A personal assistant control system which enables a robotic personal assistant to properly support a user according to the user's growth, includes: a first personal assistant (PA) 1 used in a first period to acquire information from a first sensor group; a second PA 2 used in a second period to acquire information from a second sensor group; and a server 5 connected to the first PA 1 and the second PA 2 via a network and configured to estimate a state of a user 3 based on information acquired from the first or second sensor group. In a third period T3 bridging the first period T1 and the second period T2, the server estimates the state of the user 3 based on information acquired from common sensors which are specific types of sensors included in the first and second sensor groups and configured to acquire common attributes.
    Type: Application
    Filed: July 30, 2020
    Publication date: August 25, 2022
    Inventors: Yasuhiro KAWAUCHI, Tamaki NAKAMURA, Osamu TOYAMA, Takahiro INOUE
  • Patent number: 8575469
    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: November 5, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Kawauchi, Takanori Nakamura
  • Publication number: 20120021551
    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.
    Type: Application
    Filed: October 4, 2011
    Publication date: January 26, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro KAWAUCHI, Takanori NAKAMURA
  • Publication number: 20090032080
    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.
    Type: Application
    Filed: August 21, 2008
    Publication date: February 5, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasuhiro Kawauchi, Takanori Nakamura