Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: A semiconductor apparatus is comprising a circuit board with a semiconductor device surface-mounted on one surface thereof. A heatsink is disposed and fixed with a connection member and separated with a predetermined distance on one side of the circuit board opposite to the surface where the semiconductor device is mounted. A heat conductive sheet is provided between the circuit board and the heatsink and thermally connecting the semiconductor device and the heatsink through the circuit board. The heat conductive sheet is constituted as a laminate of a first member and a second member and one of the first and second members is a ceramic board whereas the other is a resin sheet material having highly heat conductive fillers mixed therein.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: A fluorinated polymer comprising a unit represented by the following formula (1), a method for producing fluorinated compounds and the fluorinated polymers, and an optical/electrical material or coating material comprising the fluorinated polymer.

Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

Abstract: A production method of fluorinated compounds, for producing a compound represented by formula (3) in a fluorine-based solution in a flow of fluorine gas after reaction of at least one type of compounds represented by formula (1) and at least one type of compounds represented by formula (2). Similarly, fluorinated compounds represented by formula (4) prepared by the fluorination of compounds obtained by the reaction of formula (1) and formula (2)?. The fluorinated polymers obtained by the polymerizations of formula (3) and (4) compounds are useful as an optical or electrical materials. wherein R1, R2, R3, R4, Rff1, Rff2, Rff3, Rff4, X, Y, Z, and n are defined in the specification respectively.

Abstract: A fluorinated polymer comprising a unit represented by the following formula (1), a method for producing fluorinated compounds and the fluorinated polymers, and an optical/electrical material or coating material comprising the fluorinated polymer.

Abstract: A production method of fluorinated compounds, for producing a compound represented by formula (3) in a fluorine-based solution in a flow of fluorine gas after reaction of at least one type of compounds represented by formula (1) and at least one type of compounds represented by formula (2). Similarly, fluorinated compounds represented by formula (4) prepared by the fluorination of compounds obtained by the reaction of formula (1) and formula (2)?. The fluorinated polymers obtained by the polymerizations of formula (3) and (4) compounds are useful as an optical or electrical materials. wherein R1, R2, R3, R4, Rff1, Rff2, Rff3, Rff4, X, Y, Z, and n are defined in the specification respectively.

Abstract: An light source control unit controls the flashing of a light source and the light amount of a light source according to information to be transmitted. Thus, light, which is modulated according to the information to be transmitted, is emitted from the light source. The light emitted from the light source is made to enter an optical fiber to pass therethrough and enter a light-scattering body which scatters and radiates the modulated light incident from the optical fiber. The scattered light serves as illumination light as it is. Furthermore, if the illumination light is decoded by a decoding unit after being received by a photoreceptor unit of a receiving set, then information carried by the illumination light can be received.

Abstract: Provided are an optical resin and an optical member using the same, both orientation birefringence and photoelasticity birefringence of the optical material being deadened and generally eliminated. The optical material consists of a composite constituent system of three or more constituents including a copolymerization system of monomer-element number not smaller than two, combination and constituent ratio of the composite constituent system being set so that both orientation birefringence and photoelasticity birefringence of the optical material are deadened at the same time and 5.0×10?5 or less is given under a condition that principal chains of the copolymerization system have degree of orientation equal to 0.03, and further a photoelasticity constant not greater than 1.0×10?12 (Pa?1) is obtained. The composite constituent system may contain an additive containing a low molecular weight compound which has an anisotropic polarizability and can be orientated in a polymer.

Abstract: An inverter circuit overcurrent protection device in which an overcurrent detection resistor (Rs) is incorporated in a hybrid integrated circuit, in which a detection voltage from the overcurrent detection resistor (Rs) is divided by voltage dividing resistors (R1 and R2) and is compared with a reference voltage in an overcurrent detection circuit, for carrying out an overcurrent protection, and an external resistor is connected in series or in parallel with one of the voltage dividing resistors (R1 and R2) to change a division ratio so that the level of overcurrent protection can be adjusted; and an embodiment wherein, in the vicinity of a current detection terminal, a first pad (P1) is connected to a detection voltage from the overcurrent detection resistance, a second pad (P2) is connected to a detection voltage from the amplifier, and a third pad (P3) is connected to the voltage dividing resistors, and a bonding wire (10) is connected between the current detection terminal one of said pads, to select one

Abstract: A copolymer of (meth)acrylic ester represented by a general formula (1) including a following repeating unit A and repeating unit B. In the general formula (1), R1 and R2 each independently represent hydrogen atom or methyl group; R3 represents an alkyl group having 1 to 4 carbon atoms; Y represents an atomic group forming an aromatic ring; x represents 1 to n, n represents the number of fluorine atoms which can be contained in the aromatic ring; and a and b each independently represent an integer of 1 or more.

Abstract: A fluorinated polymer comprising a unit represented by the following formula (1), a method for producing fluorinated compounds and the fluorinated polymers, and an optical/electrical material or coating material comprising the fluorinated polymer.

Abstract: The present invention has been developed considering the above-described problems and aims to provide various structures and applications for illuminative light communication. According to the first aspect of the prevent invention, a broadcast system includes an LED light source 115 for lighting, a power line 103 that supplies electric power to the LED light source 115, a data modulator 102 that modulates and multiplexes a plurality of pieces of data, superimposes the resulting signal on an electric power waveform, and then transmits the resulting superimposed signal waveform to the power line 103, and a filter 112 that selectively separates one or more of a plurality of pieces of modulated data on the power line so as to control light intensity or blinking of the LED light source. Data is transmitted through changes in light intensity or blinking of the LED light source.

Abstract: A surface light emitting device includes a polarized light source that emits polarized light; and a light guide plate including a light incident surface on which the polarized light emitted from the polarized light source is made incident, and a light emitting surface that emits light, the light guide plate being made of light transmissive resin having low birefringence in which retardation is one-fourth or less of a wavelength of the polarized light.

Abstract: Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.