Abstract: The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.

Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.

Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.

Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole.

Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole.