Patents by Inventor Yasuhiro Kusano
Yasuhiro Kusano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210299412Abstract: A guide wire has a core shaft. The core shaft includes a body portion and a layered portion. The body portion contains a nickel-titanium-based alloy as a main component, the nickel-titanium-based alloy having a superelastic property. The layered portion includes an inner layer formed on a part of an outer peripheral face of the body portion and containing a nickel alloy as a main component, and an outer layer formed on the inner layer and containing a titanium oxide as a main component.Type: ApplicationFiled: June 10, 2021Publication date: September 30, 2021Applicant: ASAHI INTECC CO., LTD.Inventors: Yasuhiro Kusano, Maiko Kataoka, Yu Shinohara
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Patent number: 10362929Abstract: An imaging unit includes: a semiconductor package including an image sensor and a connection electrode; a circuit board including a main body including a connection land, and an attachment portion protruding on a back surface of the main body and including cable connection electrodes formed on at least two opposing side surfaces; electronic components mounted on an electronic component mounting area on the back surface; and cables electrically and mechanically connected to the cable connection electrodes of the attachment portion. The attachment portion protrudes from the main body such that a center plane of the two side surfaces is shifted from a center plane of side surfaces parallel to the two side surfaces, and at least one side surface is perpendicular to the back surface of the main body. The electronic component mounting area is arranged on the back surface of the main body side-by-side with the attachment portion.Type: GrantFiled: October 31, 2017Date of Patent: July 30, 2019Assignee: OLYMPUS CORPORATIONInventors: Hiroyuki Motohara, Yasuhiro Kusano
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Patent number: 10321805Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.Type: GrantFiled: January 3, 2018Date of Patent: June 18, 2019Assignee: OLYMPUS CORPORATIONInventors: Hiroyuki Motohara, Yasuhiro Kusano
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Patent number: 10064543Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a connection electrode on a back side thereof; a circuit board having connection electrodes on front and back sides thereof, the connection electrode on the front side being connected to the connection electrode of the semiconductor package; a deformed circuit board having first, second, and third faces and having connection electrodes on the first, second, and third faces, respectively, a connection electrode on the first face being connected to the connection electrodes of the circuit board; an electronic component mounted on the back side of the circuit board; and cables connected to the connection electrodes on the second and third faces. The electronic component is housed in a recess of the deformed circuit board. The circuit board, the deformed circuit board, and the cables are located within a projection plane in an optical-axis-direction of the semiconductor package.Type: GrantFiled: January 25, 2017Date of Patent: September 4, 2018Assignee: OLYMPUS CORPORATIONInventors: Hiroyuki Motohara, Yasuhiro Kusano
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Publication number: 20180125335Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.Type: ApplicationFiled: January 3, 2018Publication date: May 10, 2018Applicant: OLYMPUS CORPORATIONInventors: Hiroyuki MOTOHARA, Yasuhiro KUSANO
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Publication number: 20180049628Abstract: An imaging unit includes: a semiconductor package including an image sensor and a connection electrode; a circuit board including a main body including a connection land, and an attachment portion protruding on a back surface of the main body and including cable connection electrodes formed on at least two opposing side surfaces; electronic components mounted on an electronic component mounting area on the back surface; and cables electrically and mechanically connected to the cable connection electrodes of the attachment portion. The attachment portion protrudes from the main body such that a center plane of the two side surfaces is shifted from a center plane of side surfaces parallel to the two side surfaces, and at least one side surface is perpendicular to the back surface of the main body. The electronic component mounting area is arranged on the back surface of the main body side-by-side with the attachment portion.Type: ApplicationFiled: October 31, 2017Publication date: February 22, 2018Applicant: OLYMPUS CORPORATIONInventors: Hiroyuki MOTOHARA, Yasuhiro KUSANO
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Publication number: 20170127921Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a connection electrode on a back side thereof; a circuit board having connection electrodes on front and back sides thereof, the connection electrode on the front side being connected to the connection electrode of the semiconductor package; a deformed circuit board having first, second, and third faces and having connection electrodes on the first, second, and third faces, respectively, a connection electrode on the first face being connected to the connection electrodes of the circuit board; an electronic component mounted on the back side of the circuit board; and cables connected to the connection electrodes on the second and third faces. The electronic component is housed in a recess of the deformed circuit board. The circuit board, the deformed circuit board, and the cables are located within a projection plane in an optical-axis-direction of the semiconductor package.Type: ApplicationFiled: January 25, 2017Publication date: May 11, 2017Applicant: OLYMPUS CORPORATIONInventors: Hiroyuki MOTOHARA, Yasuhiro KUSANO
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Patent number: 7842397Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.Type: GrantFiled: September 21, 2006Date of Patent: November 30, 2010Assignee: Hitachi Cable, Ltd.Inventors: Yasuyuki Ito, Katsuyuki Matsumoto, Koji Nukaga, Yasuhiro Kusano, Kenji Yokomizo, Shingo Watanabe, Hiroyuki Ogawara, Katsumi Nomura
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Publication number: 20070071999Abstract: A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.Type: ApplicationFiled: September 21, 2006Publication date: March 29, 2007Applicant: Hitachi Cable, Ltd.Inventors: Yasuyuki Ito, Katsuyuki Matsumoto, Koji Nukaga, Yasuhiro Kusano, Kenji Yokomizo, Shingo Watanabe, Hiroyuki Ogawara, Katsumi Nomura
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Patent number: 7108923Abstract: A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 ?g/cm2 of chromium converted into metallic chromium.Type: GrantFiled: October 12, 2005Date of Patent: September 19, 2006Assignee: Hitachi Cable, Ltd.Inventors: Yasuyuki Ito, Katsuyuki Matsumoto, Kenji Yokomizo, Yasuhiro Kusano, Shinichiro Shimizu, Muneo Kodaira, Katsumi Nomura