Patents by Inventor Yasuhiro Matsuki

Yasuhiro Matsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170333982
    Abstract: A method of manufacturing a steel strip for coiled tubing includes melting molten steel having a composition including, in terms of percent by mass, C: 0.10% or more and 0.16% or less, Si: 0.1% or more and 0.5% or less, Mn: 0.5% or more and 1.5% or less, P: 0.02% or less, S: 0.005% or less, Sol. Al: 0.01% or more and 0.07% or less, Cr: 0.4% or more and 0.8% or less, Cu: 0.1% or more and 0.5% or less, Ni: 0.1% or more and 0.3% or less, Mo: 0.1% or more and 0.2% or less, Nb: 0.01% or more and 0.04% or less, Ti: 0.005% or more and 0.03% or less, N: 0.005% or less, and the balance of Fe and inevitable impurities; casting the molten steel into a steel material; subjecting the steel material to hot rolling; and coiling a resultant steel strip, wherein a finish rolling temperature is 820° C. or more and 920° C. or less, a coiling temperature is 550° C. or more and 620° C. or less, and a time taken from the finish hot rolling to the coiling is 20 seconds or less.
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Inventors: Yasuhiro Matsuki, Takahiko Ogura, Chikara Kami, Hiroshi Nakata
  • Publication number: 20170307111
    Abstract: A steel strip for an electric-resistance-welded steel pipe or tube having a strength of X70 grade or more and excellent HIC resistance and SSC resistance is provided. A steel strip for an electric-resistance-welded steel pipe or tube has a chemical composition containing, in mass %: C: 0.02% to 0.06%; Si: 0.1% to 0.3%; Mn: 0.8% to 1.3%; P: 0.01% or less; S: 0.001% or less; V: 0.04% to 0.07%; Nb: 0.04% to 0.07%; Ti: 0.01% to 0.04%; Cu: 0.1% to 0.3%; Ni: 0.1% to 0.3%; Ca: 0.001% to 0.005%; Al: 0.01% to 0.07%; and N: 0.007% or less, with a balance being Fe and incidental impurities, contents of C, Nb, V, and Ti satisfying the following Expression (1) [C]?12([Nb]/92.9+[V]/50.9+[Ti]/47.9)?0.03%??(1), wherein a ferrite area ratio is 90% or more.
    Type: Application
    Filed: August 6, 2015
    Publication date: October 26, 2017
    Applicant: JFE STEEL CORPORATION
    Inventor: Yasuhiro MATSUKI
  • Patent number: 9765417
    Abstract: A low-yield ratio high-strength electric resistance welded steel pipe has a yield ratio of 80% or less and a TS of 655 MPa or more. A steel material has a composition containing 0.38% to 0.45% C, 0.1% to 0.3% Si, 1.0% to 1.8% Mn, 0.03% or less P, 0.03% or less S, 0.01% to 0.07% sol. Al, and 0.01% or less N on a mass basis.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: September 19, 2017
    Assignee: JFE Steel Corporation
    Inventors: Yasuhiro Matsuki, Tomohiro Inoue
  • Patent number: 9616485
    Abstract: Provided is a metal strip for a pipe with which the weight of a pipe can be reduced while maintaining the strength of a joint portion that tends to be structurally the weakest. A metal strip L is formed by rolling. The thickness of each of a head end portion 1a and a tail end portion 1b, which are longitudinal end portions 1, is greater than the thickness of an intermediate portion excluding the longitudinal end portions 1. The metal strips are connected to each other in series by welding, and a pipe is made by performing a pipe-forming operation.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: April 11, 2017
    Assignee: JFE STEEL CORPORATION
    Inventors: Takahiko Ogura, Hiroshi Shigeta, Yoshimitsu Fukui, Yoshitsugu Iijima, Kei Mikami, Yasuhiro Matsuki
  • Patent number: 9253922
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: February 2, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20150328675
    Abstract: Provided is a metal strip for a pipe with which the weight of a pipe can be reduced while maintaining the strength of a joint portion that tends to be structurally the weakest. A metal strip L is formed by rolling. The thickness of each of a head end portion 1a and a tail end portion 1b, which are longitudinal end portions 1, is greater than the thickness of an intermediate portion excluding the longitudinal end portions 1. The metal strips are connected to each other in series by welding, and a pipe is made by performing a pipe-forming operation.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 19, 2015
    Applicant: JFE STEEL CORPORATION
    Inventors: Takahiko OGURA, Hiroshi SHIGETA, Yoshimitsu FUKUI, Yoshitsugu IIJIMA, Kei MIKAMI, Yasuhiro MATSUKI
  • Patent number: 9155212
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: October 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20150068638
    Abstract: A low-yield ratio high-strength electric resistance welded steel pipe has a yield ratio of 80% or less and a TS of 655 MPa or more. A steel material has a composition containing 0.38% to 0.45% C, 0.1% to 0.3% Si, 1.0% to 1.8% Mn, 0.03% or less P, 0.03% or less S, 0.01% to 0.07% sol. Al, and 0.01% or less N on a mass basis.
    Type: Application
    Filed: April 9, 2012
    Publication date: March 12, 2015
    Applicant: JFE STEEL CORPORATION
    Inventors: Yasuhiro Matsuki, Tomohiro Inoue
  • Publication number: 20150004050
    Abstract: A steel strip for coiled tubing contains, in terms of percent by mass, C: 0.10% or more and 0.16% or less, Si: 0.1% or more and 0.5% or less, Mn: 0.5% or more and 1.5% or less, P: 0.02% or less, S: 0.005% or less, Sol. Al: 0.01% or more and 0.07% or less, Cr: 0.4% or more and 0.8% or less, Cu: 0.1% or more and 0.5% or less, Ni: 0.1% or more and 0.3% or less, Mo: 0.1% or more and 0.2% or less, Nb: 0.01% or more and 0.04% or less, Ti: 0.005% or more and 0.03% or less, N: 0.005% or less, and the balance of Fe and inevitable impurities.
    Type: Application
    Filed: January 18, 2013
    Publication date: January 1, 2015
    Inventors: Yasuhiro Matsuki, Takahiko Ogura, Chikara Kami, Hiroshi Nakata
  • Patent number: 8823872
    Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: September 2, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Yasuhiro Matsuki, Takanori Suzuki, Akiya Nakayama
  • Patent number: 8790950
    Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: July 29, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takanori Suzuki, Tadashi Kosaka, Koji Tsuduki, Yasuhiro Matsuki, Shin Hasegawa, Akiya Nakayama
  • Publication number: 20130286566
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20130286565
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20130286592
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 8309433
    Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: November 13, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasuhiro Matsuki, Takanori Suzuki, Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Akiya Nakayama
  • Patent number: 8279336
    Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(?A?2?C)?L1+L1? at any point on the upright surface, and H tan(?A?2?B)+(H1)tan ?B?L1 and ?B>?C at any point on the non-vertical surface, where ?A is the inclination of incident light, ?B is the inclination at a point on the non-vertical surface, ?C is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1? is the distance from the upper edge to the lower edge of the upright surface in the planar direction.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: October 2, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Hisatane Komori, Yasuhiro Matsuki, Satoru Hamasaki
  • Patent number: 8241951
    Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: August 14, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hisatane Komori, Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki
  • Publication number: 20120052612
    Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.
    Type: Application
    Filed: August 16, 2011
    Publication date: March 1, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Yasuhiro Matsuki, Takanori Suzuki, Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Akiya Nakayama
  • Publication number: 20120050590
    Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.
    Type: Application
    Filed: August 16, 2011
    Publication date: March 1, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Tadashi Kosaka, Koji Tsuduki, Yasuhiro Matsuki, Shin Hasegawa, Akiya Nakayama