Abstract: Gob producing device with a molten glass feeder having an orifice at its bottom portion and a cutter for cutting the molten glass pushed out through the orifice so as to be suspended and produce a gob. The gob producing device includes a cutter position moving for adjusting the height of the cutter mechanism by moving it, a gob observing device for observing the falling gob in three dimensions, an image processor for obtaining the gob length from spatial position data obtained by the gob observing device to determine acceptance or rejection of the length and calculating correction data for correcting the cutter's height from the difference between measured and set values of the gob length when the obtained length is determined to be inappropriate, and a control device for moving the cutter mechanism by controlling the cutter position moving mechanism's operation on the basis of the correction data.

Abstract: A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract: A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract: A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.