Abstract: There are provided connecting wires whose reliability may be ensured by preventing leakage between the connecting wires and by preventing entry of moisture. Overexposure is performed by using a mask having a shape of a protruding pattern (55a) with a sharp tip end at a position corresponding to a pattern edge of an organic insulating film (70) between adjacent connecting wires (50). Inclination of an inclined surface of the organic insulating film (70) sandwiched by the connecting wires (50) is thereby made gradual, and thus, at the time of forming the connecting wires (50), a film thickness of a resist may be prevented from becoming thick along an edge line of the organic insulating film (70). As a result, the resist is prevented from remaining in a connected manner at a region sandwiched by the adjacent connecting wires (50), and leakage between the adjacent connecting wires (50) may be prevented.

Abstract: There are provided connecting wires whose reliability may be ensured by preventing leakage between the connecting wires and by preventing entry of moisture. Overexposure is performed by using a mask having a shape of a protruding pattern (55a) with a sharp tip end at a position corresponding to a pattern edge of an organic insulating film (70) between adjacent connecting wires (50). Inclination of an inclined surface of the organic insulating film (70) sandwiched by the connecting wires (50) is thereby made gradual, and thus, at the time of forming the connecting wires (50), a film thickness of a resist may be prevented from becoming thick along an edge line of the organic insulating film (70). As a result, the resist is prevented from remaining in a connected manner at a region sandwiched by the adjacent connecting wires (50), and leakage between the adjacent connecting wires (50) may be prevented.

Abstract: A liquid crystal display panel 100 has: a first substrate 11, having an active region AA having pixel electrodes and TFTs, and a gate driver region GDR provided on the outside of the active region AA; and a second substrate 21, disposed opposing the first substrate 11 with a liquid crystal layer 30 interposed therebetween, and having an opposite electrode 23. The opposite electrode 23 opposes the gate driver region GDR with the liquid crystal layer 30 interposed therebetween, and an insulating resin layer 26 is formed on the region of the opposite electrode 23 so that the insulating resin layer 26 opposes the gate driver region GDR. Thus, short-circuit failure between the driver region of the TFT substrate and the opposite electrode is eliminated.

Abstract: An active matrix substrate is provided with a lead wire led out from a switching element to a surrounding region; a pad portion formed in the lead wire, and positioned in surrounding region; an insulation layer formed so as to cover pad portion, including a passivation film formed of an inorganic material, and a planarization film positioned on passivation film and formed of an organic material, and having a contact hole formed so as to reach pad; and an ITO film positioned in contact hole, and formed on pad. ITO film is formed so as to be spaced from a part defined by planarization film in an inner periphery surface of contact hole.

Abstract: An active matrix substrate is provided with a lead wire led from a switching element to a surrounding region; a pad portion formed in the lead wire and positioned in surrounding region; an insulation film including a planarization film positioned uppermost, and a passivation film and a gate insulation film positioned under planarization film, formed so as to cover the pad portion, and having a contact hole formed so as to reach pad portion; and an ITO film positioned in contact hole, and formed on pad portion.