Patents by Inventor Yasuhiro Nohara

Yasuhiro Nohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5891946
    Abstract: A resin mixture including a composition containing polypropylene that includes a portion insoluble in xylene, an isotactic pentad fraction of not less than 96.5% and an isotactic average chain length of not less than 90, 45.about.70 parts by weight; a polyolefin resin, 5.about.20 parts by weight; an inorganic filler selected from precipitated calcium carbonate, hydrated silicic acid, and hydrated calcium silicate, 5.about.30 parts by weight; and an inorganic filler selected from talc, mica, and potassium titanate, 5.about.30 parts by weight; is superior in scratch resistance, moldability, and balance of rigidity and impact resistance. In addition, a laminate having a layer of this mixture has superior gloss. This mixture and the laminate are useful in automobile parts, electric and electronic parts, packaging materials, etc.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: April 6, 1999
    Assignee: Showa Denko K.K.
    Inventors: Yasuhiro Nohara, Kazuyuki Watanabe
  • Patent number: 5497047
    Abstract: A fluorescent display device capable of realizing mounting of a semiconductor element on a substrate while ensuring an increase in moisture resistance, a decrease in contact resistance at connection between the semiconductor element and a wiring conductor and increased reliability. A semiconductor element is mounted on an extension of a substrate and received in a mounting chamber formed by cooperation of a sealing material, a face plate and the substrate. The semiconductor element is downwardly pressed against the substrate by the face plate, resulting in the semiconductor element being electrically connected to a wiring conductor. The sealing material is made of an inorganic material such as indium-tin alloy or the like which has an operating temperature lower than a sealing medium.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: March 5, 1996
    Assignee: Futaba Denshi Kogyo K.K.
    Inventors: Hisashi Nakata, Yoshihisa Yonezawa, Yasuhiro Nohara