Patents by Inventor Yasuhiro Ohmori

Yasuhiro Ohmori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10281748
    Abstract: An optical modulator includes a substrate having an electro-optic effect; a waveguide pattern provided on the substrate and configured to modulate light; and a dummy pattern having a predetermined potential along the waveguide pattern from an input side to an output side.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 7, 2019
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Toyokazu Sasaki, Yoshihiko Yoshida, Yasuhiro Ohmori, Yoshinobu Kubota
  • Patent number: 10095080
    Abstract: An optical modulator includes an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and a relay substrate configured to relay and couple the electrical signal to the optical modulator chip. The optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal. One end of the optical modulator chip is arranged to face the relay substrate. An electrode connection portion coupling the electrical signal to the relay substrate by wire is provided at the one end. A distance between a tip of one end of the signal electrode in the electrode connection portion and the end of the optical modulator chip is less than a distance between a tip of an end of the ground electrode in the electrode connection portion and the end of the optical modulator chip.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: October 9, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventors: Yasuhiro Ohmori, Yoshinobu Kubota, Masaharu Doi, Masaki Sugiyama
  • Publication number: 20180129083
    Abstract: An optical modulator includes a substrate having an electro-optic effect; a waveguide pattern provided on the substrate and configured to modulate light; and a dummy pattern having a predetermined potential along the waveguide pattern from an input side to an output side.
    Type: Application
    Filed: October 10, 2017
    Publication date: May 10, 2018
    Applicant: Fujitsu Optical Components Limited
    Inventors: Toyokazu SASAKI, Yoshihiko YOSHIDA, Yasuhiro OHMORI, Yoshinobu KUBOTA
  • Publication number: 20180081251
    Abstract: An optical modulator includes a substrate and an optical waveguide group. The optical waveguide group includes a pair of relay optical waveguides, a pair of first Mach-Zehnder type optical waveguides, and a pair of second Mach-Zehnder type optical waveguides. The pair of the first Mach-Zehnder type optical waveguides are connected to the pair of the relay optical waveguides and includes input ends arranged at positions that deviate from each other in a longitudinal direction of the substrate. The pair of the second Mach-Zehnder type optical waveguides are provided on a pair of branched waveguides of each of the first Mach-Zehnder type optical waveguides and includes input ends arranged at symmetric positions with respect to a straight line that passes through an input end serving as a branch point of the branched waveguides and that extends in the longitudinal direction of the substrate.
    Type: Application
    Filed: July 12, 2017
    Publication date: March 22, 2018
    Applicant: Fujitsu Optical Components Limited
    Inventors: Shintaro TAKEUCHI, YOSHIHIKO YOSHIDA, Yoshinobu Kubota, Masaharu Doi, Yasuhiro Ohmori
  • Publication number: 20180031945
    Abstract: An optical modulator includes an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and a relay substrate configured to relay and couple the electrical signal to the optical modulator chip. The optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal. One end of the optical modulator chip is arranged to face the relay substrate. An electrode connection portion coupling the electrical signal to the relay substrate by wire is provided at the one end. A distance between a tip of one end of the signal electrode in the electrode connection portion and the end of the optical modulator chip is less than a distance between a tip of an end of the ground electrode in the electrode connection portion and the end of the optical modulator chip.
    Type: Application
    Filed: July 14, 2017
    Publication date: February 1, 2018
    Applicant: Fujitsu Optical Components Limited
    Inventors: Yasuhiro OHMORI, Yoshinobu KUBOTA, Masaharu DOI, Masaki SUGIYAMA
  • Patent number: 8785772
    Abstract: A terminal box includes a box body having a bottom portion, a terminal portion fixed to the box body, a pressing portion, a holding portion and a slide mechanism The bottom portion has an opening portion capable of receiving a terminal inserted therein from the outside. The terminal portion is capable of establishing electric conduction between the terminal portion and the terminal upon contact therewith. The pressing portion is switchable between a contacting state in which the pressing portion clamps the terminal with the terminal portion for establishing electric conduction between the terminal portion and the terminal and a spaced state spaced apart from the terminal portion. The holding portion holds the pressing portion integrally and is slidable on the box body in the direction of movement of the pressing portion to/away from the terminal portion.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: July 22, 2014
    Assignee: Hosiden Corporation
    Inventors: Yasuhiro Ohmori, Toshiya Tanaka
  • Publication number: 20130265691
    Abstract: A terminal box for a solar cell module including a terminal box body having an inner bottom surface, a backflow check diode housed in the terminal box body , and a plurality of terminal blocks fixed to the inner bottom surface. The backflow check diode includes a diode body portion and a pair of leads extending in opposite directions from the diode body portion. The leads have bent portions at distal ends thereof, respectively. All the parts of the pair of leads lie in the same plane. Each of the terminal blocks has a connecting portion connected to each of the leads. The connecting portion of the terminal block for connecting each of the pair of leads is configured to attach each of the leads thereto to allow the plane to lie along the inner bottom surface.
    Type: Application
    Filed: September 27, 2012
    Publication date: October 10, 2013
    Applicant: HOSIDEN CORPORATION
    Inventor: Yasuhiro Ohmori
  • Publication number: 20130178083
    Abstract: A terminal box includes a box body having a bottom portion, a terminal portion fixed to the box body, a pressing portion, a holding portion and a slide mechanism The bottom portion has an opening portion capable of receiving a terminal inserted therein from the outside. The terminal portion is capable of establishing electric conduction between the terminal portion and the terminal upon contact therewith. The pressing portion is switchable between a contacting state in which the pressing portion clamps the terminal with the terminal portion for establishing electric conduction between the terminal portion and the terminal and a spaced state spaced apart from the terminal portion. The holding portion holds the pressing portion integrally and is slidable on the box body in the direction of movement of the pressing portion to/away from the terminal portion.
    Type: Application
    Filed: July 12, 2012
    Publication date: July 11, 2013
    Applicant: HOSIDEN CORPORATION
    Inventors: Yasuhiro OHMORI, Toshiya TANAKA
  • Patent number: 8011942
    Abstract: There is provided a connector that allows easy engagement even when visual judgment is not possible and that has superior durability as well. In a connector for connecting a first connecting cable connected to one end of a socket and a second connecting cable connected to one end of a plug, through engagement between the socket and the plug, the socket includes a cutout portion formed by cutting away at least one portion from one opening of a cylinder along the peripheral direction thereof, the cutout portion having a V-shape at its deepest portion, a first guiding portion projecting from at least one portion of the opening along the peripheral direction, the first guiding portion having a substantial V-shape at its leading end, and a retaining portion to be retained to a lateral face of the cylinder at the time of engagement with the plug, thus retaining this engagement.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: September 6, 2011
    Assignee: Hosiden Corporation
    Inventors: Yasuhiro Ohmori, Masahiko Nakamura
  • Patent number: 7976314
    Abstract: An adapter of the present invention is used to connect between a lead terminal of an electronic component and a contact of a connecting device. The adapter includes a first connecting part, adapted for electrical and mechanical connection to the lead terminal; a second connecting part, disposed at a spaced relation to the first connecting part in a length direction of the electronic component and connectable to the contact electrically and mechanically; and an elastically deforming part, provided between the first and second connecting parts and elastically deformable in accordance with thermal expansion deformation or thermal contraction deformation in the length direction of the electronic component.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: July 12, 2011
    Assignee: Hosiden Corporation
    Inventors: Yasuhiro Ohmori, Masahiko Nakamura
  • Patent number: 7787717
    Abstract: The present invention has an object to provide an optical device capable of leading out a light propagated through an optical waveguide to a desired substrate side face while maintaining the sufficient power of the light, within a range of limited substrate size. To this end, according to the optical device of the present invention, a groove is formed in the vicinity of an end portion on the optical output side of the optical waveguide, on the substrate on which the optical waveguide is formed, a side wall of the groove is used as a reflecting plane, the light output from the optical waveguide is reflected by the reflecting plane, and the reflected light is emitted from the desired substrate side face.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: August 31, 2010
    Assignee: Fujitsu Limited
    Inventors: Yasuhiro Ohmori, Shinji Maruyama, Tetsuo Ishizaka, Masaharu Doi
  • Publication number: 20100178789
    Abstract: There is provided a connector that allows easy engagement even when visual judgment is not possible and that has superior durability as well. In a connector for connecting a first connecting cable connected to one end of a socket and a second connecting cable connected to one end of a plug, through engagement between the socket and the plug, the socket includes a cutout portion formed by cutting away at least one portion from one opening of a cylinder along the peripheral direction thereof, the cutout portion having a V-shape at its deepest portion, a first guiding portion projecting from at least one portion of the opening along the peripheral direction, the first guiding portion having a substantial V-shape at its leading end, and a retaining portion to be retained to a lateral face of the cylinder at the time of engagement with the plug, thus retaining this engagement.
    Type: Application
    Filed: January 8, 2010
    Publication date: July 15, 2010
    Applicant: HOSIDEN CORPORATION
    Inventors: Yasuhiro Ohmori, Masahiko Nakamura
  • Patent number: 7675671
    Abstract: An aspect of the embodiment, a MEMS device includes a rotating unit, a first hinge, a first frame and an actuator. The actuator has a plurality of electrodes for rotating the rotating unit. The first frame has one of the electrodes. A portion of silicon layer by the electrode of the frame is chamfered.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: March 9, 2010
    Assignee: Fujitsu Limited
    Inventor: Yasuhiro Ohmori
  • Publication number: 20100055976
    Abstract: The present invention provides a connection structure of a circuit board and a connecting device of the present invention including: a connecting device electrically and mechanically connectable to an electronic component; and a circuit board having a surface to mount the connecting device thereon. The connecting device has a locking piece for attaching the connecting device to the surface of the circuit board. The circuit board has an elongated locking hole for receiving the locking piece. The locking piece is adapted to be locked at a lip of the locking hole by sliding or turning the locking piece in a predetermined direction inside the locking hole.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Applicant: HOSIDEN CORPORATION
    Inventors: Yasuhiro OHMORI, Masahiko NAKAMURA
  • Publication number: 20090156026
    Abstract: The present invention provides a contact for connection with an electronic component. The contact includes: a base part; a supporting part, provided on top of the base part for supporting a lead terminal of the electronic component; and at least two clamp parts, provided on top of the base part so as to be located on respective outer sides of the supporting part. The clamp parts are adapted to sandwich the lead terminal of the electronic component between themselves and the supporting part.
    Type: Application
    Filed: October 27, 2008
    Publication date: June 18, 2009
    Applicant: HOSIDEN CORPORATION
    Inventor: Yasuhiro OHMORI
  • Patent number: D638797
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: May 31, 2011
    Assignee: Hosiden Corporation
    Inventor: Yasuhiro Ohmori
  • Patent number: D639242
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: June 7, 2011
    Assignee: Hosiden Corporation
    Inventor: Yasuhiro Ohmori
  • Patent number: D647479
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: October 25, 2011
    Assignee: Hosiden Corporation
    Inventor: Yasuhiro Ohmori
  • Patent number: D647480
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: October 25, 2011
    Assignee: Hosiden Corporation
    Inventor: Yasuhiro Ohmori
  • Patent number: D647481
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: October 25, 2011
    Assignee: Hosiden Corporation
    Inventor: Yasuhiro Ohmori