Abstract: An imaging device includes a communication part that transmits an image data to an external display device, an outer barrel in which at least one lens is disposed, an imaging element, an image taking button, a power button, and a zoom switch, in which a circumferential surface part is provided at the outer barrel, in which the image taking button is disposed on a left side of the circumferential surface part, in which the power button is disposed at an upper side of the circumferential surface part, and in which the zoom switch is disposed at the circumferential surface part.

Abstract: An imaging device includes a communication part that transmits an image data to an external display device, an outer barrel, an imaging element, and first and second coupling parts that are configured to be coupled to an installation device which is attachable to and detachable from the display device. The first and second coupling parts are disposed at a rear surface part of the outer barrel, and a storage part that stores a battery is provided between the first coupling part and the second coupling part in the rear surface part of the outer barrel.

Abstract: An imaging unit includes an imaging device that transmits an image data to an external display device; and an installation portion that is attachable to and detachable from the display device. The imaging device includes a communication part that transmits an image data to the display device, an outer barrel, and an imaging element. The installation portion includes a slider that is slidable with respect to the outer barrel, a first attached body that is connected to the slider, a second attached body that can change its gap with the first attached body, and a biasing member that biases the first attached body and the second attached body in a direction in which a gap therebetween becomes narrowed, in which the display device is grasped by the first attached body and the second attached body.

Abstract: A semiconductor device includes: a lead frame; an IC element mounted on a main face of the lead frame; an inductor mounted on a back face of the lead frame; and a resin body configured to seal the lead frame, the IC element and the inductor, wherein the inductor and the lead frame are closely contacted with each other, wherein the IC element is disposed at a position corresponding to an center axis of the inductor, wherein the inductor and the IC element are electrically connected to each other, and wherein wiring of main current flowing through the IC element is disposed between terminals of the inductor.

Abstract: A semiconductor device of this disclosure includes: a circuit element mounted on a main face of a lead frame; an inductor mounted on a back face of the lead frame; and a resin body sealing the circuit element and the inductor; wherein the circuit element includes a thermo-sensitive element and has an overheating protection function of the inductor.

Abstract: An imaging apparatus includes an apparatus main body and an auxiliary recording medium unit. The apparatus main body includes a main-body-side recording and reproducing unit that houses a main recording medium and a mounting section in which a first main-body-side terminal section, to which an auxiliary recording medium unit that houses an auxiliary recording medium is connected, and a second main-body-side terminal section branched from a signal line identical with that of the main-body-side terminal section are provided. The auxiliary recording medium unit includes a unit-side recording and reproducing unit that houses an auxiliary recording medium, a unit-side terminal section connected to the first main-body-side terminal section, and an operation unit for operating the unit-side recording and reproducing unit. The auxiliary recording medium unit is detachably mountable on the mounting section.