Abstract: A catheter inserter for inserting a balloon catheter into an insertion opening of an endoscope provided with a valve. The balloon catheter includes a balloon attached on a distal end side of a shaft and configured to be expanded by an expansion fluid supplied from a proximal end side of the shaft, and an elastic band wound around an outer periphery of an intermediate portion of the balloon and configured to limit expansion of the balloon at the intermediate portion. The catheter inserter includes, on a distal end side thereof, a restrained member support structure configured to support a portion of an outer periphery of the elastic band. A proximal end support portion supporting a proximal end portion of the elastic band from a proximal end side is provided at a proximal end portion of the restrained member support structure.

Abstract: A curable resin composition for silicon-containing resist including a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group; and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less; and the curable resin composition for silicon-containing resist does not contain a solvent, and a viscosity is 20 cPs or less.

Abstract: A catheter according to an aspect of the present disclosure includes a shaft, an inflatable balloon attached to a distal end side of the shaft, and a covering member configured to cover an outer periphery of the balloon and to be elastically deformable in conformity with deflation of the balloon. When the balloon is inflated and then deflated, the covering member is deflated to a state before inflation by elastic deformation, in conformity with the deflation of the balloon. Thus, the maximum diameter of the balloon in the deflated state can be reduced.

Abstract: A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of ?490 kJ/mol or more, the average free energy of oxide formation being a sum of products (Ai×Bi) of a molar ratio (Ai) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (Bi kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (Cj×Dj) of a mass ratio (Cj) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (Dj° C.

Abstract: A guiding catheter includes: a shaft that includes a main lumen and a sub-lumen; a balloon attached to a distal end portion of the shaft; a distal end tip connected to a distal end side of the shaft; and a hub connected to a proximal end side of the shaft. The shaft is formed by layering: an inner layer that forms the main lumen; a first reinforcing layer formed on the inner layer; an intermediate layer formed on the first reinforcing layer and enclosing the sub-lumen; a second reinforcing layer formed on the intermediate layer; and an outer layer formed on the second reinforcing layer from a proximal end to a distal end.

Abstract: A membrane treatment apparatus (1) comprising: a plurality of flat membrane elements (2) which are immersed in a liquid to be treated, disposed side by side in the first direction so that membrane surfaces face each other; a supporting member (8) for holding the flat membrane element (2) provided at an end part of the flat membrane element on a first side in the second direction; and an aeration means (10) provided below the flat membrane element (2); wherein a lower edge of the flat membrane element (2) is formed to extend upward from the first side to a second side in the second direction, or to extend upward and horizontally from the first side to the second side in the second direction.

Abstract: A balloon catheter includes a shaft inserted into a body; a balloon attached to the shaft on a distal end side and is expandable by an expansion fluid supplied from a side of a proximal end of the shaft; an elastic band wound around an outer periphery of an intermediate portion between a distal end portion and a proximal end portion of the balloon , and is configured to limit expansion of the balloon at the intermediate portion; and a covering member covering an outer periphery of the elastic band. The balloon is expandable to a maximum expansion diameter from a folded state, in accordance with pressure of the expansion fluid, the elastic band is expandable beyond the secured diameter, by being elastically deformed by the balloon expanding, and the covering member is expandable by being elastically deformed by the balloon or the elastic band expanding.

Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.

Abstract: A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.

Abstract: A film mold according to the present embodiment includes a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition, and a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer.

Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

Abstract: A solder paste containing a solder powder and a flux, in which the flux contains a keto acid and a hydroxy group-containing compound different from the keto acid, and the keto acid has a melting point of 60° C. or lower, the hydroxy group-containing compound has a melting point of 60° C. or lower and has at least three hydroxy groups in the molecule, and a content of the keto acid, a content of the hydroxy group-containing compound and a content of the solder powder satisfy Expressions (1) and (2), W1×??W2?W1×???(1) (W1+W2)/W3×100?2.0??(2) where W1 represents a weight (g) of the keto acid, W2 represents a weight (g) of the hydroxy group-containing compound, and W3 represents a weight (g) of the solder powder.

Abstract: A membrane element includes a filtration membrane and a flowpath member joined thereto. The flowpath member is made of yarn arranged into a three-dimensional structure, and includes inner spaces through which a permeated liquid permeated through the filtration membrane flows, and an outer bonding surface joined to the filtration membrane. At least part of the yarn forming the outer bonding surface is a low-melting point yarn having a softening point lower than that of a material forming the filtration membrane, or the yarn forming the outer bonding surface is formed by twisting a plurality of constituent yarns, and at least one of the constituent yarns is a low-melting point yarn having a softening point lower than that of the material forming the filtration membrane.

Abstract: A film mold according to the present embodiment includes a first resin layer having a pattern region including a concavo-convex pattern and constituted by a resin composition, and a first glass substrate layer constituted by thin film glass and laminated on a surface on an opposite side to a surface on which the pattern region is formed in the first resin layer.

Abstract: There is provided a base station including a memory, a processor coupled to the memory and the processor configured to generate a distortion-compensated transmission signal, and a plurality of transmitters, a transmitter of the plurality of transmitters configured to include a first amplifier configured to amplify the distortion-compensated transmission signal so as to transmit the distortion-compensated transmission signal, and an attenuator configured to attenuate a feedback signal generated by splitting the distortion-compensated transmission signal amplified by the first amplifier so as to feed back the feedback signal to the processor, wherein the processor is further configured to perform distortion compensation according to a distortion compensation coefficient based on a power of the feedback signal.

Abstract: A wireless communication device includes an antenna, a DPDC, an amplifier, a coupler, and a bias output unit. The DPDC performs distortion compensation on a transmission signal based on a feedback signal. The amplifier amplifies the transmission signal subjected to the distortion compensation by the DPDC. The coupler splits the transmission signal amplified by the amplifier into a transmission signal output to the antenna and the feedback signal input to the DPDC. The DPDC measures an index based on a reflected wave obtained by reflection of the transmission signal split by the coupler from the antenna. The bias output unit applies a bias voltage for controlling an efficiency of an amplifier to the amplifier in accordance with the index measured by the DPDC.

Abstract: A wireless communication device includes an antenna, a DPDC, an amplifier, a coupler, and a bias output unit. The DPDC performs distortion compensation on a transmission signal based on a feedback signal. The amplifier amplifies the transmission signal subjected to the distortion compensation by the DPDC. The coupler splits the transmission signal amplified by the amplifier into a transmission signal output to the antenna and the feedback signal input to the DPDC. The DPDC measures an index based on a reflected wave obtained by reflection of the transmission signal split by the coupler from the antenna. The bias output unit applies a bias voltage for controlling an efficiency of an amplifier to the amplifier in accordance with the index measured by the DPDC.

Abstract: A wireless communication apparatus includes: a first amplifier configured to amplify an input signal; a second amplifier configured to amplify the input signal when an input level of the input signal is equal to or larger than a given level; an impedance converter configure to switch an load impedance of the first amplifier and output a composite output of an output from the first amplifier and an output from the second amplifier; an impedance controller section configured to control a switching of the load impedance of the first amplifier based on a bandwidth of the input signal; a distortion compensation section configured to perform distortion compensation of the input signal and supply a compensated input signal to the first amplifier and the second amplifier; and a filter section configured to limit a band of a signal output from the impedance converter.

Abstract: A wireless communication apparatus includes: a first amplifier configured to amplify an input signal; a second amplifier configured to amplify the input signal when an input level of the input signal is equal to or larger than a given level; an impedance converter configure to switch an load impedance of the first amplifier and output a composite output of an output from the first amplifier and an output from the second amplifier; an impedance controller section configured to control a switching of the load impedance of the first amplifier based on a bandwidth of the input signal; a distortion compensation section configured to perform distortion compensation of the input signal and supply a compensated input signal to the first amplifier and the second amplifier; and a filter section configured to limit a band of a signal output from the impedance converter.