Abstract: A connector device includes a connector housing including a plurality of terminal accommodating chambers, a plurality of terminals accommodated in the plurality of terminal accommodating chambers, and a plurality of electric wires configured to be welded to the respective one of the plurality of terminals. A laser radiation through hole is formed in side walls, each forming the terminal accommodating chambers, the laser radiation through hole being configured to allow the plurality of terminals and the plurality of electric wires to be welded with each other inside the terminal accommodating chambers, and the laser radiation through hole is configured to allow laser light emitted from a laser welding machine disposed outside the connector housing to enter one of the plurality of terminal accommodating chambers.

Abstract: Described herein is a technique capable of improving the controllability of firm thickness distribution. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber; a first and a second gas supply system; an exhaust system; and a controller for controlling the first and the second gas supply system and the exhaust system to form a film. The first gas supply system includes: a first and a second storage part; a first gas supply port for supplying a gas stored in the first storage part from an outer periphery toward a center of a substrate; and a second gas supply for supplying the gas stored in the second storage part from the outer periphery along a direction more inclined toward the outer periphery than a direction from the outer periphery toward the center of the substrate.

Abstract: The present disclosure relates to a micro or nano porous membrane composed of a stretched membrane of a fluororesin membrane, wherein the fluororesin membrane contains sintered bodies of a plurality of core-shell particles containing fluororesins, wherein the core-shell particles include cores and shells covering outer surfaces of the cores, wherein an average particle size of the core-shell particles before being sintered is greater than or equal to 100 nm and less than or equal to 1,000 nm, wherein a ratio of a volume of the shells to a volume of the cores in the core-shell particles before being sintered is greater than or equal to 2/98 and less than or equal to 50/50, wherein a fluororesin of the cores is a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer or a combination thereof, and a fluororesin of the shells is polytetrafluoroethylene, and wherein a first heat of fusion of the fluororesins in the core-shell particles is less than or equal to

Abstract: A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 ?m or greater but 3.0 ?m or less. A reduction ratio of the extrusion molding is 8 or less.

Abstract: Provided is a method of processing a substrate including: forming a film on the substrate by performing a cycle, multiple times, including non-simultaneously performing: (a) supplying a precursor gas and inert gas to the substrate; and (b) supplying a reaction gas to the substrate. In (a), at least one of the precursor and inert gas stored in first tank is supplied to the substrate, and at least one of the precursor and inert gas stored in second tank is supplied to the substrate. A concentration or amount of the precursor gas differs between the first and second tank. Further, in (a), the process chamber is filled with the inert gas before the precursor gas and the inert gas are supplied to the substrate.

Abstract: A dielectric sheet includes a polytetrafluoroethylene and spherical inorganic fillers, wherein a mass ratio of the inorganic fillers to the polytetrafluoroethylene is 1.3 or more, the inorganic fillers have an average particle diameter of 0.3 ?m to 4.0 ?m, and the inorganic fillers include a silica filler. Part of the polytetrafluoroethylene is present in the form of a plurality of fibrous bodies, and in a SEM image of a surface of the dielectric sheet after a 180-degree peel test, at least part of fibrous bodies among the plurality of fibrous bodies has areas with a thickness of 0.1 ?m to 3.0 ?m and a length of 50 ?m to 5000 ?m, and an average space between the areas of the at least part of fibrous bodies is 10 ?m or less.

Abstract: A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 ?m or greater but 3.0 ?m or less. A reduction ratio of the extrusion molding is 8 or less.

Abstract: The present disclosure relates to a micro or nano porous membrane composed of a stretched membrane of a fluororesin membrane, wherein the fluororesin membrane contains sintered bodies of a plurality of core-shell particles containing fluororesins, wherein the core-shell particles include cores and shells covering outer surfaces of the cores, wherein an average particle size of the core-shell particles before being sintered is greater than or equal to 100 nm and less than or equal to 1,000 nm, wherein a ratio of a volume of the shells to a volume of the cores in the core-shell particles before being sintered is greater than or equal to 2/98 and less than or equal to 50/50, wherein a fluororesin of the cores is a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer or a combination thereof, and a fluororesin of the shells is polytetrafluoroethylene, and wherein a first heat of fusion of the fluororesins in the core-shell particles is less than or equal to

Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.

Abstract: A coating device according to an aspect of the present invention includes a travel module that causes a strip-shaped sheet to travel in a longitudinal direction, a coating module that coats a surface of the strip-shaped sheet with ink while the strip-shaped sheet travels, and a supply module that supplies the ink to the coating module. The coating module includes a slot-type coating head that is disposed above the strip-shaped sheet so as to span the strip-shaped sheet in a width direction. The slot-type coating head includes an ink storage part that widens toward the strip-shaped sheet in cross-sectional view and an ink supply path that communicates with an upper part of the ink storage part.

Abstract: A redox flow cell membrane includes a porous membrane that has a mean flow pore size of not more than 100 nm, that has a thickness of not more than 500 ?m, and that has an air flow rate of not less than 0.1 ml/s·cm2. When the redox flow cell membrane is used for a V—V-based redox flow cell, the porous membrane preferably has a mean flow pore size of not more than 30 nm.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract: A redox flow cell membrane includes a porous membrane that has a mean flow pore size of not more than 100 nm, that has a thickness of not more than 500 ?m, and that has an air flow rate of not less than 0.1 ml/s·cm2. When the redox flow cell membrane is used for a V—V-based redox flow cell, the porous membrane preferably has a mean flow pore size of not more than 30 nm.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: A composite structure comprising two polytetrafluoroethylene porous layers and a framework structural member having a plurality of gaps or openings, the framework structural member being disposed between the two polytetrafluoroethylene porous layers, wherein the composite structure is structured such that the polytetrafluoroethylene porous layers are united together by being adhered with each other through the gaps or openings of the framework structural member and such that the respective polytetrafluoroethylene porous layers (A1) and (A2) are united with the framework structural member closely along the surfaces of the respective constituent elements of the framework structural member in such a manner as to wrap the respective elements. The method of manufacturing the composite structure is characterized in that it includes a step of applying pressure through a mass of fine particles.