Abstract: An exterior panel for attachment to a surface of a housing includes: a curved profile that includes an inner surface and an outer surface; and a plurality of projecting portions extending out of the inner surface of the exterior panel, where each of the projecting portions is configured to fit in corresponding attachment holes that is formed on the surface of the housing of the game device, and the plurality of projecting portions, when fit into the corresponding holes, provide a separation between the surface of the housing of the game device and the inner surface.

Abstract: An electronic apparatus (1) includes a cooling fan (5) configured to generate an airflow that cools a part mounted on a circuit board (50), a flow passage wall (34) defining a flow passage of the airflow fed from the cooling fan (5), and a dust collecting chamber Ds configured to capture dust in the airflow and store the captured dust, the dust collecting chamber Ds being provided to the flow passage wall (34). According to this, the amount of the dust fed to air supply targets such as a heat sink and a power supply unit together with air can be reduced.

Abstract: There is provided an electronic apparatus which improves an external appearance and which easily ensures the strength of an exterior member. In the electronic apparatus, an upper surface of an exterior panel (20A) has, on a peripheral portion of the upper surface, a first position (P1), a second position (P2) defined on an opposite side of a center (P0) of the upper surface from the first position (P1), a third position (P3), and a fourth position (P4) defined on an opposite side of the center (P0) of the upper surface from the third position (P3). A line (L1) that connects the first position (P1) and the second position (P2) to each other and is formed along the upper surface is a curve bulging to a lower side, and a line (L2) that connects the third position (P3) and the fourth position (P4) to each other and is formed along the upper surface is a curve bulging to an upper side.

Abstract: An exterior panel for attachment to a surface of a housing includes: a curved profile that includes an inner surface and an outer surface; and a plurality of projecting portions extending out of the inner surface of the exterior panel, where each of the projecting portions is configured to fit in corresponding attachment holes that is formed on the surface of the housing of the game device, and the plurality of projecting portions, when fit into the corresponding holes, provide a separation between the surface of the housing of the game device and the inner surface.

Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.

Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.

Abstract: An exterior panel for attachment to a surface of a housing includes: a curved profile that includes an inner surface and an outer surface; and a plurality of projecting portions extending out of the inner surface of the exterior panel, where each of the projecting portions is configured to fit in corresponding attachment holes that is formed on the surface of the housing of the game device, and the plurality of projecting portions, when fit into the corresponding holes, provide a separation between the surface of the housing of the game device and the inner surface.

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.

Abstract: Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).

Abstract: Not only cooling performance for an integrated circuit such as a CPU but also cooling performance for a power supply unit is improved. An electronic apparatus (1) includes a first heat sink (71) and a power supply unit (60) including a power supply unit case (61) having an intake air wall (61a) in which a plurality of air intake holes (61b) are formed. The intake air wall (61b) is located in front of the first heat sink (71). The intake air wall (61b) has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink (71). A cooling fan (5) is disposed to feed air toward the intake air wall (61a).

Abstract: An electronic apparatus (1) includes a cooling fan (5) configured to generate an airflow that cools a part mounted on a circuit board (50), a flow passage wall (34) defining a flow passage of the airflow fed from the cooling fan (5), and a dust collecting chamber Ds configured to capture dust in the airflow and store the captured dust, the dust collecting chamber Ds being provided to the flow passage wall (34). According to this, the amount of the dust fed to air supply targets such as a heat sink and a power supply unit together with air can be reduced.

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

Abstract: There is provided an electronic apparatus which improves an external appearance and which easily ensures the strength of an exterior member. In the electronic apparatus, an upper surface of an exterior panel (20A) has, on a peripheral portion of the upper surface, a first position (P1), a second position (P2) defined on an opposite side of a center (P0) of the upper surface from the first position (P1), a third position (P3), and a fourth position (P4) defined on an opposite side of the center (P0) of the upper surface from the third position (P3). A line (L1) that connects the first position (P1) and the second position (P2) to each other and is formed along the upper surface is a curve bulging to a lower side, and a line (L2) that connects the third position (P3) and the fourth position (P4) to each other and is formed along the upper surface is a curve bulging to an upper side.

Abstract: Buttons (41A, 41B) have a button moving part (42) disposed in front of a circuit board (51) and allowed to move in a front-back direction, and guided parts (42e) moving in conjunction with the button moving part (42). The buttons (41A, 41B) cause the button moving part (42) to operate a switch (52) of the circuit board (51). Guide parts (21E, 21F) are disposed along the guided parts (42e) and restrict the direction in which the button moving part (42) moves. The guide parts (21E, 21F) and the guided parts (42e) have portions located back of a front surface (51a) of the circuit board (51). This structure effectively prevents the buttons from tilting when they are operated.

Abstract: A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.

Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.

Abstract: Foreign matter is prevented from entering the inside of an electronic apparatus. An electronic apparatus (100) includes plural exhaust holes (E1, E2) formed in an armor member (20), an air flow path (S3) formed inside the armor member (20) and connected to the plural exhaust holes (E1, E2), a power source circuit (41) disposed in the air flow path (S3), and a foreign matter preventing member (70) located between the power source circuit (41) and the plural exhaust holes (E1, E2). The foreign matter preventing member (70) is formed with plural openings (Es). Each of the openings (Es) is smaller in size than each of the exhaust holes (E1, E2).

Abstract: Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).