Abstract: An inspection device according to an embodiment can conduct high temperature inspection and low temperature inspection on an object to be inspected. The inspection device includes an inspection chamber in which inspection is conducted on the object; a dry air supply section that is connected to the inspection chamber via a first valve and that is configured to supply dry air into the inspection chamber; a dew point meter that is connected to the inspection chamber via a second valve and that is configured to measure a dew point in the inspection chamber; and a bypass pipe connecting the dry air supply section and the dew point meter via a third valve.

Abstract: An inspection device according to an embodiment can conduct high temperature inspection and low temperature inspection on an object to be inspected. The inspection device includes an inspection chamber in which inspection is conducted on the object; a dry air supply section that is connected to the inspection chamber via a first valve and that is configured to supply dry air into the inspection chamber; a dew point meter that is connected to the inspection chamber via a second valve and that is configured to measure a dew point in the inspection chamber; and a bypass pipe connecting the dry air supply section and the dew point meter via a third valve.

Abstract: The present disclosure provides a probe apparatus that is capable of suppressing generation of a transfer error by adsorbing and holding a semiconductor wafer even in a case where the semiconductor wafer has been warped. The probe apparatus includes a measuring section and a loader section, that is, a transfer unit. The loader section is provided with a wafer cassette placed on a load port, a wafer transfer mechanism having a wafer transfer arm, and a gas ejection mechanism having a gas ejection nozzle. When the wafer transfer arm adsorbs and holds a warped semiconductor wafer in the wafer cassette, the gas ejection nozzle ejects a gas from a substantially central portion on the upper side of the semiconductor wafer toward the lower side, thereby reducing warpage of the semiconductor wafer.

Abstract: A transporting tool of this invention transports a cracked wafer between an unload table and a test position through fork, having a vacuum suction mechanism, and a main chuck. The transporting tool of this invention has a first groove formed in a first surface of the transporting tool, a first through hole which is formed to correspond to a first opening of the fork and is open to the first groove, a second groove formed in a second surface to correspond to an attracting groove of the main chuck, and a second through hole which allows the first groove and second groove to communicate with each other.

Abstract: A transporting tool of this invention transports a cracked wafer between an unload table and a test position through fork, having a vacuum suction mechanism, and a main chuck. The transporting tool of this invention has a first groove formed in a first surface of the transporting tool, a first through hole which is formed to correspond to a first opening of the fork and is open to the first groove, a second groove formed in a second surface to correspond to an attracting groove of the main chuck, and a second through hole which allows the first groove and second groove to communicate with each other.