Abstract: The invention provides a deinking method including a step of peeling off and removing, from a plastic substrate having an ink layer, the ink layer by using a deinking agent that contains (a) 20 mass % or more of a water-soluble solvent and (b) 0.1 mass % to 10 mass % of an inorganic base. According to the invention, it is possible to provide a deinking method that can easily peel off an ink layer printed on a plastic substrate, a deinking agent that can be used in the deinking method, and a plastic substrate recovery method using the same.

Abstract: A conductive ink composition for screen printing contains a conductive metal particle (A) having an oleic acid surfactant, a non-chlorine-based resin composition (B), and an organic solvent (C), wherein the conductive metal particle (A) is contained in an amount of 45 to 70% by weight with respect to the total ink composition, the non-chlorine-based resin composition (B) has a number average molecular weight of 50,000 or more and is contained in an amount of 5 to 15% by weight with respect to the total ink composition, the organic solvent (C) has a flash point of 75 to 110° C. and is contained in an amount of 25 to 50% by weight with respect to the total ink composition, and the ink composition has an ink viscosity of 10 to 25 Pa·s (23° C.) at a shear rate of 100 s?1.

Abstract: Provided is an ink film recovery method including detaching and removing, from a plastic substrate having an ink film, the ink film by using an ink cleaning agent containing water and at least one selected from an amphoteric surfactant and a cationic surfactant, and then recovering the detached ink film, an ink cleaning agent that can be applied to this ink film recovery method, and an ink film detaching method. Ink films printed on plastic substrates can be easily detached and the detached ink films can be easily recovered using an ink cleaning agent that contains water and at least one selected from an amphoteric surfactant and a cationic surfactant.

Abstract: Provided are a recycling system, a recycling method, and a laminate separation and recovery method, in which a wet crushing facility capable of crushing a laminate in water and separating the laminate simultaneously with the crushing. The recycling system according to the invention is a recycling system for recycling a plastic laminate having at least two or more layers into a recycled material, the recycling system including: a wet crushing facility configured to separate the laminate into single layers while crushing the laminate in water by performing pressure feeding simultaneously with crushing; and a facility configured to dispense and recover a crushed mixture of each of the separated single layers.

Abstract: Provided are a recycling method which can easily separate a plastic film laminate into individual single layers and recover the layers, a recycled plastic processing material which can be processed into a high-quality recycled plastic from a plastic film laminate, and a method for producing the recycled plastic processing material. A recycling method for a laminate, winch includes crushing a plastic film laminate having at least two layers in water or a cleaning agent simultaneously with conducting pumping so that the crushed material obtained by crushing the laminate has a surface roughness of 0.7 ?m or more.

Abstract: An electroplating method that is a conventional method has had a problem that it is difficult to manufacture fine pillars without being affected by an undercut. Furthermore, an electroless plating method has had a problem that it is difficult to manufacture pillars having the same shape without any void. The inventors have performed intensive investigations to solve the above problems and, as a result, have found that fine conductive pillars with a high aspect ratio can be readily manufactured on a substrate having an electrode section in such a manner that after a conductive paste containing metal micro-particles is applied in a reduced pressure state, the conductive paste is exposed to standard pressure. The present invention has a particular effect on the manufacture of a metal pillar that is a terminal for flip-chip mounting.

Abstract: A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20° C. to 90° C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

Abstract: A conductive ink composition for screen printing contains a conductive metal particle (A) having an oleic acid surfactant, a non-chlorine-based resin composition (B), and an organic solvent (C), wherein the conductive metal particle (A) is contained in an amount of 45 to 70% by weight with respect to the total ink composition, the non-chlorine-based resin composition (B) has a number average molecular weight of 50,000 or more and is contained in an amount of 5 to 15% by weight with respect to the total ink composition, the organic solvent (C) has a flash point of 75 to 110° C. and is contained in an amount of 25 to 50% by weight with respect to the total ink composition, and the ink composition has an ink viscosity of 10 to 25 Pa·s (23° C.) at a shear rate of 100 s?1.

Abstract: [Object] To provide a conductive ink composition which allows formation of a high resolution conductive pattern, and which can provide a high conductivity pattern by firing at a lower temperature and in a shorter time. [Solution] The aforementioned object is achieved by including a conductive filler, an epoxy compound, a blocked polyisocyanate in which a blocking agent is an active methylene compound and/or a pyrazole compound, a reaction catalyst for the blocked polyisocyanate, and an organic solvent as essential components. A conductive ink composition of the present invention can be fired at a lower temperature and in a shorter time and allows printing of a higher resolution conductive pattern.

Abstract: Provided is an organic electroluminescent lighting device which can be seen that the entire surface is uniformly illuminated from the side of a transparent electrode substrate even when an auxiliary electrode or an auxiliary wiring is provided with respect to the transparent electrode substrate. In an organic electroluminescent lighting device including a pair of electrode layers including a translucent electrode layer provided on a translucent substrate, at least one organic layer interposed between the pair of electrode layers and including a light-emitting layer, and an auxiliary electrode provided on the translucent electrode layer such that the auxiliary electrode comes in contact with a portion of the translucent electrode layer, the auxiliary electrode includes conductive metal particles having a particle diameter of 0.1 to 2 ?m, and is covered with an interlayer insulating coating film for suppressing the conduction with the organic layer.

Abstract: A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

Abstract: Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from the groove on the gravure plate to the blanket, and a step of transferring the printing paste from the blanket to a substrate. The groove on the gravure plate includes a region having a width of 100 to 700 ?m in a direction perpendicular to a print direction. The region has a leading end tapered forward in the print direction and a trailing end split into a pair of branches by a notch tapered forward in the print direction.

Abstract: Provided is an organic electroluminescent lighting device which can be seen that the entire surface is uniformly illuminated from the side of a transparent electrode substrate even when an auxiliary electrode or an auxiliary wiring is provided with respect to the transparent electrode substrate. In an organic electroluminescent lighting device including a pair of electrode layers including a translucent electrode layer provided on a translucent substrate, at least one organic layer interposed between the pair of electrode layers and including a light-emitting layer, and an auxiliary electrode provided on the translucent electrode layer such that the auxiliary electrode comes in contact with a portion of the translucent electrode layer, the auxiliary electrode includes conductive metal particles having a particle diameter of 0.1 to 2 ?m, and is covered with an interlayer insulating coating film for suppressing the conduction with the organic layer.

Abstract: Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from the groove on the gravure plate to the blanket, and a step of transferring the printing paste from the blanket to a substrate. The groove on the gravure plate includes a region having a width of 100 to 700 ?m in a direction perpendicular to a print direction. The region has a leading end tapered forward in the print direction and a trailing end split into a pair of branches by a notch tapered forward in the print direction.

Abstract: [Object] To provide a conductive ink composition which allows formation of a high resolution conductive pattern, and which can provide a high conductivity pattern by firing at a lower temperature and in a shorter time. [Solution] The aforementioned object is achieved by including a conductive filler, an epoxy compound, a blocked polyisocyanate in which a blocking agent is an active methylene compound and/or a pyrazole compound, a reaction catalyst for the blocked polyisocyanate, and an organic solvent as essential components. A conductive ink composition of the present invention can be fired at a lower temperature and in a shorter time and allows printing of a higher resolution conductive pattern.

Abstract: A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

Abstract: The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25° C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120° C. or lower (low boiling point solvent), and the surface energy of the ink at 25° C. is 10 to 21 mN/m.

Abstract: The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25° C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120° C. or lower (low boiling point solvent), and the surface energy of the ink at 25° C. is 10 to 21 mN/m.