Abstract: The motion guide device includes a track member in which a rolling member rolling surface is formed along a longitudinal direction thereof, a movable member which is reciprocally movable with a number of rolling members being interposed therebetween and which is provided with a loaded rolling member rolling surface constituting a loaded rolling member rolling path opposing to the rolling member rolling surface and a rolling member return path, and a lid member provided with a pair of direction changing paths for connecting both end portions of the loaded rolling member rolling path and the rolling member return path to thereby constitute an endless circulation path. Flange portions are formed to both end portions of the movable member in the reciprocally moving direction by means of insert molding, and the flange portions are provided with fitting portions formed to end portion sides of the movable member.

Abstract: A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×103 to 1×105 Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Abstract: A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×103 to 1×105 Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Abstract: The motion guide device includes a track member in which a rolling member rolling surface is formed along a longitudinal direction thereof, a movable member which is reciprocally movable with a number of rolling members being interposed therebetween and which is provided with a loaded rolling member rolling surface constituting a loaded rolling member rolling path opposing to the rolling member rolling surface and a rolling member return path, and a lid member provided with a pair of direction changing paths for connecting both end portions of the loaded rolling member rolling path and the rolling member return path to thereby constitute an endless circulation path. Flange portions are formed to both end portions of the movable member in the reciprocally moving direction by means of insert molding, and the flange portions are provided with fitting portions formed to end portion sides of the movable member.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

Abstract: A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

Abstract: A method for producing a solar cell module is disclosed in which, in a step of bonding a tab wire to a given solar cell via an electrically conductive adhesive film, it is possible to prevent that the connection strength of the electrically conductive adhesive film to another solar cell to be connected to the tab wire is lowered. In the method for producing a solar cell module, a front surface electrode (11) of a given solar cell (2) and a reverse surface electrode (13) of another solar cell (2) are interconnected by a tab wire (3) affixed to the front surface electrode (11) and the reverse surface electrode (13) via thermally curable electrically conductive adhesive films (15).

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

Abstract: A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

Abstract: An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 ?m, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 ?m. An average particle size of the conductive particles does not exceed 1.5 ?m. The conductive particles is contained in an amount of 10 to 60 mass % of the filler.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes recessed from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechanical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer, even if the passivation layer is made of a resin.

Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1) 0.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: An electrically connecting device and an electrical connecting method in which electrical connections can be positively realized via electrically conductive particles despite slight irregularities of objects to be eclectically connected to each other. The electrical connecting device 100 electrically connects an electrically connection portion 5 of the first object and the electrically connection portion 3 of the second object. The electrical connecting device 100 is made up of a first film-shaped adhesive layer 6 and a second film-shaped adhesive layer 9. The first film-shaped adhesive layer 6, arranged on the first object 4, is made up of plural electrically conductive particles 7 and a binder 8 containing the electrically conductive particles 7. The second film-shaped adhesive layer 9, arranged on the first film-shaped adhesive layer 6 containing the electrically conductive particles, is made up only of a fluid binder.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).