Abstract: A semiconductor device has inner leads (2a) of leads (2) which are covered with a first resin-encapsulating body (4), and has outer leads (2b) which are exposed from the first resin-encapsulating body (4), and which are given a shape bending downward and have distal ends having the bending shape extending in a lateral direction. The inner leads (2a) embedded in the first resin-encapsulating body (4) extend inward, and are then formed into a shape bending downward. Above end portions (3) having the bending shape, an element mounting portion (11) is formed of the first resin-encapsulating body (4), and a semiconductor element (6) placed on the element mounting portion (11) is covered with a second resin-encapsulating body (8).

Abstract: A mold is configured to resin-seal a semiconductor chip to form a semiconductor package. The mold has a first mold cavity and a second mold cavity formed in the bottom of the first mold cavity with a stepped portion between the two mold cavities. The two mold cavities are formed in succession by a high-speed rotary cutter having a downwardly tapered round cutting surface that imparts a corresponding taper to walls of the two mold cavities.

Abstract: A die pad is set down at a height lower than a height at which inner leads are provided and a level difference for the set-down becomes larger than a depth of a lower-mold cavity formed in a lower mold. The die pad is placed so that a back surface of the die pad is brought into contact with a lower-mold cavity bottom surface. The lead frame is clamped between the lower mold and an upper mold which has an upper-mold cavity and a suspension-lead relief groove formed to communicate with an end of an opening of the upper-mold cavity to achieve resin encapsulation.

Abstract: Provided is a resin-encapsulated semiconductor device in which heat dissipation characteristic and mounting strength to a substrate are improved. Heat dissipation outer leads connected to inner leads connected to the four corners of a die pad are exposed to the outside of an encapsulating resin to improve the heat dissipation characteristic. The ends of the heat dissipation outer leads are cut in lead frame pressing, and exterior plating films are formed on the entire surfaces of the heat dissipation outer leads including the ends in exterior plating of the resin-encapsulated semiconductor device, permitting easy formation of solder fillet when the semiconductor device is mounted on a substrate.

Abstract: Provided is a semiconductor device having a single inline package with high vibration resistance. External terminals (2a to 2c) are extracted from a resin encapsulation body (3) including a magnetic sensor and other semiconductor elements, a resin protruded portion is formed between the external terminal and the adjacent external terminal, and a gap is formed between the resin protruded portion and the external terminal. When the semiconductor device is mounted on a mounting substrate, the resin protruded portion is fixed on a surface of the mounting substrate, and the external terminal is bonded to a hole formed in the mounting substrate.

Abstract: Provided is a resin encapsulating mold by which deformation of tie bars of a lead frame is prevented during resin encapsulation. The resin encapsulating mold having a cavity by which a lead frame assembly having a semiconductor element is held and encapsulated with a resin to form a semiconductor device, includes protrusions (23) outside tie bar clamping portions (24a and 24b) formed around a cavity (22), to thereby prevent deformation of tie bars (2).

Abstract: A semiconductor device has inner leads (2a) of leads (2) which are covered with a first resin-encapsulating body (4), and has outer leads (2b) which are exposed from the first resin-encapsulating body (4), and which are given a shape bending downward and have distal ends having the bending shape extending in a lateral direction. The inner leads (2a) embedded in the first resin-encapsulating body (4) extend inward, and are then formed into a shape bending downward. Above end portions (3) having the bending shape, an element mounting portion (11) is formed of the first resin-encapsulating body (4), and a semiconductor element (6) placed on the element mounting portion (11) is covered with a second resin-encapsulating body (8).

Abstract: Provided is a manufacturing method for a semiconductor device using stamping press working which is capable of securing an island having substantially the same size as that of a related art even when a lead frame thickness is increased. A portion between the island and the inner lead is punched with a punch having a width of equal to or larger than a minimum required plate thickness for stamping press working. A periphery of the island is squeezed from an island back surface. A gap between the island and the inner lead is set to be smaller than a thickness of the lead frame, and at the same time, the thickness of the lead frame in the periphery of the island is set smaller than an original plate thickness of the lead frame, thereby obtaining a required area of the island.

Abstract: A die pad is set down at a height lower than a height at which inner leads are provided and a level difference for the set-down becomes larger than a depth of a lower-mold cavity formed in a lower mold. The die pad is placed so that a back surface of the die pad is brought into contact with a lower-mold cavity bottom surface. The lead frame is clamped between the lower mold and an upper mold which has an upper-mold cavity and a suspension-lead relief groove formed to communicate with an end of an opening of the upper-mold cavity to achieve resin encapsulation.

Abstract: A liquid ejection system of this invention includes a mechanism unit that can change the relative position of a medium relative to a liquid ejection head capable of ejecting a liquid, and a liquid storage container having a liquid storage portion capable of storing the liquid that is to be supplied to the liquid ejection head. A liquid injection portion that enables injection of the liquid into the liquid storage portion is provided in the liquid storage container. In an orientation in which the liquid injection portion faces a direction upward relative to the horizontal direction, in a plan view of the mechanism unit from vertically above, at least a portion of the liquid storage container excluding the liquid injection portion is overlapped with the region of the mechanism unit.

Abstract: A semiconductor device has a semiconductor chip mounted on an island of a lead frame and covered by an encapsulating resin. An outer lead extends from the encapsulating resin and is connected within the encapsulating resin to an inner lead connected to an inner lead suspension lead. A plated film is plated on the exposed surfaces of the outer lead that extend from the encapsulating resin to improve solder bonding strength of the semiconductor device onto a substrate.

Abstract: Provided is a semiconductor device having a single inline package with high vibration resistance. External terminals (2a to 2c) are extracted from a resin encapsulation body (3) including a magnetic sensor and other semiconductor elements, a resin protruded portion is formed between the external terminal and the adjacent external terminal, and a gap is formed between the resin protruded portion and the external terminal. When the semiconductor device is mounted on a mounting substrate, the resin protruded portion is fixed on a surface of the mounting substrate, and the external terminal is bonded to a hole formed in the mounting substrate.

Abstract: In the manufacture of a semiconductor device using a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead, an encapsulating resin is formed over the inner lead, part of the outer lead, and part of the inner lead suspension lead. The parts of the outer lead and the inner lead suspension lead that protrude from the resin are cut, and a plated film is formed on the portion of the cut outer lead that protrudes from the resin so that a solder layer is easily formed on all exposed surfaces of the outer lead. The inner lead suspension lead includes a narrowed portion that is smaller in cross-sectional area than other portions of the inner lead suspension lead, and an outline of the resin overlaps the narrowed portion of the inner lead suspension lead in plan view so as to suppress impact forces generated when the inner lead suspension lead is cut at the narrowed portion.

Abstract: Provided is a manufacturing method for a semiconductor device using stamping press working which is capable of securing an island having substantially the same size as that of a related art even when a lead frame thickness is increased. A portion between the island and the inner lead is punched with a punch having a width of equal to or larger than a minimum required plate thickness for stamping press working. A periphery of the island is squeezed from an island back surface. A gap between the island and the inner lead is set to be smaller than a thickness of the lead frame, and at the same time, the thickness of the lead frame in the periphery of the island is set smaller than an original plate thickness of the lead frame, thereby obtaining a required area of the island.

Abstract: A semiconductor device uses a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead. An encapsulating resin covers the inner lead and part of the outer lead, and a plated film is formed on an outer lead cut surface so that a solder layer is easily formed on all surfaces of the outer lead extending from the encapsulating resin. The inner lead suspension lead includes a narrowed portion that is smaller in cross-sectional area than other portions of the inner lead suspension lead to suppress impact forces generated when the inner lead suspension lead is cut.

Abstract: Provided is a resin-encapsulated semiconductor device in which heat dissipation characteristic and mounting strength to a substrate are improved. Heat dissipation outer leads connected to inner leads connected to the four corners of a die pad are exposed to the outside of an encapsulating resin to improve the heat dissipation characteristic. The ends of the heat dissipation outer leads are cut in lead frame pressing, and exterior plating films are formed on the entire surfaces of the heat dissipation outer leads including the ends in exterior plating of the resin-encapsulated semiconductor device, permitting easy formation of solder fillet when the semiconductor device is mounted on a substrate.

Abstract: A semiconductor device uses a lead frame, in which an outer lead is electrically connected to an inner lead suspension lead via an inner lead. An encapsulating resin covers the inner lead and part of the outer lead, and a plated film is formed on an outer lead cut surface so that a solder layer is easily formed on all surfaces of the outer lead extending from the encapsulating resin. The inner lead suspension lead includes a narrowed portion that is smaller in cross-sectional area than other portions of the inner lead suspension lead to suppress impact forces generated when the inner lead suspension lead is cut.

Abstract: A liquid ejection system of this invention includes a mechanism unit that can change the relative position of a medium relative to a liquid ejection head capable of ejecting a liquid, and a liquid storage container having a liquid storage portion capable of storing the liquid that is to be supplied to the liquid ejection head. A liquid injection portion that enables injection of the liquid into the liquid storage portion is provided in the liquid storage container. In an orientation in which the liquid injection portion faces a direction upward relative to the horizontal direction, in a plan view of the mechanism unit from vertically above, at least a portion of the liquid storage container excluding the liquid injection portion is overlapped with the region of the mechanism unit.

Abstract: Provided is a mold for resin sealing manufactured inexpensively. Processing for cavities for the mold is performed by high-speed rotary cutting with a round cutter to form a first cavity and a second cavity, to thereby obtain the cavities formed in a multi-level fashion.

Abstract: Provided is a semiconductor device using a lead frame, in which an outer lead (5) is electrically connected to an inner lead suspension lead (3) via an inner lead, and hence a plated film is also formed on an outer lead cut surface (11) so that a solder layer is easily formed on all of surfaces of the outer lead extending from an encapsulating resin (10). Further, the inner lead suspension lead (3) includes a first narrowed portion (12a), which can suppress impact to be generated when the inner lead suspension lead is cut.