Patents by Inventor Yasuhiro Takamori

Yasuhiro Takamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same
    Patent number: 7538439
    Abstract: A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed on the first semiconductor chip and is configured to integrate a power circuit to receive an external power supply and to supply an electric power to the first semiconductor chip based on the external power supply. The plastic mold seals together the first and second semiconductor chips on the substrate.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 26, 2009
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroshi Fujito, Yasuhiro Takamori
  • MULTI-CHIP SEMICONDUCTOR DEVICE WITH HIGH WITHSTAND VOLTAGE, AND A FABRICATION METHOD OF THE SAME
    Publication number: 20080246534
    Abstract: A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed on the first semiconductor chip and is configured to integrate a power circuit to receive an external power supply and to supply an electric power to the first semiconductor chip based on the external power supply. The plastic mold seals together the first and second semiconductor chips on the substrate.
    Type: Application
    Filed: June 5, 2008
    Publication date: October 9, 2008
    Applicant: Ricoh Company, Ltd.
    Inventors: Hiroshi Fujito, Yasuhiro Takamori
  • Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same
    Patent number: 7399660
    Abstract: A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed on the first semiconductor chip and is configured to integrate a power circuit to receive an external power supply and to supply an electric power to the first semiconductor chip based on the external power supply. The plastic mold seals together the first and second semiconductor chips on the substrate.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: July 15, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroshi Fujito, Yasuhiro Takamori
  • Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same
    Publication number: 20060220618
    Abstract: A multi-chip semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a plastic mold. The first semiconductor chip has a function for executing a predetermined electrical operation and is installed on the substrate. The second semiconductor chip is installed on the first semiconductor chip and is configured to integrate a power circuit to receive an external power supply and to supply an electric power to the first semiconductor chip based on the external power supply. The plastic mold seals together the first and second semiconductor chips on the substrate.
    Type: Application
    Filed: March 17, 2006
    Publication date: October 5, 2006
    Inventors: Hiroshi Fujito, Yasuhiro Takamori