Abstract: A V-belt (B) includes a rubber composition forming a portion (11) to be V-shaped side faces (110). Organic nanofibers (16) and organic short fibers (17) are included in the rubber composition, and oriented along a belt width. In the rubber composition, a ratio of a storage modulus in a grain direction to a storage modulus in cross-grain direction is 5 or greater.

Abstract: A friction transmission belt includes short fibers arranged so as to protrude from a surface of a pulley contact-side part made of a rubber composition. The short fibers consist of aramid short fibers and non-aramid synthetic short fibers having a standard moisture regain of equal to or less than 4%.

Abstract: A portion of a flat belt B, which serves as a belt inner peripheral surface, is made of a rubber composition. The rubber composition contains nanofibers of an organic fiber having a fiber diameter of 300 to 1000 nm.

Abstract: A V-belt (B) includes a rubber composition forming a portion (11) to be V-shaped side faces (110). Organic nanofibers (16) and organic short fibers (17) are included in the rubber composition, and oriented along a belt width. In the rubber composition, a ratio of a storage modulus in a grain direction to a storage modulus in cross-grain direction is 5 or greater.

Abstract: A friction transmission belt includes short fibers arranged so as to protrude from a surface of a pulley contact-side part made of a rubber composition. The short fibers consist of aramid short fibers and non-aramid synthetic short fibers having a standard moisture regain of equal to or less than 4%.

Abstract: Provided is a process for producing a cycloolefin resin composition, comprising a step of hydrogenating a resin composition. The resin composition before hydrogenation, which is used in the above step, includes 0.01 to 20 parts by weight of an unsaturated hydrocarbon compound having a boiling point of 50° C. or higher, for example, a monomer employed in polymerization, per 100 parts by weight of the resin composition.

Abstract: A semiconductor device in which overall thickness is reduced by suppressing the rising of a metal thin line and connection reliability is enhanced at the joint of metal thin line and other member during resin sealing. A method for manufacturing such semiconductor device is also provided. The semiconductor device (10A) comprises electrodes (12A, 12B, 12C), a semiconductor chip (13) bonded to the upper surface of the electrode (12A) formed in the shape of island, a metal thin line (15A) connecting the semiconductor chip (13) and the electrode (12C), a metal thin line (15B) connecting the semiconductor chip (13) and the electrode (12B), and a sealing resin (11) supporting those elements mechanically by sealing them integrally. The metal thin lines (15A, 15B) have planar shape curved convexly toward the upstream of the flow if the sealing resin (11) to be injected.

Abstract: Provided is a process for producing a cycloolefin resin composition, comprising a step of hydrogenating a resin composition. The resin composition before hydrogenation, which is used in the above step, includes 0.01 to 20 parts by weight of an unsaturated hydrocarbon compound having a boiling point of 50° C. or higher, for example, a monomer employed in polymerization, per 100 parts by weight of the resin composition.

Abstract: This invention provides remedies or prophylactics for diseases in association with chemokines such as MIP-1 ? and/or MCP-1. Namely, remedies or prophylactics for diseases in association with the chemokines such as rheumatoid arthritis or nephritis contain, as the active ingredient, cyclic amine derivatives represented by the following formula (I), pharmaceutically acceptable acid addition salts thereof or pharmaceutically acceptable C1-C6 alkyl addition salts thereof.

Abstract: A manufacturing method of a semiconductor apparatus, comprising the steps of: forming a plurality of leads corresponding to a plurality of semiconductor apparatuses on an electrically conductive sheet; disposing a plurality of semiconductor elements in predetermined positions of the electrically conductive sheet; connecting between a bonding pad of a semiconductor element and a lead by a bonding wire, the semiconductor element being included in the plurality of semiconductor elements and the lead being included in the plurality of leads; curving the bonding wire toward an upstream side of a flow path of resin flowing into a metal mold at a time of resin sealing; and resin-sealing the semiconductor element, the lead, and the bonding wire.

Abstract: It is an object of the present invention to provide a non-conjugated cyclic diene and a non-conjugated cyclic diene composition which enable the production of a polymer based on non-conjugated cyclic diene which makes it possible to produce a (co)polymer at a high degree of polymerization activity, and a method of producing a polymer based on non-conjugated cyclic diene which makes it possible to produce a (co)polymer at a high degree of polymerization activity. A non-conjugated cyclic diene is used which meets at least one of the following requirements: (1) it contains a compound having a seven-membered cyclic triene hydrocarbon structure in a specific amount or less and (2) it contains a conjugated polyene compound having an eight-membered bicyclic hydrocarbon structure in a specific amount.

Abstract: Compounds expressed by the following general formula (1), [wherein, R01 and R02 are each independently a hydrogen atom or a protecting group for a hydroxyl group; Z is one out of the following formulae (1-1), (1-2), (1-3), (1-4) and (1-5)]. The compounds can be used as active ingredients of treating agents for inflammatory respiratory diseases, malignant tumors, rheumatoid arthritis, osteoporosis, diabetes mellitus, hypertension, alopecia, acne, psoriasis, dermatitis, hypercalcemia, hypoparathyroidism and metabolic disorder of cartilage.

Abstract: It is an object of the present invention to provide a non-conjugated cyclic diene and a non-conjugated cyclic diene composition which enable the production of a polymer based on non-conjugated cyclic diene which makes it possible to produce a (co)polymer at a high degree of polymerization activity, and a method of producing a polymer based on non-conjugated cyclic diene which makes it possible to produce a (co)polymer at a high degree of polymerization activity. A non-conjugated cyclic diene is used which meets at least one of the following requirements: (1) it contains a compound having a seven-membered cyclic triene hydrocarbon structure in a specific amount or less and (2) it contains a conjugated polyene compound having an eight-membered bicyclic hydrocarbon structure in a specific amount.

Abstract: Compounds expressed by the following general formula (1), [wherein, R01 and R02 are each independently a hydrogen atom or a protecting group for a hydroxyl group; Z is one out of the following formulae (1-1) to (1-5)]. The compounds can be used as active ingredients of treating agents for inflammatory respiratory diseases, malignant tumors, rheumatoid arthritis, osteoporosis, diabetes mellitus, hypertension, alopecia, acne, psoriasis, dermatitis, hypercalcemia, hypoparathyroidism and metabolic disorder of cartilage.

Abstract: The present invention comprises a first main face (22a) on a surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered thereto. The semiconductor chip (29), etc. are sealed in the hollow portion that is constructed by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the transparent glass plate (36) are adhered by epoxy resin, or the like.

Abstract: The present invention comprises a first main face (22a) on the surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered onto the first main face (22a). The semiconductor chip (29), etc. are sealed in a hollow space made by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the glass plate (36) are adhered by the light-shielding adhesive resin made of epoxy resin. Accordingly, there can be provided the semiconductor device and a method of manufacturing the same, which can prevent the direct incidence of the light onto the semiconductor chip (29) and the degradation of the characteristic of the semiconductor chip (29) can be suppressed.

Abstract: Compounds expressed by the following general formula (1), [wherein, R01 and R02 are each independently a hydrogen atom or a protecting group for a hydroxyl group; Z is one out of the following formula (1-5)]. The compounds can be used as active ingredients of treating agents for inflammatory respiratory diseases, malignant tumors, rheumatoid arthritis, osteoporosis, diabetes mellitus, hypertension, alopecia, acne, psoriasis, dermatitis, hypercalcemia, hypoparathyroidism and metabolic disorder of cartilage.

Abstract: Disclosed are a fluorinating agent represented by the general formula (1): wherein R1 to R4 are a substituted or unsubstituted, saturated or unsaturated alkyl group or a substituted or unsubstituted aryl group, and can be the same or different; R1 and R2 or R3 and R4 can bond to form a ring including a nitrogen atom or a nitrogen atom and other hetero atoms; or R1 and R3 can bond to form a ring including a nitrogen atom or a nitrogen atom and other hetero atoms, for example: a preparation process of the fluorinating agent and a process for preparing fluorine compounds by reacting various compounds with the fluorinating agent. The invention has also disclosed that the fluorinating agent is very effective for fluorinating oxygen containing functional compounds.

Abstract: Compounds expressed by the following general formula (1), [wherein, R01 and R02 are each independently a hydrogen atom or a protecting group for a hydroxyl group; Z is one out of the following formulae (1-1) to (1-5)]. The compounds can be used as active ingredients of treating agents for inflammatory respiratory diseases, malignant tumors, rheumatoid arthritis, osteoporosis, diabetes mellitus, hypertension, alopecia, acne, psoriasis, dermatitis, hypercalcemia, hypoparathyroidism and metabolic disorder of cartilage.

Abstract: Compounds expressed by the following general formula (1), The compounds can be used as active ingredients of treating agents for inflammatory respiratory diseases, malignant tumors, rheumatoid arthritis, osteoporosis, diabetes mellitus, hypertension; alopecia, acne, psoriasis, dermatitis, hypercalcemia, hypoparathyroidism and metabolic disorder of cartilage.