Patents by Inventor Yasuhiro TSUGAWA

Yasuhiro TSUGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240183009
    Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, and Al: 0.4 mass % or more and 5.7 mass % or less, with a remainder being Cu and inevitable impurities, among the inevitable impurities, an amount of Fe is 0.0020 mass % or less, an amount of O is 0.0020 mass % or less, an amount of S is 0.0030 mass % or less, and an amount of P is 0.0010 mass % or less, a special grain boundary length ratio (L?/L) which is a ratio of a sum L? of lengths of grain boundaries with 3???29 to a length L of all measured crystal grain boundaries by an EBSD method is 20% or more, and an average crystal grain size ?A in a sheet-thickness central portion is 40 ?m or less.
    Type: Application
    Filed: February 8, 2022
    Publication date: June 6, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yosuke NAKASATO, Kazunari MAKI, Yasuhiro TSUGAWA, U TANI
  • Publication number: 20240124955
    Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size ? in a sheet-thickness central portion is 40 ?m or less.
    Type: Application
    Filed: February 8, 2022
    Publication date: April 18, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yosuke NAKASATO, Kazunari MAKI, Yasuhiro TSUGAWA, U TANI
  • Patent number: 10584400
    Abstract: This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: March 10, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yasuhiro Tsugawa, Toshio Sakamoto
  • Publication number: 20160122849
    Abstract: This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.
    Type: Application
    Filed: May 22, 2014
    Publication date: May 5, 2016
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yasuhiro TSUGAWA, Toshio SAKAMOTO