Patents by Inventor Yasuhiro Ueda

Yasuhiro Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140207117
    Abstract: A connector comprises a housing; a main flow path being configured such that fluid is flowable from a first tube through the main flow path into a second tube; and a connection terminal including a connection side space, the connection terminal being configured such that a third tube is connectable to the connection terminal and an auxiliary flow path of the third tube communicates with the main flow path via the connection side space. The main flow path includes a main flow path side space that is continuous with at least the connection side space and is defined by: a bottom part facing the connection side space and a pair of side parts extending from opposite sides of the bottom part toward the connection side space, and at least one wall surface configured to direct the fluid toward the connection side space and toward at least one of the side parts.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Yasuhiro UEDA, Yasunobu ZUSHI
  • Patent number: 8729650
    Abstract: A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: May 20, 2014
    Assignee: Sony Corporation
    Inventors: Kouichi Harada, Yasuhiro Ueda, Nobuhiko Umezu, Kazushi Wada, Yoshinori Toumiya, Takeshi Matsuda
  • Publication number: 20140021714
    Abstract: A connecter assembly includes a male connecter and a female connecter that are connected to each other. The male connecter includes a connecter main body; an engagement member including a support portion which fixedly supports the connecter main body, a plurality of claw portions, and a plurality of slit portions; and a lock member disposed outside the engagement member and including a plurality of ribs that are slidably insertable into each of the plurality of slit portions of the engagement member. The female connecter includes a main body portion including: a plurality of flange portions protruding in a radially outward direction so as to be engagable with each of the plurality of claw portions of the engagement member, and a plurality of non-flange portions that are disposed between the plurality of flange portions, and when compared to the flange portion, bulged in a radially outward direction.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 23, 2014
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Yasuhiro Ueda, Takashi Tsukada
  • Publication number: 20140018746
    Abstract: A medical stopcock includes a main body; and a cock. The main body includes: a tubular portion; an upstream port and a downstream port; and a bypass port provided between the upstream port and the downstream port. The cock includes: a cylindrical portion rotatably accommodated in the tubular portion of the main body; and a handle configured to allow rotation of the cylindrical portion. The cylindrical portion includes: a first flow path groove communicating with the upstream port and the bypass port when the cock is in a reference position, a second flow path groove communicating with the bypass port and the downstream port when the cock is in a reference position, at least one wall portion closing openings of the upstream port, the bypass port and the downstream port when the cock is rotated by a predetermined amount from the reference position.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 16, 2014
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Yasuhiro UEDA, Takashi Tsukada
  • Publication number: 20130237923
    Abstract: A connector of the present invention includes a housing and a valve, wherein the housing has a flow path and a pipe connecting port, and the valve is formed of an elastic material and is adapted to block the pipe connecting port. The valve has a substantially columnar deformable portion. The deformable portion has a top surface exposed from the pipe connecting port, a bottom surface opposite to the top surface, and a slit that extends from the top surface to the bottom surface. When the top surface is pressed by the pipe, the deformable portion of the valve will be displaced toward the flow path while elastically deforming, so that inner surfaces that define the slit will face the flow path, and the top surface will form an opening that communicates with the flow path.
    Type: Application
    Filed: September 27, 2011
    Publication date: September 12, 2013
    Applicant: TERUMO KABUSHIKI KAISHA
    Inventors: Yasuhiro Ueda, Yasunobu Zushi
  • Publication number: 20120270457
    Abstract: The object of the present invention is to provide an expandable or foamable resol-type phenolic resin forming material that gives a phenolic resin foamed material or article which is excellent in strength and improved in brittleness and which has a high pH as compared with conventional materials or articles and has an excellent anti-corrosion property against a contact member, and a phenolic resin foamed material or article having the above properties, obtained by foaming the same, which are a foamable resol type phenolic resin forming material comprising a liquid resol type phenolic resin, a blowing agent, a foam stabilizer, an additive and an acid curing agent, said blowing agent comprising an organic non-reactive blowing agent and said additive comprising a nitrogen-containing bridged cyclic compound, and a phenolic resin foamed material or article obtained by foaming this forming material.
    Type: Application
    Filed: July 9, 2012
    Publication date: October 25, 2012
    Applicant: ASAHI ORGANIC CHEMICALS INDUSTRY CO., LTD.
    Inventors: Hiroo TAKAHASHI, Toshiyuki KATO, Takashi NONAKA, Yasuhiro UEDA
  • Publication number: 20120235072
    Abstract: Provided is an electrolytic solution for an aluminum electrolytic capacitor, which shows a specific conductivity, a high sparking voltage, and a characteristic of causing only a slight expansion of the capacitor in the reflow process, each being comparable with conventional alkyl phosphate anions, and which has high reliability without causing a short circuit. Also provided is an aluminum electrolytic capacitor. The present invention is directed to an electrolytic solution for an aluminum electrolytic capacitor, comprising an electrolyte (C) comprising an alkyl phosphate anion (a) represented by the general formula (1)/(2) and an amidinium cation (b); a borate ester (H) which is obtained by reacting boric acid (d) with diethylne glycol (e) and a polyalkylene glycol (f) having a molecular weight of 130-350 and/or a polyalkylene glycol monoalkyl ether (g) having a molecular weight of 130-350, and which has a boron content of 5-14 wt %; and an organic solvent (J).
    Type: Application
    Filed: October 22, 2010
    Publication date: September 20, 2012
    Applicants: SANYO CHEMICAL INDUSTRIES, LTD., PANASONIC CORPORATION
    Inventors: Satoshi Nishitani, Yuichiro Tsubaki, Satoshi Yamashita, Yasuhiro Ueda
  • Patent number: 8253142
    Abstract: A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: August 28, 2012
    Assignee: Sony Corporation
    Inventors: Kouichi Harada, Yasuhiro Ueda, Nobuhiko Umezu, Kazushi Wada, Yoshinori Toumiya, Takeshi Matsuda
  • Publication number: 20120129419
    Abstract: After source lines have been grouped into a plurality of blocks including adjacent ones of the source lines, in a region outside a display region, at least one inspection bus line for inputting an inspection signal to pixels is formed in association with each of the blocks, and the source lines in each of the blocks are connected to the associated inspection bus line, thereby forming an inspection circuit including the inspection bus lines. Then, an inspection signal is supplied to the pixels from the inspection bus line through the source lines in each of the blocks in the inspection circuit, and a target pixel is compared with a plurality of comparative pixels arranged along one of the source lines along which the target pixel is located, with a gray-level display provided on the display region, thereby detecting a presence of a black point defect in the target pixel.
    Type: Application
    Filed: March 1, 2010
    Publication date: May 24, 2012
    Inventors: Naoki Yoshimoto, Naoki Matsumoto, Shota Ueki, Hidenobu Nakanishi, Yasuhiro Ueda
  • Publication number: 20110162689
    Abstract: It is an object to provide a solar cell module achieving reduced improper wiring and improved working efficiency.
    Type: Application
    Filed: September 2, 2009
    Publication date: July 7, 2011
    Applicant: KANEKA CORPORATION
    Inventors: Yasuhiro Ueda, Takeharu Yamawaki, Kensuke Ishida, Takeharu Nakajima, Tadashi Obayashi
  • Publication number: 20110162301
    Abstract: It is an object to provide a solar cell module having a uniform configuration, presenting stable output characteristics, and having a size enabling easy wiring in arrangement and a solar cell array presenting stable output characteristics by employment of said solar cell modules. A solar cell module 10 has a solar cell panel 12 having a length of its longer edges of 900 to 1100 mm. The solar cell panel 12 is constituted by a number of unit solar cells 100 connected in series and has an open-circuit voltage of 100 to 180 volts. The unit solar cell 100 is of a strip-like shape with a length of its shorter edges of 7 to 12 mm and arranged in a longer-edge direction of the panel 12 so that its longer edges extend in a shorter-edge direction of the panel 12 and its shorter edges extend in the longer-edge direction of the panel 12.
    Type: Application
    Filed: September 2, 2009
    Publication date: July 7, 2011
    Applicant: Keneka Corporation
    Inventors: Yasuhiro Ueda, Takeharu Yamawaki, Kensuke Ishida, Takeharu Nakajima, Tadashi Obayashi
  • Patent number: 7668760
    Abstract: A distribution management device, a distribution management method, a program storage medium and a distribution management system are disclosed. The client order data of the merchandise 4 of the sales channel utilized the internet 3 and the store order data of the merchandise 4 for the quantity sold of the sales channels excluding the Internet 3 are received by the sales managing server 20 via the internet 3. The stock of merchandise 4 is controlled by the settlement/delivery instructing server 21 based on the client and store order data. The actual sales condition of merchandise in each sales channel is grasped by the shipment control server 55 based on the storage data and the delivery condition data obtained from the client and store order data and the storage data and delivery condition data obtained from the settlement/delivery instructing server 21, and the supply of merchandise 4 to the manufacturing factory will be instructed based on the actual sales condition.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: February 23, 2010
    Assignee: Sony Corporation
    Inventors: Kunimasa Suzuki, Yukari Takehira, Yasuhiro Ueda, Shigeaki Arai, Michiko Sekikawa, Lisa Naomi Schlais, Takashi Yamazaki, Tsuyoshi Maeda, Noriko Ishii, Kentaro Tanigaki, Hirokazu Takahashi, Futaba Shinohara
  • Patent number: 7589773
    Abstract: A solid-state image sensor device having an image sensing portion performing the photoelectric conversion and being able to correspond to both progressive mode in which all picture element signals obtained by the scanning of one time are output independently, and interlaced mode in which a plurality of interlaced scannings are performed and the picture element signals obtained by respective interlaced scannings are superposed, comprises a substrate-bias generation circuit for applying a bias voltage to the substrate of the image sensing portion, and for controlling the value of the bias voltage in the progressive mode to be smaller in comparison with that in the interlaced mode.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: September 15, 2009
    Assignee: Sony Corporation
    Inventors: Takeshi Ide, Yasuhiro Ueda
  • Publication number: 20090047852
    Abstract: The object of the present invention is to provide an expandable or foamable resol-type phenolic resin forming material that gives a phenolic resin foamed material or article which is excellent in strength and improved in brittleness and which has a high pH as compared with conventional materials or articles and has an excellent anti-corrosion property against a contact member, and a phenolic resin foamed material or article having the above properties, obtained by foaming the same, which are a foamable resol type phenolic resin forming material comprising a liquid resol type phenolic resin, a blowing agent, a foam stabilizer, an additive and an acid curing agent, said blowing agent comprising an organic non-reactive blowing agent and said additive comprising a nitrogen-containing bridged cyclic compound, and a phenolic resin foamed material or article obtained by foaming this forming material.
    Type: Application
    Filed: May 31, 2006
    Publication date: February 19, 2009
    Inventors: Hiroo Takahashi, Toshiyuki Kato, Takashi Nonaka, Yasuhiro Ueda
  • Publication number: 20090024275
    Abstract: An improvement in the fit and finish of a center stack or console area of a vehicle is provided by integrating individual electronic module faceplate and trim bezels into a single faceplate which may be positioned independent of the individual modules. A jumper or flat wire connector provides communication between the controls on the faceplate and the module. A molded alignment guide is provided to direct pass-through media through a slot in the faceplate and into the module.
    Type: Application
    Filed: February 12, 2007
    Publication date: January 22, 2009
    Applicant: COLLINS & AIKMAN PRODUCTS CO.
    Inventors: Marc A. HAYES, Yasuhiro UEDA, R. Reid SIGETY
  • Publication number: 20080315340
    Abstract: A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.
    Type: Application
    Filed: April 14, 2008
    Publication date: December 25, 2008
    Applicant: Sony Corporation
    Inventors: Kouichi Harada, Yasuhiro Ueda, Nobuhiko Umezu, Kazushi Wada, Yoshinori Toumiya, Takeshi Matsuda
  • Publication number: 20080068481
    Abstract: A solid-state image sensor device having an image sensing portion performing the photoelectric conversion and being able to correspond to both progressive mode in which all picture element signals obtained by the scanning of one time are output independently, and interlaced mode in which a plurality of interlaced scannings are performed and the picture element signals obtained by respective interlaced scannings are superposed, comprises a substrate-bias generation circuit for applying a bias voltage to the substrate of the image sensing portion, and for controlling the value of the bias voltage in the progressive mode to be smaller in comparison with that in the interlaced mode.
    Type: Application
    Filed: October 22, 2007
    Publication date: March 20, 2008
    Inventors: Takeshi Ide, Yasuhiro Ueda
  • Patent number: 7341403
    Abstract: The object is to provide a construction method of an information-communicable underground pipe whereby communication cables can be readily laid in an underground pipeline having a main pipe and branch pipes branched therefrom thereby allowing the underground pipeline to be used as an information-communicable underground pipe, and to provide a construction structure and a construction member therefor.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: March 11, 2008
    Assignees: Sanki Engineering Co., Ltd., Ashimori Industry Co., Ltd., Ashimori Engineering Co., Ltd.
    Inventors: Fumiaki Tsuchiya, Isaburo Yagi, Masaru Yamakawa, Yasuhiro Ueda, Osamu Ishizuka, Koji Aso, Yukikazu Maemoto, Takaaki Hirokawa, Hirofumi Nakatsuka
  • Patent number: 7315328
    Abstract: A solid-state image sensor device having an image sensing portion performing the photoelectric conversion and being able to correspond to both progressive mode in which all picture element signals obtained by the scanning of one time are output independently, and interlaced mode in which a plurality of interlaced scannings are performed and the picture element signals obtained by respective interlaced scannings are superposed, comprises a substrate-bias generation circuit for applying a bias voltage to the substrate of the image sensing portion, and for controlling the value of the bias voltage in the progressive mode to be smaller in comparison with that in the interlaced mode.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: January 1, 2008
    Assignee: Sony Corporation
    Inventors: Takeshi Ide, Yasuhiro Ueda
  • Patent number: RE42074
    Abstract: A method of manufacturing a light emitting device, including the steps of: forming an active layer composed of a compound semiconductor containing indium by a vapor phase growth method; and forming a cap layer composed of a compound semiconductor on said active layer by a vapor phase growth method at a growth temperature approximately equal to or lower than a growth temperature for said active layer.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: January 25, 2011
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tatsuya Kunisato, Takashi Kano, Yasuhiro Ueda, Yasuhiko Matsushita, Katsumi Yagi