Abstract: Disclosed is a cathode plate for a secondary battery, which includes a collector, and a cathode active material layer, wherein the cathode active material layer is formed of multiple layers of coating films formed on a surface of the collector and obtained by application and drying of an aqueous paste, which is obtained by kneading and dispersing an iron lithium phosphate material having an olivine structure as the cathode active material, an electroconductive material, a water-soluble thickner, a binder, and water as a dispersion medium.

Abstract: The present invention is intended for providing a porous film having excellent film uniformity, and is capable to contribute for improving cyclic and rate properties, which is provided on a surface of electrode used for a secondary battery and the like. The porous film of the present invention is characterized by including water soluble polymer having an average polymerization degree of 500 to 2500, an inorganic filler and water soluble particulate polymer. In the present invention particularly, it is preferable that said water soluble polymer is thickening polysaccharides, further said water-insoluble polymer is preferably selected from the group consisting of semisynthetic cellulose polymer, sodium salt and ammonium salt thereof.

Abstract: Disclosed is a binder composition for a nonaqueous electrolyte secondary battery electrode including an antioxidizing agent, able to inhibit the thickening of an electrode slurry. The binder composition enables to form electrode slurry without making the antioxidizing agent adhere to the insides of fine pores of electrode active materials after coating and drying. The binder composition for a nonaqueous electrolyte secondary battery electrode contains a binder and an emulsified antioxidizing agent, and particularly, it is preferable that the binder is an aqueous binder including a diene-based polymer and that the antioxidizing agent is a polymeric phenol compound.

Abstract: The present invention aims at improving binding continuity, rate property, cycle property and short circuit ratio by lowering a inner resistance of electrode in a secondary battery. A binder for secondary battery electrode according to the present invention is comprised a polymer having weight-average molecular weight of 5000 to 2500000 formed by polymerizing a monomer composition including fluorine atom containing monomer represented by following formula (I). (R1 is hydrogen or methyl group, R2 is hydrocarbon group having carbon number 6 to 18 containing fluorine atom).

Abstract: The present invention aims at providing slurry for electrodes having advantageous homogeneity and stability, an electrode having advantageous homogeneous thickness and density, and further, a nonaqueous electrolyte secondary battery having small variability in battery properties. In the present invention, slurry for electrodes is produced by using the binder composition used for manufacturing a nonaqueous electrolyte secondary battery wherein polymers for binding active materials are dissolved or dispersed in organic solvent or water, and a total sum of content ratios of monomer and oligomer is 300 ppm or less.

Abstract: The present invention aims at providing an electrode giving a nonaqueous electrolyte secondary battery showing small variability in battery properties, and a nonaqueous electrolyte secondary battery using the same. The nonaqueous electrolyte secondary battery electrode according to the present invention comprises an electrode material mixture comprising an active material and a polymer, the active material being capable of reversibly inserting and releasing a lithium ion by discharge and charge, and a collector. In the present invention, the stress relaxation rate (1??10/?0)×100(%) of said polymer is 50 to 80% and the thickness change rate of the electrode material mixture is ?3 to 10% when immersing in an electrolyte at 60° C. for 72 hours.

Abstract: A curable resin composition layer (3) containing an insulating resin and a curing agent is formed on the surface of an inner layer board having an electrical insulating layer (1) with a conductor circuit (2) formed on the surface, so as to cover said conductor circuit. A compound (4) having a structure capable of coordinating to metal atoms or metal ions is brought into contact with the surface of the curable resin composition layer. An electrical insulating layer (7) is formed by curing the curable resin composition layer. A metallic thin film layer (8) is formed on the surface of the electrical insulating layer. A conductor circuit (9) is formed on the surface of the electrical insulating layer utilizing the metallic thin film layer. A multilayer circuit board is manufactured through these steps.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated with at least one surface treatment agent selected from the group consisting of a phosphorus compound soluble in an organic solvent, an organosilicon compound and a dispersant having a carboxyl group. A formed material is obtained by applying and drying the varnish on a substrate. A multilayer structure is obtained by forming on a substrate having a conductor circuit layer an electrical insulation layer obtained by curing the formed material obtained from the varnish.

Abstract: A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core (1) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.

Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 ?m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: To provide a resin composite film which is assured of high insulating performance and excellent mechanical properties, to allow for bending, and gives a flexible printed circuit excellent in the adhesive property. A resin composite film comprising a resin A layer having formed on at least one surface thereof a resin B layer, wherein the thickness of the resin B layer is from 0.1 to 4 ?m and the resin B layer comprises an insulating material capable of giving a film having a thickness of 10 ?m and a water absorptivity of 0.03 to 0.25%. When a metal layer is formed on the resin B layer surface of this resin composite film, a metal-resin composite film is obtained.

Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.

Abstract: The invention provides a varnish that contains an insulting resin, a curing agent, a flame retardant, and an organic solvent. The flame retardant comprises flame retardant particles surface treated with at least one surface treatment agent selected from the group consisting of a phosphorus compound soluble in an organic solvent, an organosilicon compound and a dispersant having a carboxyl group. A formed material is obtained by applying and drying the varnish on a substrate. A multilayer structure is obtained by forming on a substrate having a conductor circuit layer an electrical insulation layer obtained by curing the formed material obtained from the varnish.

Abstract: Disclosed is a partial plating process for forming a patterned plating layer on a surface of a resin substrate. The partial plating process of the present invention comprises the following steps: subjecting the surface of the resin substrate to oxidation treatment, causing a compound, which has a structure capable of coordination to a metal atom or metal ion, to adhere in a pattered form on the oxidation-treated surface to form an initiator pattern, forming a plating layer on the initiator pattern by electroless plating, and allowing the plating layer to grow to a desired thickness, as needed. This invention also relates to partially plated resin substrates obtained by the process, and to a process for manufacturing multilayered circuit boards by using the partial plating process.

Abstract: A curable resin composition layer (3) containing an insulating resin and a curing agent is formed on the surface of an inner layer board having an electrical insulating layer (1) with a conductor circuit (2) formed on the surface, so as to cover said conductor circuit. A compound (4) having a structure capable of coordinating to metal atoms or metal ions is brought into contact with the surface of the curable resin composition layer. An electrical insulating layer (7) is formed by curing the curable resin composition layer. A metallic thin film layer (8) is formed on the surface of the electrical insulating layer. A conductor circuit (9) is formed on the surface of the electrical insulating layer utilizing the metallic thin film layer. A multilayer circuit board is manufactured through these steps.

Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 &mgr;m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.

Abstract: An alicyclic structure-containing resin composition comprising an alicyclic structure-containing resin (A) having a polar group in a proportion of 3 to 50 mol % based on the whole repeating unit in the resin, and a soft polymer (B), a varnish containing the resin composition, a sheet formed of the resin composition, and an insulating film formed of the resin composition.