Patents by Inventor Yasuhiro Yamaji

Yasuhiro Yamaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having an improved lead arrangement and method for manufacturing the same
    Patent number: 5198883
    Abstract: First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.
    Type: Grant
    Filed: July 19, 1989
    Date of Patent: March 30, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Takahashi, Yasuhiro Yamaji, Susumu Harada, Kazuichi Komenaka, Mitsugu Miyamoto, Masashi Muromachi, Hiroshi Harada, Kazuo Numajiri, Haruyuki Shimakawa, Toshiharu Sakurai
  • Semiconductor device
    Patent number: 4855807
    Abstract: This invention provides a semiconductor device comprising a die-pad supported by tie-bars, a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in a moulding compound, means for defining an aperture which extends in to the moulding compound so as to expose a portion of a tie-bar.
    Type: Grant
    Filed: December 18, 1987
    Date of Patent: August 8, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuhiro Yamaji, Kenji Takahashi, Seiichi Hirata, Toshiharu Sakurai