Patents by Inventor Yasuhiro Yoshii

Yasuhiro Yoshii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POSITIVE RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY AND METHOD FOR FORMING RESIST PATTERN
    Publication number: 20080090171
    Abstract: Provided are a positive resist composition for immersion lithography, and a method for forming a resist pattern using the same, wherein the positive resist composition comprises a resin component (A) that increases its alkali solubility under action of an acid, an acid generator component (B) that generates an acid upon exposure, and a resin component (C) containing a constituent unit (c1) represented by the following Chemical Formula 1: wherein R1 is a hydrogen atom or a methyl group; R2 and R3 are each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; n is an integer of 0 to 3; and Z is an aliphatic cyclic group having 4 to 12 carbon atoms, having a fluorine atom and/or a fluorinated alkyl group as a substituent.
    Type: Application
    Filed: October 12, 2007
    Publication date: April 17, 2008
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Makiko Irie, Yasuhiro Yoshii
  • Adhesive composition and adhesive sheet for semiconductor devices
    Patent number: 6617021
    Abstract: An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: September 9, 2003
    Assignee: Tomoegawa Paper Co., Inc.
    Inventors: Masaharu Kobayashi, Osamu Oka, Yasuhiro Yoshii
  • Adhesive composition and adhesive sheet for semiconductor devices
    Publication number: 20020155286
    Abstract: An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.
    Type: Application
    Filed: February 11, 2002
    Publication date: October 24, 2002
    Inventors: Masaharu Kobayashi, Osamu Oka, Yasuhiro Yoshii
  • Semiconductor memory device
    Patent number: 5383162
    Abstract: A non-volatile memory element comprising a control gate formed by a diffusion layer, a floating gate comprising a conductive layer, the floating gate being partly overlapping with the control gate through a thin insulating layer, and a barrier layer formed to cover a part or the entire part of the floating gate is used as a defect remedy circuit for the memory circuit having read-only memory elements arranged in the form of a matrix for storing defective addresses corresponding to the word lines and bit lines and storing data corresponding thereto respectively.
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: January 17, 1995
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Masaki Shirai, Hisahiro Moriuchi, Yasuhiro Yoshii, Kenichi Kuroda, Akinori Matsuo