Patents by Inventor Yasuhisa Ichihashi

Yasuhisa Ichihashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive element, resist pattern formation method and printed wiring board production method
    Patent number: 7622243
    Abstract: The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (?m), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5?R?79.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: November 24, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takashi Kumaki, Masahiro Miyasaka, Yasuhisa Ichihashi, Toshiki Ito, Makoto Kaji
  • Photosensitive element, resist pattern formation method and printed wiring board production method
    Publication number: 20070105036
    Abstract: The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (?m), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R1 to R8 represent a hydrogen atom, halogen atom or hydrocarbon group. 25.5?R?79.
    Type: Application
    Filed: September 17, 2004
    Publication date: May 10, 2007
    Inventors: Takashi Kumaki, Masahiro Miyasaka, Yasuhisa Ichihashi, Toshiki Ito, Makoto Kaji