Patents by Inventor Yasuhisa Kayaba

Yasuhisa Kayaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200347265
    Abstract: Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).
    Type: Application
    Filed: July 15, 2020
    Publication date: November 5, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Koji INOUE
  • Patent number: 10759964
    Abstract: A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: September 1, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Hirofumi Tanaka, Hiroko Wachi, Shoko Ono
  • Patent number: 10752805
    Abstract: Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: August 25, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Hirofumi Tanaka, Koji Inoue
  • Publication number: 20200168476
    Abstract: This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 28, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kaichiro HARUTA, Yasuhisa KAYABA, Kazuo KOHMURA, Yoichi KODAMA
  • Publication number: 20200166835
    Abstract: A method of producing a substrate with a fine uneven pattern is a method of producing a substrate having a fine uneven pattern on a surface thereof, the method including a step (a) of preparing a laminate provided with a substrate and a first resin layer provided on the substrate and having a first fine uneven pattern formed on a surface thereof; and a step (b) of forming a second fine uneven pattern corresponding to the first fine uneven pattern on the surface of the substrate by etching the surface of the first fine uneven pattern using the first resin layer as a mask, in which the first resin layer is formed of a resin composition (P) including a fluorine-containing cyclic olefin polymer (A) or a cured product of the resin composition (P).
    Type: Application
    Filed: June 5, 2018
    Publication date: May 28, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Takashi ODA, Hisanori OHKITA, Yasuhisa KAYABA
  • Patent number: 10580639
    Abstract: The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 3, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Hirofumi Tanaka, Shoko Ono, Koji Inoue, Hiroko Wachi, Tsuneji Suzuki
  • Publication number: 20200048515
    Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.
    Type: Application
    Filed: April 24, 2018
    Publication date: February 13, 2020
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Jun KAMADA, Kazuo KOHMURA, Yasuhisa KAYABA
  • Publication number: 20190187560
    Abstract: A composition for forming a metal-containing film, the composition including: a compound (A) which is at least one selected from the group consisting of: a compound (a1) containing a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom, and a compound (a2) which is a compound other than the compound (a1) and which contains a nitrogen atom; and a compound (B) which is at least one selected from the group consisting of: a compound (b1) containing a carboxy group and at least one of a germanium atom, a tin atom, a selenium atom or a zirconium atom, and an ester of the compound (b1).
    Type: Application
    Filed: May 19, 2017
    Publication date: June 20, 2019
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA
  • Publication number: 20180334588
    Abstract: Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).
    Type: Application
    Filed: November 16, 2016
    Publication date: November 22, 2018
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Koji INOUE
  • Publication number: 20180327547
    Abstract: A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
    Type: Application
    Filed: November 16, 2016
    Publication date: November 15, 2018
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Hiroko WACHI, Shoko ONO
  • Patent number: 10043677
    Abstract: A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: August 7, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Hirofumi Tanaka, Yasuhisa Kayaba, Hiroko Wachi, Koji Inoue, Shoko Ono
  • Patent number: 10020238
    Abstract: Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition<the isoelectric point of a surface of the member A; and an application process of applying the composition to the surface of the member A and the surface of the member B included in the composite member.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: July 10, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Shoko Ono, Hirofumi Tanaka, Tsuneji Suzuki, Shigeru Mio, Kazuo Kohmura
  • Publication number: 20180076047
    Abstract: A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.
    Type: Application
    Filed: March 24, 2016
    Publication date: March 15, 2018
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Hirofumi TANAKA, Yasuhisa KAYABA, Hiroko WACHI, Koji INOUE, Shoko ONO
  • Publication number: 20170372993
    Abstract: A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.
    Type: Application
    Filed: December 14, 2015
    Publication date: December 28, 2017
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA, Koji INOUE, Hiroko WACHI
  • Patent number: 9780008
    Abstract: A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: October 3, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki
  • Publication number: 20170162382
    Abstract: The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.
    Type: Application
    Filed: August 5, 2015
    Publication date: June 8, 2017
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Shoko ONO, Koji INOUE, Hiroko WACHI, Tsuneji SUZUKI
  • Publication number: 20160049343
    Abstract: Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition<the isoelectric point of a surface of the member A; and an application process of applying the composition to the surface of the member A and the surface of the member B included in the composite member.
    Type: Application
    Filed: March 11, 2014
    Publication date: February 18, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA, Tsuneji SUZUKI, Shigeru MIO, Kazuo KOHMURA
  • Patent number: 9169353
    Abstract: In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: October 27, 2015
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki, Shigeru Mio
  • Publication number: 20150187670
    Abstract: A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.
    Type: Application
    Filed: July 12, 2013
    Publication date: July 2, 2015
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki
  • Publication number: 20140367868
    Abstract: In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.
    Type: Application
    Filed: January 16, 2013
    Publication date: December 18, 2014
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki, Shigeru Mio