Abstract: An efficient coating machine capable of hardening coating on works in a short hardening time with a small-sized hardening oven at reduced costs. The coating machine has a painting booth, a hardening oven and a work transfer device. The work transfer device has a rotary shaft provided at a center of the coating machine, and a plurality of hangers, each holding one piece of work and being turnable about the rotary shaft. The painting booth and the hardening oven are arranged around the rotary shaft into an arc-shaped configuration, respectively. The hardening oven has an arc-shaped work passage adapted to move the works. One piece of work is coated in the painting booth and continuously transferred to the work passage of the hardening oven while being held with each of the hangers and turned about the rotary shaft. In the work passage, the work is blown with hot air fed from a hot air generating device for hardening the coating on the work.

Abstract: An efficient coating machine capable of hardening coating on works in a short hardening time with a small-sized hardening oven at reduced costs. The coating machine has a painting booth, a hardening oven and a work transfer device. The work transfer device has a rotary shaft provided at a center of the coating machine, and a plurality of hangers, each holding one piece of work and being turnable about the rotary shaft. The painting booth and the hardening oven are arranged around the rotary shaft into an arc-shaped configuration, respectively. The hardening oven has an arc-shaped work passage adapted to move the works. One piece of work is coated in the painting booth and continuously transferred to the work passage of the hardening oven while being held with each of the hangers and turned about the rotary shaft. In the work passage, the work is blown with hot air fed from a hot air generating device for hardening the coating on the work.

Abstract: An apparatus and method for heating semiconductor devices (DUTs) having a variety of package shapes. The apparatus has a plurality of trays on which DUTs are mounted. A heating chamber with a plurality of stages, house the tray. A tray moving mechanism moves the trays so as to be disposed within the heating chamber and outside of the heating chamber. The method has the steps of supplying the DUTs on a tray, heating the DUTs supplied on each tray, and relocating and measuring the DUTs.

Abstract: An apparatus for and a method of heating semiconductor devices of the invention can cope with semiconductor devices having a variety of package shapes at low cost and can restrain the apparatus from being large sized and power supply capacity from being increased. The trays and place multiple DUTs thereon. A heating chamber holds the trays and therein. A tray moving mechanism moves the trays and inside and outside the heating chamber. A hosing step and a supplying step are completed during a heating step.

Abstract: A TAB tester for recognizing image on or before testing the TAB so as to prevent erroneous detection. There are provided first, second and third image cameras. The second image camera is disposed upstream relative to a first sprocket, namely, at the front stage of measurement of a tape carrier and it takes a second image of the TAB and outputs a second image to an image processing unit. The third image camera is disposed downstream relative to a punch unit, namely, at the rear stage of the measurement of the tape carrier and it takes a third image of the TAB and outputs the third image to the image processing unit. The image processing unit converts the second and third images into second and third processed image data. The second processed image data is supplied to a control unit where it is stored as data of necessity of measurement of the TAB.