Abstract: Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste following drying and curing is within a range from 1 to 300 MPa (25° C.). The solid fraction is preferably from 40 to 90% by weight, the thixotropic index is preferably from 1.5 to 8.0, and the viscosity (25° C.) is preferably from 5 to 1,000 Pa·s. Using this resin paste, a semiconductor device is produced by a method comprising (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to effect B-staging of the resin, (3) mounting a semiconductor chip on the B-staged resin, and (4) conducting post-curing of the resin.

Abstract: A resin paste for die bonding that can be supplied and applied easily by a printing method. The resin paste for die bonding of the present invention comprises: a polyimide resin (PI), which is obtained by reacting a tetracarboxylic dianhydride (A) comprising a tetracarboxylic dianhydride represented by the formula (I) shown below: (wherein, n represents an integer from 2 to 20), with a diamine (B) comprising a siloxane-based diamine represented by the formula (II) shown below: (wherein, Q1 and Q2 each represent, independently, an alkylene group of 1 to 5 carbon atoms or a phenylene group, Q3, Q4, Q5 and Q6 each represent, independently, an alkyl group of 1 to 5 carbon atoms, a phenyl group, or a phenoxy group, and p represents an integer from 1 to 50); a filler (F); and a printing solvent (S), wherein the resin paste has been adjusted to have a solid fraction from 20 to 70% by weight, a thixotropic index from 1.5 to 8.0, and a viscosity (25° C.) from 5 to 1,000 Pa·s.

Abstract: Disclosed are a resin composition for artificial marble comprising:(I) an unsaturated polyester obtained by using a divalent alcohol containing hydrogenated hisphenol A as an essential component and an .alpha.,.beta.