Patents by Inventor Yasuhisa Saito

Yasuhisa Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4960860
    Abstract: The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represent a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: October 2, 1990
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Yasuhisa Saito, Kunimasa Kamio, Mitsuhiro Shibata, Katsuya Watanabe, Yutaka Shiomi, Youichi Ueda
  • Patent number: 4957995
    Abstract: A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiberreinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.
    Type: Grant
    Filed: September 5, 1989
    Date of Patent: September 18, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Katsuya Watanabe, Kohichi Okuno, Kunimasa Kamio, Akira Morii
  • Patent number: 4913697
    Abstract: A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said traizine compound, and an inorganic filler as essential components; and said s-triazine compound.
    Type: Grant
    Filed: December 8, 1988
    Date of Patent: April 3, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Kunimasa Kamio, Shuichi Kanagawa, Yutaka Shiomi
  • Patent number: 4900848
    Abstract: A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiber-reinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.
    Type: Grant
    Filed: March 29, 1988
    Date of Patent: February 13, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Katsuya Watanabe, Kohichi Okuno, Kunimasa Kamio, Akira Morii, Hiroshi Nakamura
  • Patent number: 4871832
    Abstract: The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.
    Type: Grant
    Filed: January 21, 1988
    Date of Patent: October 3, 1989
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Yasuhisa Saito, Shuichi Kanagawa, Katsuya Watanabe, Kunimasa Kamio
  • Patent number: 4855339
    Abstract: An epoxy resin composition comprising (A) an epoxy resin having three or more epoxy groups per a molecule and (B) a reactive oligomer having in its molecule an aromatic residue connected thereto by --O-- or --S-- linkage and having at the terminal of the molecule a phonolic hydroxyl group.
    Type: Grant
    Filed: January 19, 1989
    Date of Patent: August 8, 1989
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Hisao Takagishi, Hiroshi Nakamura, Kohichi Okuno, Yutaka Shiomi, Kunimasa Kamio
  • Patent number: 4808717
    Abstract: A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.
    Type: Grant
    Filed: May 4, 1987
    Date of Patent: February 28, 1989
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Kunimasa Kamio, Shuichi Kanagawa, Yutaka Shiomi
  • Patent number: 4794148
    Abstract: A fiber-reinforced composite material superior in mechanical strength, heat resistance and hot water resistance is provided herein. This composite material is composed of a matrix of a cured product of a resin composition containing as essential components an epoxy resin (A) and an imide compound (B) represented by the following general formula (I), ##STR1## wherein X represents --NH.sub.2 group and/or --OH group, Ar represents an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or a hydroxyl group, and each of m and n cannot be 0 at the same time, and a fiber (C) as a reinforcing material.
    Type: Grant
    Filed: January 15, 1988
    Date of Patent: December 27, 1988
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroshi Nakamura, Shigenao Hata, Kunimasa Kamio, Yasuhisa Saito
  • Patent number: 4705833
    Abstract: A thermosettable heat-resistant resin composition containing (A) an amino group-terminated imide compound produced by imidating an aromatic diamine with an aromatic tetracarboxylic anhydride at a diamine:anhydride molar ratio of from 1.2:1 to 4:1, and (B) an epoxy resin having at least two epoxy groups, the molar ratio of the amino group of the imide compound to the epoxy group of the epoxy resin being 1:1.6 to 1:2.6.
    Type: Grant
    Filed: December 24, 1985
    Date of Patent: November 10, 1987
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Hisao Takagishi, Katsuya Watanabe, Kohichi Okuno, Junichi Kenmei, Kunimasa Kamio
  • Patent number: 4663401
    Abstract: A thermosettable epoxy resin composition comprising 100 parts by weight of an epoxy resin, 5 to 40 parts by weight of polysulfone resin having both a resorcinol moiety and 4,4'-dichlorodiphenylsulfone moiety in the molecular chain, and an effective amount of a curing agent, which gives a cured product excellent in toughness as well as in curability, adhesion, mechanical strength at high temperatures and resistance to chemicals.
    Type: Grant
    Filed: May 2, 1985
    Date of Patent: May 5, 1987
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Akira Morii, Hiroshi Nakamura
  • Patent number: 4368299
    Abstract: A composition comprising an epoxy resin having at least two epoxy groups in the molecule and a hardener selected from the group consisting of (1) a resorcinol novolak having an unreacted resorcinol content of 10% by weight or less, (2) a mixed novolak of a resorcinol novolak and a monohydric phenol novolak having a total unreacted resorcinol and monohydric phenol content of 8% by weight or less, and (3) a resorcinol/monohydric phenol polycondensation novolak having a polycondensed resorcinol content of 30 mole % or more and a total unreacted resorcinol and monohydric phenol content of 8% by weight or less.The composition is useful for moldings, laminates, paints, and adhesives with excellent thermal resistance, durability and electrical characteristics.
    Type: Grant
    Filed: July 23, 1981
    Date of Patent: January 11, 1983
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Katsuyoshi Watanabe, Makoto Andoh, Yasuhisa Saito, Yasuteru Maeda, Yoshiya Fukuyama
  • Patent number: 4307223
    Abstract: A solid resinous product useful for coatings, adhesives and molding materials which is obtained by polymerizing a by-product tar produced as by-product in manufacturing resorcinol or resorcinol and hydroquinone via hydroperoxide of m-diisopropylbenzene or of a combination of m- and p-diisorpopylbenzenes and containing m-substituted phenolic constituents or a combination of m- and p-substituted phenolic constituents as major constituents.
    Type: Grant
    Filed: June 5, 1979
    Date of Patent: December 22, 1981
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Akira Shintani, Katsuo Akagane, Yasuhisa Saito, Takashi Urata, deceased
  • Patent number: 4257926
    Abstract: A method is disclosed for adhering rubber and reinforcing materials simultaneously with vulcanization, without defects such as fume and bloom phenomena of formaldehyde-acceptors, deliquescence and blocking, which is characterized in the use of a vulcanizable rubber composition containing an improved co-polycondensate resin which is prepared by condensing (A) a resol type pre-polycondensate prepared by at least one phenol and formaldehyde or acetaldehyde in the presence of an alkaline catalyst, and (B) resorcinol, m-aminophenol or the like, while distilling off water present in the reaction system, and then solidifying the reaction mixture.
    Type: Grant
    Filed: January 24, 1978
    Date of Patent: March 24, 1981
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Shozo Tanimura, Yasuhisa Saito, Hiroshi Horiuchi, Kazunori Mieno, Shinji Nakao, Takaaki Nakano, Kenzo Kamei