Patents by Inventor Yasuhisa Shimazaki

Yasuhisa Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10566047
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 18, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
  • Patent number: 10483268
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: November 19, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
  • Patent number: 10304526
    Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: May 28, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
  • Publication number: 20190147940
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Application
    Filed: January 17, 2019
    Publication date: May 16, 2019
    Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
  • Patent number: 10224095
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: March 5, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
  • Publication number: 20190006375
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Application
    Filed: September 6, 2018
    Publication date: January 3, 2019
    Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
  • Publication number: 20180350430
    Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.
    Type: Application
    Filed: August 9, 2018
    Publication date: December 6, 2018
    Inventors: Shigenobu KOMATSU, Masanao YAMAOKA, Noriaki MAEDA, Masao MORIMOTO, Yasuhisa SHIMAZAKI, Yasuyuki OKUMA, Toshiaki SANO
  • Patent number: 10096608
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 9, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
  • Patent number: 10079055
    Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: September 18, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
  • Publication number: 20180068710
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Application
    Filed: October 27, 2017
    Publication date: March 8, 2018
    Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
  • Patent number: 9830975
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: November 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
  • Publication number: 20170309327
    Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.
    Type: Application
    Filed: July 13, 2017
    Publication date: October 26, 2017
    Inventors: Shigenobu KOMATSU, Masanao YAMAOKA, Noriaki MAEDA, Masao MORIMOTO, Yasuhisa SHIMAZAKI, Yasuyuki OKUMA, Toshiaki SANO
  • Publication number: 20170271344
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Application
    Filed: June 7, 2017
    Publication date: September 21, 2017
    Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
  • Publication number: 20170236576
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 17, 2017
    Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
  • Patent number: 9734893
    Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: August 15, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
  • Patent number: 9704873
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: July 11, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
  • Patent number: 9672872
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: June 6, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
  • Publication number: 20160300597
    Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 13, 2016
    Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
  • Publication number: 20160276352
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 22, 2016
    Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
  • Patent number: 9385133
    Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: July 5, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki