Patents by Inventor Yasuhisa Shimazaki
Yasuhisa Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10566047Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: GrantFiled: January 17, 2019Date of Patent: February 18, 2020Assignee: Renesas Electronics CorporationInventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
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Patent number: 10483268Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: GrantFiled: September 6, 2018Date of Patent: November 19, 2019Assignee: Renesas Electronics CorporationInventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
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Patent number: 10304526Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.Type: GrantFiled: August 9, 2018Date of Patent: May 28, 2019Assignee: Renesas Electronics CorporationInventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
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Publication number: 20190147940Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: ApplicationFiled: January 17, 2019Publication date: May 16, 2019Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
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Patent number: 10224095Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: GrantFiled: October 27, 2017Date of Patent: March 5, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
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Publication number: 20190006375Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: ApplicationFiled: September 6, 2018Publication date: January 3, 2019Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
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Publication number: 20180350430Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.Type: ApplicationFiled: August 9, 2018Publication date: December 6, 2018Inventors: Shigenobu KOMATSU, Masanao YAMAOKA, Noriaki MAEDA, Masao MORIMOTO, Yasuhisa SHIMAZAKI, Yasuyuki OKUMA, Toshiaki SANO
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Patent number: 10096608Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: GrantFiled: June 7, 2017Date of Patent: October 9, 2018Assignee: Renesas Electronics CorporationInventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
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Patent number: 10079055Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.Type: GrantFiled: July 13, 2017Date of Patent: September 18, 2018Assignee: Renesas Electronics CorporationInventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
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Publication number: 20180068710Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: ApplicationFiled: October 27, 2017Publication date: March 8, 2018Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
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Patent number: 9830975Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: GrantFiled: May 1, 2017Date of Patent: November 28, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
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Publication number: 20170309327Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.Type: ApplicationFiled: July 13, 2017Publication date: October 26, 2017Inventors: Shigenobu KOMATSU, Masanao YAMAOKA, Noriaki MAEDA, Masao MORIMOTO, Yasuhisa SHIMAZAKI, Yasuyuki OKUMA, Toshiaki SANO
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Publication number: 20170271344Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: ApplicationFiled: June 7, 2017Publication date: September 21, 2017Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
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Publication number: 20170236576Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: ApplicationFiled: May 1, 2017Publication date: August 17, 2017Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
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Patent number: 9734893Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.Type: GrantFiled: February 22, 2016Date of Patent: August 15, 2017Assignee: Renesas Electronics CorporationInventors: Shigenobu Komatsu, Masanao Yamaoka, Noriaki Maeda, Masao Morimoto, Yasuhisa Shimazaki, Yasuyuki Okuma, Toshiaki Sano
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Patent number: 9704873Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: GrantFiled: May 26, 2016Date of Patent: July 11, 2017Assignee: Renesas Electronics CorporationInventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki
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Patent number: 9672872Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: GrantFiled: June 23, 2016Date of Patent: June 6, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kiyotada Funane, Ken Shibata, Yasuhisa Shimazaki
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Publication number: 20160300597Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.Type: ApplicationFiled: June 23, 2016Publication date: October 13, 2016Inventors: Kiyotada FUNANE, Ken SHIBATA, Yasuhisa SHIMAZAKI
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Publication number: 20160276352Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: ApplicationFiled: May 26, 2016Publication date: September 22, 2016Inventors: Masao MORIMOTO, Noriaki MAEDA, Yasuhisa SHIMAZAKI
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Patent number: 9385133Abstract: A semiconductor device having an SRAM which includes: a monolithic first active region in which a first transistor and a fifth transistor are disposed; a second active region separated from the first active region, in which a second transistor is disposed; a monolithic third active region in which a third transistor and a sixth transistor are disposed; and a fourth active region separated from the third active region, in which a fourth transistor is disposed. Each driver transistor is divided into a first transistor and a second transistor (or a third transistor and a fourth transistor) and these driver transistors are disposed over different active regions.Type: GrantFiled: October 23, 2015Date of Patent: July 5, 2016Assignee: Renesas Electronics CorporationInventors: Masao Morimoto, Noriaki Maeda, Yasuhisa Shimazaki