Patents by Inventor Yasuhisa Sugita

Yasuhisa Sugita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7598309
    Abstract: A polypropylene-based resin composition including (A) 70 to 96 mass % of a polypropylene-based soft resin having an ISO D hardness of 35 or less and containing 25 to 55 mass % of xylene-insoluble part at room temperature and 75 to 45 mass % of xylene-soluble part at room temperature, (B) 2 to 10 mass % of homopolypropylene having a melt mass flow rate (MFR) at 230° C. under a load of 2.16 kg measured in accordance with JIS K 7210 of 1 to 30 g/10 min. and stereoregularity (meso pentad fraction) of 90% or more, (C) 2 to 20 mass % of a propylene-ethylene random copolymer having an ethylene content of 1 to 10 mass %, and (D) 0 to 15 mass % of a platy inorganic filler.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: October 6, 2009
    Assignees: Idemitsu Kosan Co. Ltd, Yazaki Corporation
    Inventors: Yasuhisa Sugita, Masato Koike, Susumu Hara, Atsushi Sugiyama
  • Publication number: 20060199891
    Abstract: A polypropylene-based resin composition including (A) 70 to 96 mass % of a polypropylene-based soft resin having an ISO D hardness of 35 or less and containing 25 to 55 mass % of xylene-insoluble part at room temperature and 75 to 45 mass % of xylene-soluble part at room temperature, (B) 2 to 10 mass % of homopolypropylene having a melt mass flow rate (MFR) at 230° C. under a load of 2.16 kg measured in accordance with JIS K 7210 of 1 to 30 g/10 min. and stereoregularity (mesopentad fraction) of 90% or more, (C) 2 to 20 mass % of a propylene-ethylene random copolymer having an ethylene content of 1 to 10 mass %, and (D) 0 to 15 mass % of a platy inorganic filler.
    Type: Application
    Filed: March 1, 2006
    Publication date: September 7, 2006
    Inventors: Yasuhisa Sugita, Masato Koike, Susumu Hara, Atsushi Sugiyama
  • Patent number: 6667359
    Abstract: There are disclosed a polypropylene composition for automotive parts which has a melt index at 230° C. and at 2.16 kgf of at least 30 g/10 minutes and which comprises 55 to 60% by weight of (1) propylene/ethylene block copolymer; 20 to 25% by weight of (2) rubber comprising a styrene/ethylene/propylene/styrene block copolymer and/or a styrene/ethylene/1-butene/styrene block copolymer and an olefinic elastomer; and 18 to 23% by weight of (3) talc, and also an automotive part which comprises the above polypropylene composition.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: December 23, 2003
    Assignees: Idemitsu Petrochemical Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Masaru Nakagawa, Koki Hirano, Yutaka Obata, Yasuhisa Sugita, Takao Nomura, Masatoshi Matsuda, Hisayuki Iwai, Takayuki Nagai
  • Patent number: 6407168
    Abstract: Provided are a propylene resin composition comprising 100 parts byweight in total of two different types of propylene polymers each having specific properties, from 0 to 50 parts by weight of a specific elastomer, and from 0 to 50 parts by weight of an inorganic filler; and a method for producing it. The production method comprises melting and kneading two polymer groups each comprising one or more propylene polymers. The resin composition in which the viscosity difference between the propylene homopolymer segments to form the base polymer and the amorphous propylene segments to form the disperse phase is small is produced by first melting and kneading one polymer group, then immediately adding the other polymer group thereto, and further kneading and melting the two. For the composition in which the viscosity difference therebetween is large, the polymer groups are separately kneaded in melt, and the resulting melts are further kneaded.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: June 18, 2002
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Yasuhisa Sugita, Takashi Saeki, Hiroki Nakashima, Masaru Nakagawa, Kenichi Mitsuhashi, Yutaka Obata
  • Patent number: 6313227
    Abstract: Provided are a propylene-ethylene block copolymer having MFR of from 0.01 to 1.0 g/10 min and comprised of (A) from 85 to 97% by weight a 25° C. xylene-insoluble fraction and (B) from 3 to 15% by weight of a 25° C. xylene-soluble fraction, wherein the fraction (A) is such that its stereospecificity index measured through 13C-NMR is at least 98.0%, its intrinsic viscosity [&eegr;] falls between 2.5 and 5.5 dl/g, and its weight-average molecular weight, Mw, measured through GPC and the content, S, of the fraction having a molecular weight of at most 104.5 therein satisfy S (wt. %)≦−5.3×10−6 Mw+7.58, and the fraction (B) is such that its ethylene unit content measured through 13C-NMR falls between 30 and 70% by weight, and its intrinsic viscosity [&eegr;] falls between 2.5 and 9.0 dl/g; and its blow-molded articles.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: November 6, 2001
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Kenji Tanaka, Yasuhisa Sugita, Masaru Nakagawa, Tetsuya Nakamura
  • Patent number: 5552480
    Abstract: There is disclosed a thermoplastic resin composition comprising as principal components a [A] thermoplastic resin having a functional group reactive with an amino group, a [B] olefinic polymer and/or styrenic polymer, the subtotal of the above [A]+[B] being 100 parts by weight, and 0.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: September 3, 1996
    Assignees: Idemitsu Petrochemical Co., Ltd., Dai-ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Yasuhisa Sugita, Naoki Kitazawa, Hiroshi Hotta
  • Patent number: 5373065
    Abstract: A process for producing a novel formamide group-containing copolymer, or a salt thereof, which can be used as a high-molecular weight amino reagent, a starting material for functional high-molecular weight compounds, a starting material for adhesives, a polymer compatibilizer, a resin modifier, etc.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: December 13, 1994
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Naoki Kitazawa, Hiroshi Hotta, Yasuhisa Sugita, Katsutoshi Ohta