Abstract: Mounting components such as LSIs, which emit noise to the outside and are subjected to the influence of external noise, on the top-most layer and the bottom-most layer respectively, a co-existing layer of the ground region and the power source region has been employed, where a ground region has been provided respectively to the range corresponding to the position the LSIs on the next layer below the top-most layer and the next layer above the bottom-most layer. Accordingly, the number of layers to be laminated to form the multilayer substrate has been reduced, because it is no longer required, unlike the related art, to provide a ground layer where the ground pattern is formed substantially over the entire surface of layer respectively to the next layer below the top-most layer having mounted a LSI thereon and of the next layer above the bottom-most layer having mounting a LSI thereon.

Abstract: Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semiconductor component on the substrate, the mounting the heatsink on the substrate, and the fixing the heatsink to the semiconductor component can be implemented through a single soldering operation. Thus, the step of attaching the heatsink can be simplified. Since the solder is present in a clearance between the first and second bonding parts, the efficiency of heat dissipation can be enhanced.

Abstract: Mounting components such as LSIs, which emit noise to the outside and are subjected to the influence of external noise, on the top-most layer and the bottom-most layer respectively, a co-existing layer of the ground region and the power source region has been employed, where a ground region has been provided respectively to the range corresponding to the position the LSIs on the next layer below the top-most layer and the next layer above the bottom-most layer. Accordingly, the number of layers to be laminated to form the multilayer substrate has been reduced, because it is no longer required, unlike the related art, to provide a ground layer where the ground pattern is formed substantially over the entire surface of layer respectively to the next layer below the top-most layer having mounted a LSI thereon and of the next layer above the bottom-most layer having mounting a LSI thereon.

Abstract: Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semiconductor component on the substrate, the mounting the heatsink on the substrate, and the fixing the heatsink to the semiconductor component can be implemented through a single soldering operation. Thus, the step of attaching the heatsink can be simplified. Since the solder is present in a clearance between the first and second bonding parts, the efficiency of heat dissipation can be enhanced.