Abstract: A memory chip unit includes a pad electrode including first and second portions, and a memory cell array. A prober includes a probe card and a movement mechanism. The probe card includes a probe electrode to be in contact with the pad electrode, and a memory controller electrically coupled to the probe electrode and executes reading and writing on the memory cell array. The movement mechanism executes a first operation that brings the probe electrode into contact with the first portion and does not bring the probe electrode into contact with the second portion, and a second operation that does not bring the probe electrode into contact with the first portion and brings the probe electrode into contact with the second portion.

Abstract: In a spread spectrum communication using a long spreading code, a spread spectrum signal processing apparatus is provided, which is suitable for performing communication by using a correlator having a size mountable on a portable equipment. The spread spectrum signal processing apparatus has a correlator for correlating between a spread spectrum signal and a given reference signal, an A/D converter for converting a correlation signal into a digital signal, a memory for storing the digital signal from the AD converter as digital data, a signal processor for summing digital data corresponding to each of divided codes C1–C16 and for outputting a result of summation, and a control unit for controlling to apply each of the divided codes C1–C16 in this order repeatedly as a reference signal to the correlator. The signal processor begins a summing process by making reference to a timing signal from the control unit.

Abstract: In a spread spectrum communication using a long spreading code, a spread spectrum signal processing apparatus is provided, which is suitable for performing communication by using a correlator having a size mountable on a portable equipment.

Abstract: A surface acoustic wave functional element is provided that includes a piezoelectric substrate or a multilayer piezoelectric substrate having a large electromechanical coupling coefficient. Semiconductor layers are formed on the piezoelectric substrate. The semiconductor layers include an active layer and a buffer layer. The buffer layer is formed of a structure that has a lattice constant that is the same as or similar to that of the active layer. In addition, input and output electrodes are formed on both sides of the semiconductor layers. The surface acoustic wave functional element attains a large amplification gain at low voltage, and can be used as part of a transmitting/receiving circuit in a high frequency portion of a mobile communication device.

Abstract: A surface acoustic wave functional element is provided that includes a piezoelectric substrate or a multilayer piezoelectric substrate having a large electromechanical coupling coefficient. Semiconductor layers are formed on the piezoelectric substrate. The semiconductor layers include an active layer and a buffer layer. The buffer layer is formed of a structure that has a lattice constant that is the same as or similar to that of the active layer. In addition, input and output electrodes are formed on both sides of the semiconductor layers. The surface acoustic wave functional clement attains a large amplification gain at low voltage, and can be used as part of a transmitting/receiving circuit in a high frequency portion of a mobile communication device.