Patents by Inventor Yasuhito Kumabuchi
Yasuhito Kumabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090159924Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: ApplicationFiled: February 24, 2009Publication date: June 25, 2009Applicant: Panasonic CorporationInventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Patent number: 7368766Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: GrantFiled: July 15, 2004Date of Patent: May 6, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Publication number: 20070228395Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: ApplicationFiled: June 7, 2007Publication date: October 4, 2007Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Patent number: 6861672Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: GrantFiled: November 6, 2001Date of Patent: March 1, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Publication number: 20050003571Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: ApplicationFiled: July 15, 2004Publication date: January 6, 2005Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Patent number: 6674100Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.Type: GrantFiled: April 5, 2002Date of Patent: January 6, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Minoru Kubo, Katsuya Nozawa, Masakatsu Suzuki, Takeshi Uenoyama, Yasuhito Kumabuchi
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Publication number: 20020105015Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.Type: ApplicationFiled: April 5, 2002Publication date: August 8, 2002Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Minoru Kubo, Katsuya Nozawa, Masakatsu Suzuki, Takeshi Uenoyama, Yasuhito Kumabuchi
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Patent number: 6399970Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.Type: GrantFiled: September 16, 1997Date of Patent: June 4, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Minoru Kubo, Katsuya Nozawa, Masakatsu Suzuki, Takeshi Uenoyama, Yasuhito Kumabuchi
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Publication number: 20020054616Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: ApplicationFiled: November 6, 2001Publication date: May 9, 2002Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Publication number: 20020011617Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.Type: ApplicationFiled: September 16, 1997Publication date: January 31, 2002Inventors: MINORU KUBO, KATSUYA NOZAWA, MASAKATSU SUZUKI, TAKESHI UENOYAMA, YASUHITO KUMABUCHI
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Patent number: 6326638Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: GrantFiled: May 15, 1998Date of Patent: December 4, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi
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Patent number: 6274889Abstract: A semiconductor device having a single substrate made of silicon carbide; an epitaxial film made of AlxInyGa(1−x−y)N which is selectively formed on the single substrate; an amplifier section including a gate formed on the single substrate and a source layer and a drain layer which are formed within the single substrate; and another amplifier section formed on the epitaxial film.Type: GrantFiled: September 21, 1999Date of Patent: August 14, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yorito Ota, Hiroyuki Masato, Yasuhito Kumabuchi, Makoto Kitabatake
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Patent number: 6266354Abstract: A semiconductor laser device, including a substrate; a ridge stripe formed on the substrate and including an active layer, an n-cladding layer and p-cladding layer, the n-cladding layer and the p-cladding layer interposing the active layer; in which the ridge stripe has a laser unit which lases. In one embodiment the ridge stripe has a tip portion having a tapered shape, and an angle formed inside the ridge stripe by a bottom surface of the ridge stripe and a side surface of the ridge stripe is in the range of about 60° and about 90°. In one embodiment, the laser device includes a misoriented substrate and the ridge stripe has current blocking layers formed on both sides thereof.Type: GrantFiled: July 27, 2000Date of Patent: July 24, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toyoji Chino, Yasuhito Kumabuchi, Isao Kidoguchi, Hideto Adachi
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Patent number: 6190975Abstract: Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.Type: GrantFiled: December 9, 1998Date of Patent: February 20, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Minoru Kubo, Katsuya Nozawa, Masakatsu Suzuki, Takeshi Uenoyama, Yasuhito Kumabuchi
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Patent number: 6151348Abstract: A semiconductor laser includes at least an active layer and a saturable absorbing layer, and a compressive strain amount in the saturable absorbing layer is set to be greater than a value of compressive strain in the active layer by about 0.3% or more. Alternatively, a semiconductor laser includes at least an active layer, a saturable absorbing layer, and a light guiding layer disposed in the vicinity of the saturable absorbing layer; and a compressive strain amount in the saturable absorbing layer is greater than a value of compressive strain in the active layer by about 0.3% or more.Type: GrantFiled: November 17, 1998Date of Patent: November 21, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideto Adachi, Isao Kidoguchi, Yasuhito Kumabuchi
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Patent number: 6127201Abstract: An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 10.sup.10 cm.sup.-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogen. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas).gtoreq.1; and an internal pressure during etching reaction is about 1 mTorr or greater.Type: GrantFiled: March 16, 1999Date of Patent: October 3, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toyoji Chino, Yasuhito Kumabuchi, Isao Kidoguchi, Hideto Adachi
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Patent number: 6118800Abstract: In a semiconductor laser having an active layer and a cladding structure interposing the active layer, the cladding structure includes a saturable absorbing layer, and the saturable absorbing layer is formed of InGaAsP.Type: GrantFiled: December 19, 1997Date of Patent: September 12, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Isao Kidoguchi, Hideto Adachi, Yasuhito Kumabuchi
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Patent number: 6110813Abstract: A first metal film and a second metal film, both of which are made of Ni or the like, are deposited on the upper surface of a substrate made of SiC. In such a state, the interface between the first metal film and the substrate and the interface between the second metal film and the substrate both form a Schottky contact. Next, laser light is irradiated from above the upper surface of the substrate only onto the first metal film on the substrate after the diameter of the top end of the laser light has been reduced. Thus, since the metal-semiconductor interface between the first metal film and the substrate is turned into an alloy owing to the energy of the laser light without heating the entire substrate, an ohmic contact can be formed in the interface between the first metal film and the substrate. As a result, an ohmic electrode can be constituted by the first metal film.Type: GrantFiled: April 3, 1998Date of Patent: August 29, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yorito Ota, Hiroyuki Masato, Yasuhito Kumabuchi, Makoto Kitabatake
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Patent number: 5968845Abstract: An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 10.sup.10 cm.sup.-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogon. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas) .gtoreq.1; and an internal pressure during etching reaction is about 1 mTorr or greater.Type: GrantFiled: February 7, 1997Date of Patent: October 19, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toyoji Chino, Yasuhito Kumabuchi, Isao Kidoguchi, Hideto Adachi
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Patent number: 5787104Abstract: The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.Type: GrantFiled: January 19, 1996Date of Patent: July 28, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoshi Kamiyama, Masakatsu Suzuki, Takeshi Uenoyama, Kiyoshi Ohnaka, Akira Takamori, Masaya Mannoh, Isao Kidoguchi, Hideto Adachi, Akihiko Ishibashi, Toshiya Fukuhisa, Yasuhito Kumabuchi