Patents by Inventor Yasuhito Masuda

Yasuhito Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8147911
    Abstract: A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: April 3, 2012
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga, Taro Fujita, Mayo Uenoyama, Yasuhito Masuda, Yuichi Idomoto
  • Patent number: 7807066
    Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: October 5, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Mayo Uenoyama, Yasuhiro Okuda, Fumihiro Hayashi, Taro Fujita, Yasuhito Masuda, Yuichi Idomoto
  • Patent number: 7586047
    Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: September 8, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Fumihiro Hayashi, Yasuhito Masuda, Yasuhiro Okuda
  • Patent number: 7563487
    Abstract: The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: July 21, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuhito Masuda, Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga
  • Publication number: 20090152246
    Abstract: In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.
    Type: Application
    Filed: February 23, 2006
    Publication date: June 18, 2009
    Inventors: Hidehiko Mishima, Yasuhito Masuda, Yasuhiro Okuda, Kenichi Watatani, Shuji Sakabe, Masaki Hashida, Seiji Shimizu
  • Publication number: 20080044637
    Abstract: A microhole-formed stretched porous polytetrafluoroethylene material, in which a microhole having a hole diameter greater than an average pore diameter of a stretched porous polytetrafluoroethylene material is formed in the stretched porous polytetrafluoroethylene material by irradiation of a pulse laser beam having a pulse length of at most 10 picoseconds, and the microporous structure of the wall surface of the microhole is substantially retained without being destroyed, a production process thereof, and an abrasion working process.
    Type: Application
    Filed: January 20, 2005
    Publication date: February 21, 2008
    Inventors: Yasuhito Masuda, Yasuhiro Okuda, Hidehiko Mishima
  • Publication number: 20080006605
    Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
    Type: Application
    Filed: July 11, 2005
    Publication date: January 10, 2008
    Inventors: Mayo Uenoyama, Yasuhiro Okuda, Fumihiro Hayashi, Taro Fujita, Yasuhito Masuda, Yuichi Idomoto
  • Publication number: 20070160810
    Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric.
    Type: Application
    Filed: January 13, 2005
    Publication date: July 12, 2007
    Inventors: Fumihiro Hayashi, Yasuhito Masuda, Yasuhiro Okuda
  • Publication number: 20060251871
    Abstract: The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
    Type: Application
    Filed: March 12, 2004
    Publication date: November 9, 2006
    Inventors: Yasuhito Masuda, Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga
  • Publication number: 20060141159
    Abstract: A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.
    Type: Application
    Filed: June 4, 2004
    Publication date: June 29, 2006
    Inventors: Yasuhiro Okuda, Fumihiro Hayashi, Tsuyoshi Haga, Taro Fujita, Mayo Uenoyama, Yasuhito Masuda, Yuichi Idomoto