Patents by Inventor Yasuhito Taki

Yasuhito Taki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-tensile copper alloy for current conduction having superior flexibility
    Patent number: 5250256
    Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The hightensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.
    Type: Grant
    Filed: April 14, 1992
    Date of Patent: October 5, 1993
    Assignee: Yazaki Corporation
    Inventors: Yasusuke Ohashi, Tamotsu Nishijima, Toshihiro Fujino, Yasuhito Taki
  • High-tensile copper alloy for current conduction having superior flexibility
    Patent number: 5124124
    Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The high-tensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: June 23, 1992
    Assignee: Yazaki Corporation
    Inventors: Yasusuke Ohashi, Tamotsu Nishijima, Toshihiro Fujino, Yasuhito Taki
  • Aged copper alloy with iron and phosphorous
    Patent number: 5071494
    Abstract: An aged copper alloy comprising:0.15-1.0 wt % Fe,0.05-0.3 wt % P, and0.05-0.3 wt % Mg and 0.05-0.3 wt % Pbwith the balance being essentially composed of Cu.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: December 10, 1991
    Assignee: Yazaki Corporation
    Inventors: Yasusuke Ohashi, Toshihiro Fujino, Yasuhito Taki, Tamotsu Nishijima
  • Copper alloy with phosphorus and iron
    Patent number: 5024815
    Abstract: A copper alloy comprising:(A) 0.15-1.0 wt % Fe,(B) 0.05-0.3 wt % P, and(C)(1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or(2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or(3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or(4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si,with the balance being essentially composed of Cu.
    Type: Grant
    Filed: May 24, 1989
    Date of Patent: June 18, 1991
    Assignee: Yazaki Corporation
    Inventors: Yasusuke Ohashi, Toshihiro Fujino, Yasuhito Taki, Tamotsu Nishijima