Patents by Inventor Yasuhito Uetsuki

Yasuhito Uetsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060154526
    Abstract: A printed circuit board is adjacently mounted on a part of a chassis substantially in parallel with each other and the chassis serves as an all-overlaying GND pattern layer. Furthermore, by placing an insulator between the printed circuit board and the chassis, the stray capacitance around signal lines D+ and D? is stabilized in a proper range. Thus, a differential impedance between the USB signal lines D+ and D? is made in compliance with standard concerned. As a result, in an electronic device equipped with an interface in conformity to the USB 2.0 standard, the differential impedance can be made in compliance with the standard in spite of using an inexpensive two-layered board.
    Type: Application
    Filed: January 4, 2006
    Publication date: July 13, 2006
    Applicant: Funai Electric Co., Ltd.
    Inventor: Yasuhito Uetsuki