Patents by Inventor Yasuisa TAKINISHI

Yasuisa TAKINISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131758
    Abstract: An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 25, 2024
    Inventors: Yasuisa TAKINISHI, Chuzo TANIGUCHI, Eiji KAWASHIMA, Hajime NAKAGAWA, Takenori YOSHIDA
  • Publication number: 20240031713
    Abstract: A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.
    Type: Application
    Filed: November 9, 2021
    Publication date: January 25, 2024
    Applicant: NISSHA CO.,LTD.
    Inventors: Chuzo TANIGUCHI, Jun SASAKI, Eiji KAWASHIMA, Yasuisa TAKINISHI
  • Patent number: 11877386
    Abstract: An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: January 16, 2024
    Assignee: NISSHA CO., LTD.
    Inventor: Yasuisa Takinishi
  • Publication number: 20230171878
    Abstract: An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.
    Type: Application
    Filed: January 16, 2023
    Publication date: June 1, 2023
    Applicant: NISSHA CO., LTD.
    Inventor: Yasuisa Takinishi
  • Patent number: 11324114
    Abstract: To provide a cylindrical printed board in which a processing shape is maintained, and a printed-board-integrated molded article in which the cylindrical printed board is integrated with an inner wall of a hole portion in a molded article. A cylindrical printed board 1 according to the present invention is a printed board 4 including an insulator substrate 2 and a conductor pattern 3 formed on the insulator substrate 2, wherein the printed board 4 is rolled beyond one full circle to form a cylindrical shape. In addition, a printed-board-integrated molded article 40 includes a molded article 20 constituting a casing that has a cylindrical part, and the cylindrical printed board 4 that is integrated with an inner wall 21a of a hole portion 21 in the cylindrical part of the molded article 20.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: May 3, 2022
    Assignee: NISSHA CO., LTD.
    Inventors: Chuzo Taniguchi, Yasuhide Fukada, Eiji Kawashima, Yasuisa Takinishi, Takeshi Nishimura, Tomohiro Yamaoka, Yuki Naito, Yuu Kuwataka, Koji Asai, Takenori Yoshida
  • Publication number: 20220053635
    Abstract: To provide a cylindrical printed board in which a processing shape is maintained, and a printed-board-integrated molded article in which the cylindrical printed board is integrated with an inner wall of a hole portion in a molded article. A cylindrical printed board 1 according to the present invention is a printed board 4 including an insulator substrate 2 and a conductor pattern 3 formed on the insulator substrate 2, wherein the printed board 4 is rolled beyond one full circle to form a cylindrical shape. In addition, a printed-board-integrated molded article 40 includes a molded article 20 constituting a casing that has a cylindrical part, and the cylindrical printed board 4 that is integrated with an inner wall 21a of a hole portion 21 in the cylindrical part of the molded article 20.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Applicant: NISSHA CO.,LTD.
    Inventors: Chuzo TANIGUCHI, Yasuhide FUKADA, Eiji KAWASHIMA, Yasuisa TAKINISHI, Takeshi NISHIMURA, Tomohiro YAMAOKA, Yuki NAITO, Yuu KUWATAKA, Koji ASAI, Takenori YOSHIDA
  • Patent number: 10383234
    Abstract: A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: August 13, 2019
    Assignee: NISSHA CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Iga, Yasuisa Takinishi
  • Publication number: 20180228032
    Abstract: [Object] To provide a molding with an integrated electrode pattern in which a band-shaped second film including an electric connecting portion to be connected to an external substrate can be securely fixed to an inner surface of a resin molded body, and to provide a method for manufacturing the molding with an integrated electrode pattern. [Solution] A molding with an integrated electrode pattern includes a resin molded body; a first film 11 that is formed on an inner surface of the resin molded body and that includes an electrode pattern 13 and a first lead-out wire 63 electrically connected to the electrode pattern; and a second film 4 that is band-shaped, that stands on the inner surface of the resin molded body, and that includes a second lead-out wire 15 electrically connected to the first lead-out wire.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 9, 2018
    Applicant: NISSAHA CO., LTD.
    Inventors: Seiichi YAMAZAKI, Toshihiro IGA, Yasuisa TAKINISHI
  • Patent number: 9814232
    Abstract: An insect control sheet containing a Cry polyhedron prepared by fixing an insecticidal protein (a Cry toxin) produced by Bacillus thuringiensis to a polyhedron of polyhedrin protein is provided. The insect control sheet contains the Cry polyhedron and is used by floating on water. The insect control sheet is floatable on water, and includes a pure matrix layer 20 and a toxin-containing matrix layer 30 containing the Cry polyhedron 51 which are layered on the underside of a sheet-shaped first sheet substrate 10. The pure matrix layer 20 is composed of a degradable or water-soluble second material and the toxin-containing matrix layer 30 is composed of a degradable or water-soluble third material and the Cry polyhedron. The toxin-containing matrix layer sustainably releases the Cry polyhedron to the water on which the insect control sheet is floated.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: November 14, 2017
    Assignees: NISSHA PRINTING CO., LTD., NATIONAL UNIVERSITY CORPORATION KYOTO INSTITUTE OF TECHNOLOCY
    Inventors: Tetsuya Nakayama, Yasuisa Takinishi, Yoshihide Inako, Hajime Mori, Tomoko Hirano, Yoshihiro Harada
  • Publication number: 20160249609
    Abstract: An insect control sheet containing a Cry polyhedron prepared by fixing an insecticidal protein (a Cry toxin) produced by Bacillus thuringiensis to a polyhedron of polyhedrin protein is provided. The insect control sheet contains the Cry polyhedron and is used by floating on water. The insect control sheet is floatable on water, and includes a pure matrix layer 20 and a toxin-containing matrix layer 30 containing the Cry polyhedron 51 which are layered on the underside of a sheet-shaped first sheet substrate 10. The pure matrix layer 20 is composed of a degradable or water-soluble second material and the toxin-containing matrix layer 30 is composed of a degradable or water-soluble third material and the Cry polyhedron. The toxin-containing matrix layer sustainably releases the Cry polyhedron to the water on which the insect control sheet is floated.
    Type: Application
    Filed: February 12, 2015
    Publication date: September 1, 2016
    Inventors: Tetsuya NAKAYAMA, Yasuisa TAKINISHI, Yoshihide INAKO, Hajime MORI, Tomoko HIRANO, Yoshihiro HARADA