Patents by Inventor Yasuji Kawashima
Yasuji Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11167364Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.Type: GrantFiled: August 1, 2018Date of Patent: November 9, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
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Patent number: 10894294Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.Type: GrantFiled: November 27, 2018Date of Patent: January 19, 2021Assignee: Senju Metal Industry Co., Ltd.Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
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Publication number: 20200290143Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.Type: ApplicationFiled: November 27, 2018Publication date: September 17, 2020Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
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Publication number: 20190039159Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
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Patent number: 7971627Abstract: A process and a device for easily and rapidly producing a metal sample for analysis for determining the content of impurities in a molten metal with high accuracy. More particularly, according to the metal sample production process, a metal sample for high accuracy analysis is produced by solidifying a collected molten metal without segregating impurities contained in a molten metal, by rapidly cooling a collected molten metal using a metal sample production device having a thin-walled mold having a thin sample collection space for collecting a molten metal, and an opening/closing operation part with which the mold can be freely opened/closed.Type: GrantFiled: June 30, 2006Date of Patent: July 5, 2011Assignee: Panasonic CorporationInventor: Yasuji Kawashima
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Publication number: 20100282430Abstract: A process and device for easily and rapidly producing a metal sample for analysis to he used for determining the content of impurities in a molten metal with high accuracy. The device for metal sample production comprises: a thin-walled mold having a thin sample collection space for collecting a molten metal; and an opening/closing operation part with which the mold can be freely opened/closed. This device is used to collect a molten metal and rapidly cool the molten metal to thereby solidify it without causing segregation of the impurities contained in the molten metal. Thus, a metal sample for high-accuracy analysis is produced.Type: ApplicationFiled: June 30, 2006Publication date: November 11, 2010Inventor: Yasuji Kawashima
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Patent number: 6805282Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.Type: GrantFiled: May 24, 2002Date of Patent: October 19, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
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Publication number: 20020179693Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.Type: ApplicationFiled: May 24, 2002Publication date: December 5, 2002Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
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Publication number: 20020179690Abstract: It is realized that a solder material is sufficiently supplied to a through hole formed through a board by a spraying mode flux applying method in a flow soldering process for mounting an electronic component onto the board by means of a solder material.Type: ApplicationFiled: May 24, 2002Publication date: December 5, 2002Inventors: Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima, Yukio Maeda, Mikiya Nakata
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Patent number: 6235208Abstract: A soldering apparatus includes a solder wave shape forming means for melting solder and forming a solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.Type: GrantFiled: October 10, 2000Date of Patent: May 22, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuji Kawashima, Kaoru Shimizu
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Patent number: 6214218Abstract: A soldering apparatus includes a solder wave shape forming device for melting solder and forming a solder wave shape, and a separating agent dusting device for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.Type: GrantFiled: February 22, 1999Date of Patent: April 10, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuji Kawashima, Kaoru Shimizu
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Patent number: 5690890Abstract: A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.Type: GrantFiled: November 4, 1994Date of Patent: November 25, 1997Assignees: Matsushita Electric Industrial Co., Ltd., Kabushiki Kaisha Nihon GenmaInventors: Yasuji Kawashima, Takashi Nagashima, Akihiko Matsuike, Takeshi Meguro, Kaoru Shimizu, Hideo Chaki, Toshiaki Ogura
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Patent number: 4981249Abstract: An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.Type: GrantFiled: August 30, 1989Date of Patent: January 1, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuji Kawashima, Kazuo Nishibori, Yasuhiro Morita, Sachiho Hayama