Abstract: The present invention discloses a cooling structure for electronic devices which is characterized in that a plurality of electronic device accommodating boxes in which electronic devices are accommodated are accommodated in a casing in multiple stages, a vent portion which allows ventilation between the inside and the outside of the casing is formed in a ceiling of the casing, in a first accommodating portion for accommodating the first electronic device accommodating box which is defined at the stage close to the ceiling, a hollow duct having two opening faces is arranged, the first opening face faces the vent portion and the second opening face faces a second accommodating portion for accommodating the second electronic device accommodating box which is defined at the stage remote from the ceiling, air inside the second electronic device accommodating box which is accommodated in the second accommodating portion is discharged outside the casing from the vent portion through the inside of the duct, and air i

Abstract: A disk module with a disk for recording information and a controller for controlling operation of the disk in a cabinet, is formed by providing a heat radiation member on at least one of two side faces of the cabinet. The disk array apparatus includes a plurality of disk boxes, each of which accommodates a plurality of the disk modules therein and has an inlet surface on one end side and an exhaust surface on the other end side; a rack which can accommodate the disk boxes therein in a stacking manner and of which surfaces facing the inlet surfaces of the boxes are capable of ventilation; and an exhaust fan arranged in the rack. The heat radiation member is provided on at least one of the two side faces of the cabinet for each disk module, which are parallel to the recording surface of the disk.

Abstract: Two substrates respectively mounting electric parts are disposed so that parts-mounting faces of the two substrates oppose each other. The opposed substrates are connected at the respective opposing side edges thereof to each other by means of respective cover plates. High voltage electric parts are mounted on one of the substrates, while heat/electromagnetic wave generating electric parts are mounted on the other of the substrates to obtain heat radiation and electromagnetic wave shielding.