Patents by Inventor Yasuji Yamamoto

Yasuji Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190297922
    Abstract: A microwave-heating system irradiates sealed packaged foods with microwaves to heat the packaged foods at 100° C. or higher for heat sterilization. The microwave-heating system includes a microwave generator to irradiate the packaged foods with microwaves of 2450 MHz in a multi-mode and a microwave generator to irradiate the packaged foods in a waveguide with microwaves of 915 MHz in a single-mode.
    Type: Application
    Filed: March 12, 2019
    Publication date: October 3, 2019
    Applicant: MORINAGA MILK INDUSTRY CO., LTD.
    Inventors: Yasuhiro Takeda, Atsushi Furuya, Takahiro Koyama, Hiroyuki Ikeda, Junichi Otsuji, Shuji Obi, Yasuji Yamamoto, Junichi Kodama
  • Patent number: 9847173
    Abstract: A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 ?m or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 ?m or less.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: December 19, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaaki Taniguchi, Yasuji Yamamoto, Takahiro Ishibashi
  • Publication number: 20160381802
    Abstract: A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 ?m or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 ?m or less.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 29, 2016
    Inventors: Masaaki TANIGUCHI, Yasuji YAMAMOTO, Takahiro ISHIBASHI
  • Publication number: 20100150308
    Abstract: An X-ray inspection apparatus includes an X-ray radiating part, an X-ray detecting part, a mass estimation unit and a mass class determination unit. The X-ray radiating part is configured and arranged to radiate X-rays to an inspection target. The X-ray detecting part is configured and arranged to detect the X-rays radiated from the X-ray radiating part that transmitted through the inspection target. The mass estimation unit is configured to estimate a mass of the inspection target based on an amount of the X-rays detected by the X-ray detecting part. The mass class determination unit is configured to determine which mass class among a plurality of mass classes within a preset range the inspection target belongs to based on the mass of the inspection target estimated by the mass estimation unit.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 17, 2010
    Applicant: ISHIDA CO., LTD.
    Inventors: Masao TSUNO, Kiyoshi MIYAZAKI, Shinya YAMAMOTO, Yasuji YAMAMOTO, Yasuhiro YAMAMOTO, Tetsuji MATSUMURA, Koji KATAYAMA
  • Patent number: 7470878
    Abstract: Thawing is achieved by applying high-frequency power to a frozen material (R) sandwiched between opposing electrodes. A thawing section of a thawing apparatus (10) includes unit electrodes (302) for a first electrode group as a former stage, unit electrodes (303) for a second electrode group as a latter stage, and unit electrodes (304) for a third electrode group as a further stage. The unit electrodes (302) for the first electrode group are set so that the area of the electrode surface is smaller than the area of the sandwiched surface of the frozen material (R). The unit electrodes (303) for the second top electrode group are larger than the area of the unit electrodes (302) for the first electrode group. The unit electrodes (304) for the third electrode group are larger than the area of the unit electrodes (303) for the second electrode group.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: December 30, 2008
    Assignee: Yamamoto Vinita Co., Ltd.
    Inventors: Yasuji Yamamoto, Toshihiro Imahori
  • Publication number: 20080105672
    Abstract: Thawing is achieved by applying high-frequency power to a frozen material (R) sandwiched between opposing electrodes. A thawing section of a thawing apparatus (10) includes unit electrodes (302) for a first electrode group as a former stage, unit electrodes (303) for a second electrode group as a latter stage, and unit electrodes (304) for a third electrode group as a further stage. The unit electrodes (302) for the first electrode group are set so that the area of the electrode surface is smaller than the area of the sandwiched surface of the frozen material (R). The unit electrodes (303) for the second top electrode group are larger than the area of the unit electrodes (302) for the first electrode group. The unit electrodes (304) for the third electrode group are larger than the area of the unit electrodes (303) for the second electrode group.
    Type: Application
    Filed: August 10, 2006
    Publication date: May 8, 2008
    Applicant: YAMAMOTTO VINITA CO,. LTD.
    Inventors: Yasuji Yamamoto, Toshihiro Imahori
  • Patent number: 7010837
    Abstract: A method for manufacturing an electronic component includes the steps of forming an electrode layer including ?-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes ?-tungsten, and has a specific resistance of about 15 ??.cm or less and a warpage of about 120 ?m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including ?-tungsten.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: March 14, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Genji Inuidani, Michio Kadota
  • Publication number: 20050098926
    Abstract: Raw materials are portioned in a plurality of molds, which are continuously moved and transferred to a heating area by a conveyer. The heating area is divided into a plurality of sub-areas, each of which has power source means and power feeding means. The raw materials are heated and molded by applying high frequency to the molds from the power feeding means. Even if the heating apparatus is large, it is possible to restrain or prevent concentration of high-frequency energy since the heating area is divided into sub-areas.
    Type: Application
    Filed: May 7, 2002
    Publication date: May 12, 2005
    Inventors: Tomoya Tamura, Naoyuki Okuda, Yoshiyuki Otani, Tsutomu Kosaka, Yasuo Shinomiya, Toshitaka Haruta, Taizo Karasawa, Yoshio Akesaka, Masato Yanagitani, Tsuneo Nagata, Yasuji Yamamoto
  • Patent number: 6810566
    Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: November 2, 2004
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Patent number: 6789297
    Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: September 14, 2004
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Publication number: 20030231082
    Abstract: A method for manufacturing an electronic component includes the steps of forming an electrode layer including &agr;-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes &agr;-tungsten, and has a specific resistance of about 15 &mgr;&OHgr;.cm or less and a warpage of about 120 &mgr;m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including &agr;-tungsten.
    Type: Application
    Filed: April 9, 2003
    Publication date: December 18, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Genji Inuidani, Michio Kadota
  • Patent number: 6625855
    Abstract: A method for producing a surface acoustic wave device, includes the steps of preparing a piezoelectric substrate, forming a thin film electrode on the piezoelectric substrate, etching the thin film electrode for forming an IDT, trimming at least one of the piezoelectric substrate and the IDT to adjust an operation frequency of the surface acoustic wave device, and rapidly altering the surface of the IDT for stabilizing the surface of the IDT.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Patent number: 6564439
    Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: May 20, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Publication number: 20020062542
    Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 30, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Publication number: 20020059709
    Abstract: A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 23, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Patent number: 6359273
    Abstract: A method of preheating a polymer plate by dielectric heating by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes; a method of producing a laminate, comprising dielectric heating a polymer plate by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes in a state where the laminate is housed in an annular container encompassing the surfaces of the laminates, and pressing the laminate in the direction of its lamination at least after completion of the application of the radio frequency voltage; and an apparatus for producing the laminate.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 19, 2002
    Assignee: Nitta Corporation
    Inventors: Kiyoshi Ogawa, Takahiko Yoshida, Michiaki Inui, Mikiya Shimizu, Yasuji Yamamoto, Yuichi Sugizaki, Tsuneo Nagata
  • Patent number: 6323473
    Abstract: A prepackaged food sterilizing apparatus for sterilizing a prepackaged food P has a high frequency generator 71. A high frequency is supplied from the high frequency generator 71 to the prepackaged food P to sterilize the prepackaged food P by dielectric heating. The apparatus includes a food loading container 2x constituted by a pair of opposing electrodes 20 consisting of a lower electrode 210 and an upper electrode 220 to which the high frequency is supplied and an annular insulator 23 interposed between the opposing electrode pair 20. The food loading container 2x has at least one food loading chamber 21 in which the prepackaged food P is loaded with an inner shape thereof substantially equal to an outer shape of the prepackaged food P.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: November 27, 2001
    Assignee: Yamamoto Vinita Co., Ltd.
    Inventors: Yasuji Yamamoto, Yoshio Akesaka, Junichi Kodama
  • Patent number: 6247395
    Abstract: An object of a high-frequency thawing apparatus is to uniformly thaw an entirety of an article with high efficiency and high-speed, particularly an article having a relatively large thickness. The apparatus is so constructed that a high-frequency power from a high-frequency generating circuit is supplied to a pair of opposing electrodes by way of an impedance matching circuit including a transformer to thaw an article (F) which is carried in between the opposing electrode pair by dielectric heating. The impedance matching circuit includes an electrostatic capacitor section (C) and an inductance section (L). A conductor each constituting the inductance section (L) has such a length that the downstream-located conductor with respect to the transport direction of a conveyor is longer than the upstream-located conductor.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: June 19, 2001
    Assignee: Yamamoto Vinita Co., Ltd.
    Inventor: Yasuji Yamamoto
  • Patent number: 6023055
    Abstract: A heating apparatus for heating a prepackaged food, is provided with a heater which heats a prepackaged food, an enclosure which defines an airtight chamber operable to accommodate the prepackaged food, and a pressure controller which controls the inside pressure of the airtight chamber. The heater includes a pair of electrodes which are arranged face to face, and an electric power source which supplies a high frequency electric power. The inside pressure of the airtight chamber is controlled in response to an expansion of the prepackaged food being heated to prevent the packaging container from breaking out.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: February 8, 2000
    Assignee: Yamamoto Vinita Co., Ltd.
    Inventor: Yasuji Yamamoto
  • Patent number: 5304308
    Abstract: In an intermittent aeration activated sludge process in which aeration and agitation is repeated alternately, a first aeration tank and a second aeration tank are connected to each other and an ORP meter is applied to each tank. In the first aeration tank, the sum of an aeration period and a denitrification period of an agitation step is controlled to a predetermined period T.sub.gs based on a time when a bending point appeared on an ORP curve in a previous cycle. In the second aeration tank, the sum of an aeration period and an agitation period is controlled to a predetermined period T.sub.ds longer than T.sub.gs based on a time when an ORP measured value reached a predetermined value in a previous cycle. Operations of the first and second aeration tanks are simultaneously transferred from the agitation to the aeration based on detection of the predetermined ORP value. As a result, a necessary anaerobic condition period is secured in the first aeration tank.
    Type: Grant
    Filed: April 27, 1993
    Date of Patent: April 19, 1994
    Assignees: Fuji Electric Co., Ltd., Unitika Ltd.
    Inventors: Kazushi Tsumura, Yasuji Yamamoto, Kosei Sasaki, Shigeru Hatsumata