Patents by Inventor Yasukazu Nishi

Yasukazu Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8042722
    Abstract: A conductive ball arraying apparatus includes an arraying jig having ball insertion parts at a predetermined array pattern, a ball cup that has an opening part on a lower surface thereof and is capable of housing a plurality of conductive balls, moving means that moves the arraying jig and the ball cup relatively and moves the ball cup relatively along an upper surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig. The apparatus includes means for detecting a quantity of the conductive balls in the ball cup and detects as to whether the quantity of the conductive balls in the ball cup reaches at least one of an upper limit and a lower limit and/or means for detecting leakage of the conductive balls from a clearance between the ball cup and the arraying jig.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: October 25, 2011
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventors: Tatsuya Sakano, Yasukazu Nishi, Kazuo Niizuma
  • Publication number: 20070251722
    Abstract: A conductive ball arraying apparatus includes an arraying jig having ball insertion parts at a predetermined array pattern, a ball cup that has an opening part on a lower surface thereof and is capable of housing a plurality of conductive balls, moving means that moves the arraying jig and the ball cup relatively and moves the ball cup relatively along an upper surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig. The apparatus includes means for detecting a quantity of the conductive balls in the ball cup and detects as to whether the quantity of the conductive balls in the ball cup reaches at least one of an upper limit and a lower limit and/or means for detecting leakage of the conductive balls from a clearance between the ball cup and the arraying jig.
    Type: Application
    Filed: April 27, 2007
    Publication date: November 1, 2007
    Inventors: Tatsuya Sakano, Yasukazu Nishi, Kazuo Niizuma
  • Patent number: 7024344
    Abstract: Method for calculating a deformation of a physical body under a load by forming virtual first to n-th material agents and boundary agents. A predetermined load is transmitted from the virtual first material agent to the virtual second to n-th material agents and to the boundary agents based on a material property and a strain characteristic of the physical body along a load direction and orthogonal to the load direction.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: April 4, 2006
    Assignee: Nihon University
    Inventor: Yasukazu Nishi