Patents by Inventor Yasukazu Shikano
Yasukazu Shikano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10927232Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.Type: GrantFiled: January 26, 2016Date of Patent: February 23, 2021Assignee: ASAHI KASEI KABUSHIKI KAISHAInventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
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Patent number: 10781307Abstract: A polyoxymethylene resin molded article comprising 100 parts by mass of a polyoxymethylene resin (A) and 0.1 to 5 parts by mass of a sliding agent (B), wherein four or more dispersion domains of the sliding agent (B) are present in a region of 1000 nm in depth from a surface of the molded article and 12000 nm in width, and the dispersion domain has an average minor diameter of 300 nm or less, and an average major diameter of 600 nm or more and 5000 nm or less.Type: GrantFiled: July 16, 2018Date of Patent: September 22, 2020Assignee: ASAHI KASEI KABUSHIKI KAISHAInventors: Junichi Tsuzuki, Yasukazu Shikano
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Publication number: 20200207975Abstract: Provided is a resin composition that is excellent in balance between tenacity and rigidity, suppresses variation in physical properties, and is further excellent in moldability. The disclosure provides a resin composition at least comprising 100 parts by mass of polyacetal resin (A), 0.01 to 1 part by mass of fatty acid metal salt (B), and 0.1 to 3 parts by mass of zinc oxide (C), wherein a total content of the polyacetal resin (A), the fatty acid metal salt (B), and the zinc oxide (C) is 98.0% by mass or more.Type: ApplicationFiled: December 20, 2019Publication date: July 2, 2020Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Shunichiro I, Yasukazu Shikano
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Patent number: 10479853Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.Type: GrantFiled: March 5, 2013Date of Patent: November 19, 2019Assignee: ASAHI KASEI CHEMICALS CORPORATIONInventors: Aya Takagiwa, Teruaki Sakuma, Yasukazu Shikano, Kazuya Noda
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Publication number: 20190062546Abstract: A polyoxymethylene resin molded article comprising 100 parts by mass of a polyoxymethylene resin (A) and 0.1 to 5 parts by mass of a sliding agent (B), wherein four or more dispersion domains of the sliding agent (B) are present in a region of 1000 nm in depth from a surface of the molded article and 12000 nm in width, and the dispersion domain has an average minor diameter of 300 nm or less, and an average major diameter of 600 nm or more and 5000 nm or less.Type: ApplicationFiled: July 16, 2018Publication date: February 28, 2019Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Junichi TSUZUKI, Yasukazu SHIKANO
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Patent number: 10113054Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.Type: GrantFiled: January 13, 2016Date of Patent: October 30, 2018Assignee: ASAHI KASEI KABUSHIKI KAISHAInventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
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Publication number: 20180265695Abstract: A polyacetal resin composition has very excellent durability, which includes 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B), wherein when a polyacetal resin molded article (C) made of the polyacetal resin composition is washed with a mixed solvent of hexafluoroisopropanol and chloroform in 1/1 (volume ratio), the remaining residue (D) has an ignition loss of 0.2% by weight or more.Type: ApplicationFiled: September 20, 2016Publication date: September 20, 2018Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Yosuke TAKAHASHI, Yasukazu SHIKANO, Takaaki MIYOSHI, Kouji SATOU
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Patent number: 9902843Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).Type: GrantFiled: September 24, 2014Date of Patent: February 27, 2018Assignee: ASAHI KASEI CHEMICALS CORPORATIONInventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
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Publication number: 20180030236Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.Type: ApplicationFiled: January 26, 2016Publication date: February 1, 2018Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
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Publication number: 20170114185Abstract: The polyamide resin composition of the present invention comprises a polyamide resin, (B) 0.5 to 400 mmol of a phosphorus compound in terms of a phosphorus element concentration, and (C) 0.5 to 400 mmol of a metal element, per kg of the polyamide resin, wherein the content of an apatite-based compound is 0.3 parts by mass or smaller based on 100 parts by mass of the polyamide resin, and the viscosity number [VN] of the polyamide resin is 160 mL/g or higher.Type: ApplicationFiled: April 9, 2015Publication date: April 27, 2017Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Masashi OKAMOTO, Yasukazu SHIKANO
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Publication number: 20170009050Abstract: The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an aluminic acid metal salt, and (C) an organic acid, wherein the content of the aluminic acid metal salt (B) is larger than 0.6 parts by mass based on 100 parts by mass of the polyamide resin (A).Type: ApplicationFiled: February 19, 2015Publication date: January 12, 2017Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
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Publication number: 20160222196Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).Type: ApplicationFiled: September 24, 2014Publication date: August 4, 2016Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
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Publication number: 20160215109Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.Type: ApplicationFiled: January 13, 2016Publication date: July 28, 2016Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
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Patent number: 9115247Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: GrantFiled: June 19, 2013Date of Patent: August 25, 2015Assignee: ASAHI KASEI CHEMICALS CORPORATIONInventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
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Patent number: 9023975Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.Type: GrantFiled: September 7, 2010Date of Patent: May 5, 2015Assignee: Asahi Kasei Chemicals CorporationInventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
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Publication number: 20150018490Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.Type: ApplicationFiled: March 5, 2013Publication date: January 15, 2015Inventors: Aya Takagiwa, Teruaki Sakuma, Yasukazu Shikano, Kazuya Noda
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Patent number: 8933167Abstract: A polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05?(x)?0.5 and a range of blocking ratio (Y) is ?0.3?(Y)?0.8. Also provided are compositions comprising 30 to 95% by mass of the above polyamide and 5 to 70% by mass of an inorganic filler.Type: GrantFiled: June 10, 2011Date of Patent: January 13, 2015Assignee: Asahi Kasei Chemicals CorporationInventors: Yukiyoshi Sasaki, Hiroshi Oyamada, Yasukazu Shikano
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Publication number: 20130281655Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: ApplicationFiled: June 19, 2013Publication date: October 24, 2013Inventors: Yasukazu SHIKANO, Teruaki SAKUMA, Hiroki MATSUI, Masaaki ARAMAKI, Yu NITTO, Shinji IEDA
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Patent number: 8487024Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: GrantFiled: March 11, 2009Date of Patent: July 16, 2013Assignee: Asahi Kasei Chemicals CorporationInventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
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Publication number: 20130085229Abstract: [Problem to be Solved] A main object of the present invention is to provide a polyamide and a polyamide composition capable of rendering good surface appearance stability and outstanding impact resistance properties to a molded article even when molded under rigorous molding conditions. [Solution] The present invention is (A) a polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05?(x)?0.5 and a range of blocking ratio (Y) is ?0.3?(Y)?0.8. Also, the polyamide composition of the present invention contains 30 to 95% by mass of the above polyamide and 5 to 70% by mass of (B) an inorganic filler.Type: ApplicationFiled: June 10, 2011Publication date: April 4, 2013Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Yukiyoshi Sasaki, Hiroshi Oyamada, Yasukazu Shikano