Patents by Inventor Yasukazu Shikano

Yasukazu Shikano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927232
    Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: February 23, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Patent number: 10781307
    Abstract: A polyoxymethylene resin molded article comprising 100 parts by mass of a polyoxymethylene resin (A) and 0.1 to 5 parts by mass of a sliding agent (B), wherein four or more dispersion domains of the sliding agent (B) are present in a region of 1000 nm in depth from a surface of the molded article and 12000 nm in width, and the dispersion domain has an average minor diameter of 300 nm or less, and an average major diameter of 600 nm or more and 5000 nm or less.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 22, 2020
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Junichi Tsuzuki, Yasukazu Shikano
  • Publication number: 20200207975
    Abstract: Provided is a resin composition that is excellent in balance between tenacity and rigidity, suppresses variation in physical properties, and is further excellent in moldability. The disclosure provides a resin composition at least comprising 100 parts by mass of polyacetal resin (A), 0.01 to 1 part by mass of fatty acid metal salt (B), and 0.1 to 3 parts by mass of zinc oxide (C), wherein a total content of the polyacetal resin (A), the fatty acid metal salt (B), and the zinc oxide (C) is 98.0% by mass or more.
    Type: Application
    Filed: December 20, 2019
    Publication date: July 2, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Shunichiro I, Yasukazu Shikano
  • Patent number: 10479853
    Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 19, 2019
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Aya Takagiwa, Teruaki Sakuma, Yasukazu Shikano, Kazuya Noda
  • Publication number: 20190062546
    Abstract: A polyoxymethylene resin molded article comprising 100 parts by mass of a polyoxymethylene resin (A) and 0.1 to 5 parts by mass of a sliding agent (B), wherein four or more dispersion domains of the sliding agent (B) are present in a region of 1000 nm in depth from a surface of the molded article and 12000 nm in width, and the dispersion domain has an average minor diameter of 300 nm or less, and an average major diameter of 600 nm or more and 5000 nm or less.
    Type: Application
    Filed: July 16, 2018
    Publication date: February 28, 2019
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Junichi TSUZUKI, Yasukazu SHIKANO
  • Patent number: 10113054
    Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: October 30, 2018
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Publication number: 20180265695
    Abstract: A polyacetal resin composition has very excellent durability, which includes 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B), wherein when a polyacetal resin molded article (C) made of the polyacetal resin composition is washed with a mixed solvent of hexafluoroisopropanol and chloroform in 1/1 (volume ratio), the remaining residue (D) has an ignition loss of 0.2% by weight or more.
    Type: Application
    Filed: September 20, 2016
    Publication date: September 20, 2018
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Yosuke TAKAHASHI, Yasukazu SHIKANO, Takaaki MIYOSHI, Kouji SATOU
  • Patent number: 9902843
    Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: February 27, 2018
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Publication number: 20180030236
    Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.
    Type: Application
    Filed: January 26, 2016
    Publication date: February 1, 2018
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20170114185
    Abstract: The polyamide resin composition of the present invention comprises a polyamide resin, (B) 0.5 to 400 mmol of a phosphorus compound in terms of a phosphorus element concentration, and (C) 0.5 to 400 mmol of a metal element, per kg of the polyamide resin, wherein the content of an apatite-based compound is 0.3 parts by mass or smaller based on 100 parts by mass of the polyamide resin, and the viscosity number [VN] of the polyamide resin is 160 mL/g or higher.
    Type: Application
    Filed: April 9, 2015
    Publication date: April 27, 2017
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Masashi OKAMOTO, Yasukazu SHIKANO
  • Publication number: 20170009050
    Abstract: The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an aluminic acid metal salt, and (C) an organic acid, wherein the content of the aluminic acid metal salt (B) is larger than 0.6 parts by mass based on 100 parts by mass of the polyamide resin (A).
    Type: Application
    Filed: February 19, 2015
    Publication date: January 12, 2017
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20160222196
    Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).
    Type: Application
    Filed: September 24, 2014
    Publication date: August 4, 2016
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20160215109
    Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 28, 2016
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Patent number: 9115247
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: August 25, 2015
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
  • Patent number: 9023975
    Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: May 5, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
  • Publication number: 20150018490
    Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.
    Type: Application
    Filed: March 5, 2013
    Publication date: January 15, 2015
    Inventors: Aya Takagiwa, Teruaki Sakuma, Yasukazu Shikano, Kazuya Noda
  • Patent number: 8933167
    Abstract: A polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05?(x)?0.5 and a range of blocking ratio (Y) is ?0.3?(Y)?0.8. Also provided are compositions comprising 30 to 95% by mass of the above polyamide and 5 to 70% by mass of an inorganic filler.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 13, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yukiyoshi Sasaki, Hiroshi Oyamada, Yasukazu Shikano
  • Publication number: 20130281655
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Application
    Filed: June 19, 2013
    Publication date: October 24, 2013
    Inventors: Yasukazu SHIKANO, Teruaki SAKUMA, Hiroki MATSUI, Masaaki ARAMAKI, Yu NITTO, Shinji IEDA
  • Patent number: 8487024
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: July 16, 2013
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
  • Publication number: 20130085229
    Abstract: [Problem to be Solved] A main object of the present invention is to provide a polyamide and a polyamide composition capable of rendering good surface appearance stability and outstanding impact resistance properties to a molded article even when molded under rigorous molding conditions. [Solution] The present invention is (A) a polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05?(x)?0.5 and a range of blocking ratio (Y) is ?0.3?(Y)?0.8. Also, the polyamide composition of the present invention contains 30 to 95% by mass of the above polyamide and 5 to 70% by mass of (B) an inorganic filler.
    Type: Application
    Filed: June 10, 2011
    Publication date: April 4, 2013
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yukiyoshi Sasaki, Hiroshi Oyamada, Yasukazu Shikano