Patents by Inventor Yasukazu Yamamoto

Yasukazu Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 9018775
    Abstract: A semiconductor device includes: a substrate; first and second pads disposed adjacent to each other on the substrate; an electrically conductive tape adhered to the first and second pads and having a through hole at an inner portion of the first pad; an electrically conductive adhesive in the through hole and having a thermal conductivity higher than the thermal conductivity of the electrically conductive tape; a semiconductor chip mounted on the first pad via the electrically conductive adhesive; and an electronic component part mounted on the second pad via the electrically conductive tape.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: April 28, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasukazu Yamamoto, Katsumi Miyawaki
  • SEMICONDUCTOR DEVICE
    Publication number: 20150008596
    Abstract: A semiconductor device includes: a substrate; first and second pads disposed adjacent to each other on the substrate; an electrically conductive tape adhered to the first and second pads and having a through hole at an inner portion of the first pad; an electrically conductive adhesive in the through hole and having a thermal conductivity higher than the thermal conductivity of the electrically conductive tape; a semiconductor chip mounted on the first pad via the electrically conductive adhesive; and an electronic component part mounted on the second pad via the electrically conductive tape.
    Type: Application
    Filed: March 24, 2014
    Publication date: January 8, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasukazu Yamamoto, Katsumi Miyawaki