Patents by Inventor Yasuko TABUCHI

Yasuko TABUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20110224333
    Abstract: The present invention relates to a resin composition for electronic component encapsulation including: A: a cyanate ester resin; B: at least one selected from the group consisting of a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler.
    Type: Application
    Filed: March 10, 2011
    Publication date: September 15, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuya KITAGAWA, Yasuko TABUCHI
  • EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20100308477
    Abstract: The present invention relates to an epoxy resin composition for semiconductor encapsulation, which includes the following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R1 and R2 each independently represent an alkyl group or an alkylol group, in which at least one of R1 and R2 represents an alkylol group, and R3 represents an alkyl group or an aryl group, (D) a linear saturated carboxylic acid having a number average molecular weight of 550 to 800, and (E) an inorganic filler.
    Type: Application
    Filed: June 3, 2010
    Publication date: December 9, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinya AKIZUKI, Tsuyoshi ISHIZAKA, Yasuko TABUCHI, Tomoaki ICHIKAWA