Patents by Inventor Yasuko Tachibana

Yasuko Tachibana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, METHOD FOR PRODUCING RESIN, METHOD FOR PRODUCING RESIN FILM, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
    Publication number: 20180362763
    Abstract: A resin composition includes an (a) resin having a structure represented by Chemical Formula (1); and a (b) solvent. The resin composition also includes an amount of a compound represented by Chemical Formula (3) which is 0.1 ppm by mass or more and 40 ppm by mass or less.
    Type: Application
    Filed: December 8, 2016
    Publication date: December 20, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Daichi Miyazaki, Junji Wakita, Takashi Tokuda, Yasuko Tachibana, Koji Ueoka, Tomoki Ashibe
  • PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20120181709
    Abstract: Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.
    Type: Application
    Filed: October 15, 2010
    Publication date: July 19, 2012
    Inventors: Akira Shimada, Yasuko Tachibana, Hiroyuki Niwa, Toshihisa Nonaka